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41. 发明申请

US20140102775A1 NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE 审中-公开
公开(公告)号：US20140102775A1
公开(公告)日：2014-04-17
申请号：US14134046
申请日：2013-12-19
申请人： Taiwan Green Point Enterprises Co., Ltd.
发明人： Sheng-Hung Yi , Pen-Yi Liao
IPC分类号： H05K3/02
CPC分类号： H05K3/188 , C25D5/02 , C25D5/10 , H05K3/027 , H05K3/185 , H05K3/24 , H05K2203/107 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.

42. 发明申请

US20140014401A1 CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：电路装置及其制造方法
公开(公告)号：US20140014401A1
公开(公告)日：2014-01-16
申请号：US13547454
申请日：2012-07-12
申请人： Pen-Yi LIAO , Ming-Chun WU , I-Lin TSENG , Tsung-Han WU , Jung-Chi LIN
发明人： Pen-Yi LIAO , Ming-Chun WU , I-Lin TSENG , Tsung-Han WU , Jung-Chi LIN
IPC分类号： H05K1/09 , H05K3/00
CPC分类号： H05K3/184 , H05K3/107 , H05K2201/0376 , H05K2203/0713 , H05K2203/107
摘要： A circuit device includes: a substrate having an insulative upper surface; a hydrophobic anti-plating layer of a hydrophobic material formed on the upper surface of the substrate and having at least one patterned through-hole for exposing a plating portion of the upper surface of the substrate; an active metal layer formed on the plating portion of the upper surface of the substrate and disposed in the patterned through-hole in the hydrophobic anti-plating layer; and an electroless deposited metal layer electroless deposited on the active metal layer.
摘要翻译：电路装置包括：具有绝缘上表面的基板; 疏水性材料的疏水性防镀层形成在所述基板的上表面上并且具有至少一个图案化的通孔，用于暴露所述基板的上表面的镀层部分; 形成在所述基板的上表面的电镀部上并设置在所述疏水性防镀层的所述图案化通孔中的活性金属层; 以及沉积在活性金属层上的无电沉积金属层。

43. 发明申请

US20110111176A1 SHELL BODY WITH A PLASTIC MEMBER MOLDED ONTO A GLASS PANEL, AND METHOD FOR MANUFACTURING THE SHELL BODY 审中-公开
标题翻译：具有模制在玻璃面板上的塑料构件的壳体以及制造壳体的方法
公开(公告)号：US20110111176A1
公开(公告)日：2011-05-12
申请号：US12938036
申请日：2010-11-02
申请人： Shao-Chen CHIU , Shang-Ming LIN , Wei-Chuan CHUANG , Chia-Hsiu HO
发明人： Shao-Chen CHIU , Shang-Ming LIN , Wei-Chuan CHUANG , Chia-Hsiu HO
IPC分类号： B32B3/02 , B29C47/02 , B44C1/22
CPC分类号： B32B3/02 , B29C45/14434 , B32B3/06 , B32B17/00 , Y10T428/24488
摘要： A method for manufacturing a shell body includes the steps of: a) processing a glass substrate to form a glass panel having a top surface, a bottom surface, and a peripheral face extending between the top and bottom surfaces, the peripheral face being formed with a coupling portion, the coupling portion being one of a protrusion protruding from the peripheral face and a recess indented from the peripheral face; and b) molding a plastic member onto the glass panel, the plastic member being coupled fittingly to the coupling portion of the glass panel. A shell body with a plastic member molded onto a glass panel is also disclosed.
摘要翻译：一种制造壳体的方法包括以下步骤：a）处理玻璃基板以形成玻璃面板，该玻璃基板具有在顶表面和底表面之间延伸的顶表面，底表面和周面，外周面形成有联接部，所述联接部是从所述周面突出的突起和从所述周面凹陷的凹部之一; 以及b）将塑料构件模制到所述玻璃面板上，所述塑料构件适配地联接到所述玻璃面板的所述联接部分。还公开了一种具有模制在玻璃面板上的塑料构件的壳体。

