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41. 发明申请

US20110199764A1 DEVICE AND METHOD FOR CONTROLLING AN ANGULAR COVERAGE OF A LIGHT BEAM 审中-公开
标题翻译：用于控制光束的角度覆盖的装置和方法
公开(公告)号：US20110199764A1
公开(公告)日：2011-08-18
申请号：US12064363
申请日：2006-08-16
申请人： Diana Shapirov
发明人： Diana Shapirov
IPC分类号： F21V5/00 , F21S8/00
CPC分类号： G01N21/8806 , G01N21/9501 , G01N21/95684 , G01N2021/8825 , G01N2021/95676
摘要： A system and method for controlling an angular coverage of a light beam. The method includes: defining a non-uniform angular coverage of a first light beam; altering a first spatial relationship between a first movable transmissive deflector and a first light source in response to the definition; directing a first light beam from the first light source through the first movable transmissive deflector such as to provide a first deflected light beam; and focusing the first deflected beam, by a first optical focusing element, to provide a first focused light bean that is focused onto a first area that is characterized by a location that is substantially indifferent to changes in the first spatial relationship.
摘要翻译：一种用于控制光束的角度覆盖的系统和方法。该方法包括：定义第一光束的不均匀的角度覆盖; 响应于该定义改变第一可移动透射偏转器和第一光源之间的第一空间关系; 将来自第一光源的第一光束引导通过第一可移动透射偏转器，以便提供第一偏转光束; 并且通过第一光学聚焦元件聚焦第一偏转光束，以提供聚焦到第一区域上的第一聚焦光束，该第一区域的特征在于基本上与第一空间关系中的变化无关的位置。

42. 发明申请

US20110154764A1 COMPOSITE STRUCTURE FOR EXTERIOR INSULATION APPLICATIONS 审中-公开
标题翻译：外部绝缘应用的复合结构
公开(公告)号：US20110154764A1
公开(公告)日：2011-06-30
申请号：US13060409
申请日：2008-09-22
申请人： XiaoMing Simon Wang , Hari Parvatareddy , WuLong Hunter Xu , Jing Jeffery Li
发明人： XiaoMing Simon Wang , Hari Parvatareddy , WuLong Hunter Xu , Jing Jeffery Li
IPC分类号： E04C2/20 , B32B27/06
CPC分类号： E04C2/288 , C04B28/02 , C04B2111/00612 , E04B1/762 , Y10T428/31616 , Y10T428/31797 , Y10T428/3188 , C04B14/06 , C04B14/10 , C04B24/2623 , C04B24/383 , C04B41/483
摘要： A composite structure comprising an extruded polystyrene layer, a mortar layer and a primer layer, wherein at least one surface of the extruded polystyrene layer is planed, and the mortar layer is made from a mortar composition comprising re-dispersible powder, cellulose ether, one or more viscosity modification agents, one or more hydraulic binders, and one or more aggregates. A method of making such a composite structure.
摘要翻译：一种复合结构，其包括挤出的聚苯乙烯层，砂浆层和底漆层，其中挤出的聚苯乙烯层的至少一个表面是平面的，并且砂浆层由包含可再分散粉末，纤维素醚，一个或更多的粘度改性剂，一种或多种水硬性粘合剂和一种或多种聚集体。制造这种复合结构的方法。

43. 发明授权

US07922932B2 Reactive fine particles 有权
标题翻译：活性微粒
公开(公告)号：US07922932B2
公开(公告)日：2011-04-12
申请号：US12637115
申请日：2009-12-14
申请人： Izhar Halahmi , Jacob Mozel , Ran Vilk
发明人： Izhar Halahmi , Jacob Mozel , Ran Vilk
IPC分类号： C09K3/00 , C08G59/50 , C08G59/56 , C08L63/00
CPC分类号： C08K9/00
摘要： A method for producing reactive fine particles, includes: admixing at least one latent curing agent selected from the group consisting of a urea derivative, an imidazole, a dicyaniamide (DICY), a mixture of any one or more thereof, and a precursor thereof, in a solvent to form a clear solution; spraying the clear solution onto at least one inorganic inert particle selected from the group consisting of a metal oxide, a mineral filler, a natural filler, and a mixture of any one or more thereof, the at least one inorganic inert particle having a specific surface area in the range of about 10 to about 50 m2/g; and removing the solvent to form reactive fine particles that includes a core of inert material coated by a coating layer that includes the at least one latent curing agent.
摘要翻译：一种反应性微粒的制造方法，其特征在于，含有选自脲衍生物，咪唑，二氰胺（DICY），其任何一种或多种的混合物中的至少一种潜在性固化剂及其前体，在溶剂中形成澄清溶液; 将透明溶液喷射到至少一种选自金属氧化物，矿物填料，天然填料及其任何一种或多种的混合物中的无机惰性颗粒中，所述至少一种无机惰性颗粒具有比表面积面积在约10至约50m 2 / g的范围内; 并除去溶剂以形成反应性细颗粒，其包括由包含至少一种潜在性固化剂的涂层涂覆的惰性材料芯。

