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    • 45. 发明授权
    • Bonded member manufacturing apparatus and method of manufacturing bonded member
    • 粘结部件制造装置及其制造方法
    • US09375905B2
    • 2016-06-28
    • US13631837
    • 2012-09-28
    • ORIGIN ELECTRIC COMPANY. LIMITED
    • Hideyuki KokajiKoji Yamaguchi
    • B32B37/00B32B37/02
    • B29C65/48B29L2009/00B32B37/0046B32B37/02B32B2310/0831B32B2457/202Y10T156/1798
    • To prevent misalignment between substrates and distortion of surface, and to keep film thickness uniformity of thin substrate when two substrates are bonded for bonded member, bonded member manufacturing apparatus of bonding first substrate and second substrate, comprising resin film forming means for forming liquid state resin film on the first substrate, semi-curing means for maintaining outer peripheral section of resin film in uncured state and curing inner section surrounded with outer peripheral section in semi-cured state, and substrate bonding means for bonding first substrate and second substrate by bringing second substrate into contact with resin film, such that one end of outer peripheral section is determined as starting point of contact so that boundary line between contact portion and noncontact portion moves in one direction from starting point to opposite end of outer peripheral section while applying pressing force to second substrate.
    • 为了防止基板之间的偏移和表面的变形,并且为了使两个基板接合用于接合部件时保持薄基板的膜厚均匀性,第一基板和第二基板的接合部件制造装置包括用于形成液态树脂的树脂膜形成装置 第一基板上的膜,用于将树脂膜的外周部保持为未固化状态的半固化装置以及在半固化状态下被外周部包围的固化内部部分的基板接合装置,以及通过使第二基板通过第二基板 衬底与树脂膜接触,使得外周部分的一端被确定为接触起点,使得接触部分和非接触部分之间的边界线沿着外周部分的起始点到相对端部在一个方向上移动,同时施加压力 到第二衬底。