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    • 43. 发明授权
    • Predictive error correction code generation facilitating high-speed byte-write in a semiconductor memory
    • 在半导体存储器中促进高速字节写入的预测性纠错码产生
    • US07392456B2
    • 2008-06-24
    • US10997604
    • 2004-11-23
    • Wingyu LeungKit Sang Tam
    • Wingyu LeungKit Sang Tam
    • G11C29/00
    • G11C7/1006G06F11/1056G11C11/4078
    • Write check bits are generated in a predictive manner for partial-word write transactions in a memory system implementing error code correction. A read data word and associated read check bits are read from an address of the memory. If an error exists in a byte of the read data word, this byte is identified. At the same time, one or more bytes of the uncorrected read data word are merged with one or more bytes of a write data word, thereby creating a merged data word. Write check bits are generated in response to the merged data word. If the merged data word includes a byte of the read data word, which contains an error, the write check bits are modified to reflect this error. The merged data word and the modified (or unmodified) write check bits are then written to the address of the memory.
    • 以实现错误代码校正的存储器系统中的部分字写入事务的预测方式生成写校验位。 从存储器的地址读取读取数据字和相关联的读取校验位。 如果读取数据字的一个字节存在错误,则识别该字节。 同时,未校正的读取数据字的一个或多个字节与写入数据字的一个或多个字节合并,从而创建合并的数据字。 响应于合并的数据字生成写校验位。 如果合并的数据字包含包含错误的读取数据字的字节,则修改校验位以反映该错误。 合并的数据字和修改的(或未修改的)写入校验位然后被写入存储器的地址。
    • 44. 发明授权
    • Non-volatile memory in CMOS logic process and method of operation thereof
    • CMOS逻辑过程中的非易失性存储器及其操作方法
    • US07391647B2
    • 2008-06-24
    • US11279382
    • 2006-04-11
    • Gang-feng FangDennis SinitskyWingyu Leung
    • Gang-feng FangDennis SinitskyWingyu Leung
    • G11C16/04
    • G11C16/0408G11C16/0416G11C16/10G11C2216/10H01L27/11519H01L27/11521H01L27/11558H01L29/42324H01L29/7883
    • A non-volatile memory (NVM) cell fabricated on a semiconductor substrate, and including a floating gate electrode (which extends at least partially over all active regions of the NVM cell). The NVM cell also includes a PMOS access transistor located in a first n-type region, a PMOS control capacitor located in a second n-type region (separate from the first n-type region), and an NMOS programming transistor located in a p-type region. The floating gate electrode is a continuous electrode which extends over the active regions of the PMOS access transistor, the PMOS control capacitor and the NMOS programming transistor. Various array connections are provided for implementing arrays using this NVM cell. The PMOS access transistor and NMOS programming transistor can be replaced with an NMOS access transistor and a PMOS erase transistor, respectively, in an alternate embodiment.
    • 制造在半导体衬底上的非易失性存储器(NVM)单元,并且包括浮置栅极电极(至少部分地延伸到NVM单元的所有有源区域上)。 NVM单元还包括位于第一n型区域中的PMOS访问晶体管,位于第二n型区域(与第一n型区域分离)的PMOS控制电容器,以及位于p型区域中的NMOS编程晶体管 型区域。 浮置栅电极是在PMOS存取晶体管,PMOS控制电容器和NMOS编程晶体管的有源区域上延伸的连续电极。 提供了各种阵列连接来实现使用该NVM单元的阵列。 在替代实施例中,PMOS存取晶体管和NMOS编程晶体管可以分别被NMOS存取晶体管和PMOS擦除晶体管代替。
    • 45. 发明授权
    • Non-volatile memory embedded in a conventional logic process and methods for operating same
    • 嵌入在常规逻辑过程中的非易失性存储器及其操作方法
    • US07382658B2
    • 2008-06-03
    • US11421986
    • 2006-06-02
    • Gang-feng FangWingyu Leung
    • Gang-feng FangWingyu Leung
    • G11C11/34G11C11/24
    • H01L27/115G11C16/0416G11C16/10G11C16/3477G11C2216/10H01L27/11519H01L27/11521H01L27/11558
    • A non-volatile memory system including an array of cells, each having an access transistor and a capacitor sharing a floating gate. The access transistors in each row are fabricated in separate well regions, which are independently biased. Within each row, the source of each access transistor is coupled to a corresponding virtual ground line, and each capacitor structure is coupled to a corresponding word line. Alternately, the source of each access transistor in a column is coupled to a corresponding virtual ground line. Within each column, the drain of each access transistor is coupled to a corresponding bit line. Select memory cells in each row are programmed by band-to-band tunneling. Bit line biasing prevents programming of non-selected cells of the row. Programming is prevented in non-selected rows by controlling the well region voltages of these rows. Sector erase operations are implemented by Fowler-Nordheim tunneling.
    • 一种包括单元阵列的非易失性存储器系统,每个单元具有存取晶体管和共享浮置栅极的电容器。 每行中的存取晶体管被制造在独立的偏置区域中。 在每行内,每个存取晶体管的源极耦合到对应的虚拟接地线,并且每个电容器结构耦合到对应的字线。 或者,列中的每个存取晶体管的源极耦合到相应的虚拟接地线。 在每列中,每个存取晶体管的漏极耦合到相应的位线。 选择每行的存储单元通过带对带隧道进行编程。 位线偏置可防止对该行的非选定单元进行编程。 通过控制这些行的阱区电压,在未选择的行中防止编程。 扇区擦除操作由Fowler-Nordheim隧道实现。
    • 46. 发明授权
    • Fabrication process for increased capacitance in an embedded DRAM memory
    • 嵌入式DRAM存储器中增加电容的制造工艺
    • US07323379B2
    • 2008-01-29
    • US11050988
    • 2005-02-03
    • Dennis SinitskyFu-Chieh Hsu
    • Dennis SinitskyFu-Chieh Hsu
    • H01L21/8238
    • H01L29/66181H01L27/10829H01L27/1087H01L27/10894H01L27/11
    • An embedded memory system includes an array of dynamic random access memory (DRAM) cells, which are isolated with deep trench isolation, and logic transistors, which are isolated with shallow trench isolation. Each DRAM cell includes an access transistor and a capacitor structure. The capacitor structure is fabricated by forming a metal-dielectric-semiconductor (MOS) capacitor in a deep trench isolation region. A cavity is formed in the deep trench isolation, thereby exposing a sidewall region of the substrate. The sidewall region is doped, thereby forming one electrode of the cell capacitor. A gate dielectric layer is formed over the exposed sidewall, and a polysilicon layer is deposited over the resulting structure, thereby filling the cavity. The polysilicon layer is patterned to form the gate electrode of the access transistor and a capacitor electrode, which extends over the sidewall region and upper surface of the substrate.
    • 嵌入式存储器系统包括与深沟槽隔离隔离的动态随机存取存储器(DRAM)单元阵列和与浅沟槽隔离隔离的逻辑晶体管。 每个DRAM单元包括存取晶体管和电容器结构。 通过在深沟槽隔离区域中形成金属 - 电介质半导体(MOS)电容器来制造电容器结构。 在深沟槽隔离中形成空腔,从而暴露衬底的侧壁区域。 侧壁区域被掺杂,从而形成单元电容器的一个电极。 在暴露的侧壁上形成栅介电层,并且在所得结构上沉积多晶硅层,从而填充空腔。 图案化多晶硅层以形成存取晶体管的栅电极和在衬底的侧壁区域和上表面上延伸的电容器电极。