44. 发明申请

US20110029121A1 METHOD AND SYSTEM FOR CONTROLLING A MANUFACTURING PROCESS 有权
标题翻译：用于控制制造工艺的方法和系统
公开(公告)号：US20110029121A1
公开(公告)日：2011-02-03
申请号：US12678148
申请日：2008-07-22
申请人： Rafi Amit
发明人： Rafi Amit
IPC分类号： G06F17/00
CPC分类号： H05K3/4679 , H05K1/0269 , H05K3/0008 , H05K3/0082 , H05K3/4644 , H05K2203/163
摘要： A method, system and computer program product for controlling a manufacturing process of an electronic circuit, the method includes: calculating at least one layer misalignment between layers of an electrical circuit that are expected to be mutually aligned; wherein the layers are manufactured by at least a direct imaging device that exposes a photo-resistive material to radiation to provide a pattern; selecting, in response to the at least one layer misalignment and in response to at least one allowable misalignment threshold, a selected response out of: manufacturing at least one additional layer of the electrical circuit; and stopping the manufacturing process of the electrical circuit; and participating in executing the selected response.
摘要翻译：一种用于控制电子电路的制造过程的方法，系统和计算机程序产品，所述方法包括：计算期望相互对准的电路层之间的至少一层层不对准; 其中所述层由至少直接成像装置制造，所述成像装置将光电材料暴露于辐射以提供图案; 响应于所述至少一个层未对准并且响应于至少一个允许的未对准阈值，选择所选择的响应：制造所述电路的至少一个附加层; 并停止电路的制造过程; 并参与执行所选择的响应。

45. 发明申请

US20100117279A1 SUPPORTING SYSTEM AND A METHOD FOR SUPPORTING AN OBJECT 审中-公开
标题翻译：支持系统和支持对象的方法
公开(公告)号：US20100117279A1
公开(公告)日：2010-05-13
申请号：US12516355
申请日：2007-11-25
申请人： Uri Vekstein , Valery Nuzni
发明人： Uri Vekstein , Valery Nuzni
IPC分类号： H01L21/683 , B25B11/00
CPC分类号： H01L21/6838 , H01L21/67748
摘要： A supporting system, the system includes a vertically movable chuck and a stationary chuck; wherein the vertically movable chuck and the stationary chuck are concentric; wherein the vertically movable chuck vertically moves between an upper position and a lower position; wherein when the vertically movable chuck is positioned at the upper position an upper surface of the vertically movable chuck is higher than an upper surface of the stationary chuck and when the vertically movable chuck is positioned at the lower position the upper surface of the vertically movable chuck is lower than the upper surface of the stationary chuck.
摘要翻译：一种支撑系统，该系统包括可垂直移动的卡盘和固定卡盘; 其中所述可垂直移动的卡盘和固定卡盘是同心的; 其中所述可垂直移动的卡盘在上部位置和下部位置之间垂直移动; 其特征在于，当所述可升降卡盘位于所述上部位置时，所述可升降卡盘的上表面高于所述固定卡盘的上表面，并且当所述可升降卡盘位于所述下部位置时，所述可升降卡盘的上表面比固定卡盘的上表面低。