44. 发明申请

US20060274553A1 Lamp having a planar light-emitting source 有权
标题翻译：具有平面发光源的灯
公开(公告)号：US20060274553A1
公开(公告)日：2006-12-07
申请号：US11144835
申请日：2005-06-06
申请人： Shao Chiu , Chi Cheng , Ray Tsai , Hui Hu , Ming Lai
发明人： Shao Chiu , Chi Cheng , Ray Tsai , Hui Hu , Ming Lai
IPC分类号： F21V7/04
CPC分类号： G02B6/0055 , G02B6/0036 , G02B6/0068
摘要： A lamp having a planar light-emitting source includes a light-guiding structure, a light-emitting portion, and a shading supporting seat. The point-shaped lighting units of the light-emitting portion emit the point-shaped light beams toward the side plane of the light-guiding structure. Then, these beams enter the light-guiding structure. After turning approximately 90 degrees, a uniformly distributed planar light generated from the light-emitting plane of the light-guiding structure. So, a planar light source is obtained. In this invention, it has a planar light-emitting function with better lighting efficiency. The planar lighting is evenly distributed without shadow. Its energy consumption and heat generation are low. The product's life is prolonged. Its volume is small and it is portable.
摘要翻译：具有平面发光源的灯包括导光结构，发光部分和遮光支撑座。发光部的点状照明单元朝向导光结构的侧面发射点状光束。然后，这些梁进入导光结构。转动大约90度后，从导光结构的发光平面产生均匀分布的平面光。因此，获得平面光源。在本发明中，它具有更好的照明效率的平面发光功能。平面照明均匀分布，无阴影。其能源消耗和发热量低。产品的使用寿命延长。体积小，便于携带。

45. 发明授权

US11167284B2 Substrate assembly and method of bonding substrates 有权
公开(公告)号：US11167284B2
公开(公告)日：2021-11-09
申请号：US16172116
申请日：2018-10-26
申请人： TAIWAN GREEN POINT ENTERPRISES CO., LTD.
发明人： Sung-Yi Yang , Pao-Chuan Wang
IPC分类号： B01L3/00 , B81B7/00 , B81C3/00 , B32B3/30 , B32B3/26 , B32B27/08 , B32B7/12
摘要： A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

46. 发明授权

US11134574B2 Double-sided circuit board and method for preparing the same 有权
公开(公告)号：US11134574B2
公开(公告)日：2021-09-28
申请号：US16154822
申请日：2018-10-09
申请人： TAIWAN GREEN POINT ENTERPRISES CO., LTD.
发明人： I-Lin Tseng , Tzu-Chun Chen
IPC分类号： H05K3/46 , H05K3/00 , H05K3/18 , H05K3/38 , H05K3/42 , H05K1/02 , H05K1/11 , H05K3/10 , B23K26/384 , H05K3/02
摘要： A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.

47. 发明授权

US10889694B2 Method and composition for preparing polyamide powders 有权
公开(公告)号：US10889694B2
公开(公告)日：2021-01-12
申请号：US16458770
申请日：2019-07-01
申请人： Taiwan Green Point Enterprises Co., Ltd.
发明人： Chia-Hung Yang , Yu-Pao Huang , Hsing-Fu Yeh , Yao-Tang Ke , Feng-Lin Chen , Yung-Chih Chen , Yi-Chung Su
IPC分类号： C08J3/14 , C08J3/11 , C08J3/09 , C08K3/36 , C08K3/22 , C08J3/215
摘要： A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.≤Tm−T2≤33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent.

48. 发明申请

US20200153118A1 CONFORMAL ARRAY ANTENNA 审中-公开
公开(公告)号：US20200153118A1
公开(公告)日：2020-05-14
申请号：US16742327
申请日：2020-01-14
申请人： Taiwan Green Point Enterprises Co., Ltd.
发明人： Sheng-Hung Yi , Pen-Yi Liao , Tsung-Han Wu , Po-Cheng Huang
IPC分类号： H01Q21/20 , H01Q9/42 , H01Q21/00 , H01Q1/38 , H01Q1/52 , H01Q1/12
摘要： A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.

49. 发明授权

US10446731B2 Light emitting device 有权
公开(公告)号：US10446731B2
公开(公告)日：2019-10-15
申请号：US16182381
申请日：2018-11-06
申请人： TAIWAN GREEN POINT ENTERPRISES CO. LTD.
发明人： Pen-Yi Liao , Chia-Tai Chen , Wen-Chia Tsai , Jing-Yi Yang , Ai-Ling Lin
IPC分类号： H01L33/64 , H01L33/62 , H01L21/48
摘要： A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.

50. 发明授权

US09976709B2 Method for making an LED lighting fixture 有权
公开(公告)号：US09976709B2
公开(公告)日：2018-05-22
申请号：US15150914
申请日：2016-05-10
申请人： Taiwan Green Point Enterprises Co., Ltd.
发明人： Sheng-Hung Yi , I-Lin Tseng , Po-Cheng Huang , Hui-Ju Yang
IPC分类号： H05K3/30 , F21K9/90 , F21K9/232 , F21Y107/50 , F21Y107/30 , F21Y107/80
CPC分类号： F21K9/90 , F21K9/232 , F21Y2107/30 , F21Y2107/50 , F21Y2107/80 , Y10T29/4913
摘要： A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.

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