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    • 45. 发明授权
    • Socket assembly
    • 插座装配
    • US07862368B1
    • 2011-01-04
    • US12540103
    • 2009-08-12
    • Chih-Ming LaiYung-Shun Kao
    • Chih-Ming LaiYung-Shun Kao
    • H01R13/62
    • H01R13/6275H01R12/724
    • A socket assembly includes a socket, a connection terminal, and a snap-fit member. The connection terminal is plugged into the socket. The snap-fit member includes a main body, a positioning portion, and a snap-fit portion. The positioning portion and the snap-fit portion are connected to the main body. The positioning portion is locked with the socket. The main body is pivotable between a first position and a second position about the portioning portion. The snap-fit portion is snappingly engaged with the connection terminal when the snap-fit portion is in the first position. The snap-fit portion is disengaged from the connection terminal when the snap-fit portion is in the second position.
    • 插座组件包括插座,连接端子和卡扣配合构件。 连接端子插入插座。 卡扣配合构件包括主体,定位部和卡扣配合部。 定位部分和卡扣配合部分连接到主体。 定位部分与插座锁定。 主体可围绕分隔部分在第一位置和第二位置之间枢转。 当卡扣配合部分处于第一位置时,卡扣配合部分与连接端子卡扣地接合。 当卡扣配合部分处于第二位置时,卡扣配合部分从连接端子脱离。
    • 47. 发明授权
    • White light emitting device with particular light emitting structure
    • 具有特殊发光结构的白光发光装置
    • US07843133B2
    • 2010-11-30
    • US12135853
    • 2008-06-09
    • Chih-Ming Lai
    • Chih-Ming Lai
    • H01J1/62H01J63/04
    • H01L33/20H01L33/007H01L33/0079H01L33/508
    • A white light emitting device and a method for making the same are provided. The white light emitting device includes a light emitting diode (LED) chip, a fluorescent layer and a reflective layer. The LED chip includes a substrate and a light emitting structure formed on the substrate. The LED chip has a plurality of side walls. The light emitting structure includes a first-type semiconductor layer, an active layer and a second-type semiconductor layer arranged in that order along a direction away from the substrate. The substrate has through hole formed therethrough and the first-type semiconductor layer is partially exposed. The fluorescent layer is formed in the through hole for wavelength conversion. The reflective layer is formed on the side walls and surrounds the LED chip.
    • 提供白色发光器件及其制造方法。 白色发光器件包括发光二极管(LED)芯片,荧光层和反射层。 LED芯片包括形成在基板上的基板和发光结构。 LED芯片具有多个侧壁。 发光结构包括沿着离开衬底的方向依次布置的第一类型半导体层,有源层和第二类型半导体层。 基板具有通过其形成的通孔,并且第一类型半导体层部分地露出。 荧光层形成在用于波长转换的通孔中。 反射层形成在侧壁上并围绕LED芯片。
    • 50. 发明授权
    • Multi-image presentation billboard
    • 多图片展示广告牌
    • US07794108B2
    • 2010-09-14
    • US11967028
    • 2007-12-29
    • Chih-Ming Lai
    • Chih-Ming Lai
    • G03B25/02F21V11/00
    • G09F19/14
    • A billboard (10) includes a substrate (11), a lens array (12) and at least one light source (13). A plurality of pattern units are provided at a first side of the substrate. Each of the pattern units includes a plurality of pattern cells for being selectively combined to form at least one independent image. The lens array corresponding to the pattern units is arranged on one surface of the substrate at the first side thereof. The lens array includes a plurality of lenses arranged in rows and columns. The lens array is configured for displaying the at least one independent image. At least one light source is disposed facing to the other surface of the substrate configured for emitting light rays towards the substrate.
    • 广告牌(10)包括基板(11),透镜阵列(12)和至少一个光源(13)。 多个图形单元设置在基板的第一侧。 每个图案单元包括多个图案单元,用于选择性地组合以形成至少一个独立图像。 对应于图案单元的透镜阵列在其第一侧布置在基板的一个表面上。 透镜阵列包括以行和列排列的多个透镜。 透镜阵列被配置为显示至少一个独立图像。 至少一个光源被布置成面向衬底的另一个表面,被配置为朝向衬底发射光线。