46. 发明授权

US06934019B2 Confocal wafer-inspection system 有权
标题翻译：共聚焦晶片检查系统
公开(公告)号：US06934019B2
公开(公告)日：2005-08-23
申请号：US10820367
申请日：2004-04-07
申请人： Michael Geffen , Yaki Levi
发明人： Michael Geffen , Yaki Levi
IPC分类号： G01B11/02 , G01B11/06 , G01B11/24 , G01N21/95 , G02B21/00 , H01L21/60 , H01L21/66 , G01N21/88
CPC分类号： G02B21/006 , G01B11/026 , G01B11/0608 , G01B11/24 , G01B2210/50 , G01N21/9501 , G02B21/0024 , G02B21/0028
摘要： A confocal wafer inspection system including: (a) a table to carry a wafer for inspection, the table having two vertical degrees of freedom to enable XY axis movements; (b) a movement device for moving the table along the degrees of freedom; (c) a confocal height measurement system, perpendicular to the table, for measuring the range to a point on a surface of the wafer and for enabling to recognize changes in surface altitude while the wafer moves with the table; and (d) a computer operative for: (i) holding a bumps map of the wafer; (ii) controlling the movement device; (iii) moving the table so that the measuring point of the confocal height measurement system crosses each bump of the wafer; (iv) storing a height profile of each bump; (v) comparing the height profiles or checking each height profile according to predetermined criteria or both; and (vi) enabling a results output. The invention also relates to a method for confocal wafer inspection.
摘要翻译：一种共焦晶片检查系统，包括：（a）用于携带用于检查的晶片的工作台，所述工作台具有两个垂直自由度以实现XY轴运动; （b）沿着自由度移动桌子的移动装置; （c）垂直于工作台的共焦高度测量系统，用于测量晶片表面上的一个点的范围，并且使得能够在晶片与工作台移动的同时识别表面高度的变化; （d）计算机，用于：（i）保持晶片的凸起图; （ii）控制移动装置; （iii）移动台，使得共焦高度测量系统的测量点与晶片的每个凸块交叉; （iv）存储每个凸起的高度轮廓; （v）根据预定标准或两者比较高度轮廓或检查每个高度轮廓; 和（vi）实现结果输出。本发明还涉及一种用于共焦晶片检查的方法。

47. 发明公开

US20240003826A1 SEMICONDUCTOR INSPECTION TOOL SYSTEM AND METHOD FOR WAFER EDGE INSPECTION 审中-公开
公开(公告)号：US20240003826A1
公开(公告)日：2024-01-04
申请号：US18216162
申请日：2023-06-29
申请人： CAMTEK LTD
发明人： Carmel Yehuda DRILLMAN , Moshe EDRI , Menachem REGENSBURGER , Baheej BATHISH , Mordi DAHAN
IPC分类号： G01N21/95 , G01N21/88
CPC分类号： G01N21/9503 , G01N21/8806 , G01N2021/8825 , H01L22/12
摘要： A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.

48. 发明授权

US11828713B1 Semiconductor inspection tool system and method for wafer edge inspection 有权
公开(公告)号：US11828713B1
公开(公告)日：2023-11-28
申请号：US18080006
申请日：2022-12-13
申请人： CAMTEK LTD
发明人： Carmel Yehuda Drillman , Moshe Edri , Menachem Regensburger , Baheej Bathish , Mordi Dahan
IPC分类号： G01N21/95 , G01N21/88 , H01L21/66
CPC分类号： G01N21/9503 , G01N21/8806 , G01N2021/8825 , G01N2021/8841 , H01L22/12
摘要： A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.

49. 发明授权

US11300521B2 Automatic defect classification 有权
公开(公告)号：US11300521B2
公开(公告)日：2022-04-12
申请号：US16619941
申请日：2018-06-14
申请人： Camtek Ltd.
发明人： Menachem Regensburger , Daniel Buzaglo
IPC分类号： G01N21/88 , G01N21/95 , G06T7/00
摘要： A method for automatic defect classification, the method may include (i) acquiring, by a first camera, at least one first image of at least one area of an object; (ii) processing the at least one first image to detect a group of suspected defects within the at least one area; (iii) performing a first classification process for initially classifying the group of suspected defects; (iii) determining whether a first subgroup of the suspected defects requires additional information from a second camera for a completion of a classification; (iv) when determining that the first subgroup of the suspected defects requires additional information from the second camera then: (a) acquiring second images, by the second camera, of the first subgroup of the suspected defects; and (b) performing a second classification process for classifying the first subgroup of suspected defects.

50. 发明申请

US20210334946A1 METHOD AND SYSTEM FOR CLASSIFYING DEFECTS IN WAFER USING WAFER-DEFECT IMAGES, BASED ON DEEP LEARNING 有权
公开(公告)号：US20210334946A1
公开(公告)日：2021-10-28
申请号：US16932717
申请日：2020-07-18
申请人： CAMTEK LTD.
发明人： Isaac Daniel Buzaglo
IPC分类号： G06T7/00 , G01N21/95 , H01L21/66 , G06T7/90
摘要： The present disclosure provides method and system 100 for classifying defects in wafer using wafer defect images, based on deep learning network. Embodiments herein uses synergy between several modalities of the wafer defect images for the classification decision. Further, by adding a mixture of modalities, information may be obtained from different sources such as color image, ICI, the black and white image, to classify the defect image. In addition to mixture of modalities, a reference image may be used for each modality. The reference image of each modality image is provided to deep learning models to concentrate on the defect itself and not on the related underlying lithography of the defect image. Further, the reference image may be provided to the training process of the deep learning models that may significantly reduce the number of labelled images and the training epochs required for convergence of the deep learning model.

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