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41. 发明授权

US07836981B2 Thermally stable polycrystalline diamond cutting elements and bits incorporating the same 有权
标题翻译：耐热稳定的多晶金刚石切割元件和结合其的钻头
公开(公告)号：US07836981B2
公开(公告)日：2010-11-23
申请号：US12416817
申请日：2009-04-01
申请人： Youhe Zhang , Yuelin Shen , Madapusi K. Keshavan , Michael G. Azar
发明人： Youhe Zhang , Yuelin Shen , Madapusi K. Keshavan , Michael G. Azar
IPC分类号： E21B10/573 , E21B10/46
CPC分类号： E21B10/5676 , E21B10/5735
摘要： Cutting elements are provided having substrates including end surfaces. TSP material layers extend over only a portion of the end surfaces or extend into the substrates below the end surfaces. Bits incorporating such cutting elements are also provided.
摘要翻译：提供具有包括端面的基板的切割元件。 TSP材料层仅在端表面的一部分上延伸，或延伸到端面下方的基板中。还提供了结合这种切割元件的钻头。

42. 发明申请

US20100270088A1 THERMALLY STABLE POLYCRYSTALLINE DIAMOND CUTTING ELEMENTS AND BITS INCORPORATING THE SAME 有权
标题翻译：热稳定的多晶金刚石切割元件和与其同时进入的部件
公开(公告)号：US20100270088A1
公开(公告)日：2010-10-28
申请号：US12830136
申请日：2010-07-02
申请人： Youhe Zhang , Yuelin Shen , Madapusi K. Keshavan , Michael G. Azar
发明人： Youhe Zhang , Yuelin Shen , Madapusi K. Keshavan , Michael G. Azar
IPC分类号： E21B10/46 , B24D18/00
CPC分类号： E21B10/5676 , E21B10/5735
摘要： Cutting elements are provided having substrates including end surfaces. TSP material layers extend over only a portion of the end surfaces or extend into the substrates below the end surfaces. Bits incorporating such cutting elements are also provided.
摘要翻译：提供具有包括端面的基板的切割元件。 TSP材料层仅在端表面的一部分上延伸，或延伸到端面下方的基板中。还提供了结合这种切割元件的钻头。

43. 发明申请

US20100219001A1 ROLLING CUTTER 有权
标题翻译：滚动切割机
公开(公告)号：US20100219001A1
公开(公告)日：2010-09-02
申请号：US12751663
申请日：2010-03-31
申请人： Yuelin Shen , Youhe Zhang , Zhou Yong , Jiaqing Yu , Madapusi K. Keshavan
发明人： Yuelin Shen , Youhe Zhang , Zhou Yong , Jiaqing Yu , Madapusi K. Keshavan
IPC分类号： E21B10/633 , B23P11/00
CPC分类号： E21B10/52 , E21B10/5673 , E21B10/573 , Y10T29/49947 , Y10T29/49963
摘要： A cutting element for a drill bit that includes an outer support element having at least a bottom portion and a side portion; and an inner rotatable cutting element, a portion of which is disposed in the outer support element, wherein the inner rotatable cutting element includes a substrate and a diamond cutting face having a thickness of at least 0.050 inches disposed on an upper surface of the substrate; and wherein a distance from an upper surface of the diamond cutting face to a bearing surface between the inner rotatable cutting element and the outer support element ranges from 0 to about 0.300 inches is disclosed.
摘要翻译：一种用于钻头的切割元件，其包括至少具有底部和侧部的外部支撑元件; 以及内部可旋转切割元件，其一部分设置在所述外部支撑元件中，其中所述内部可旋转切割元件包括基底和设置在所述基底的上表面上的具有至少0.050英寸的厚度的金刚石切割面; 并且其中公开了从金刚石切割面的上表面到内部可旋转切割元件和外部支撑元件之间的支承表面的距离为0至约0.300英寸。

44. 发明申请

US20100012389A1 METHODS OF FORMING POLYCRYSTALLINE DIAMOND CUTTERS 审中-公开
标题翻译：形成多晶金刚石切割机的方法
公开(公告)号：US20100012389A1
公开(公告)日：2010-01-21
申请号：US12505297
申请日：2009-07-17
申请人： Youhe Zhang , Yuelin Shen
发明人： Youhe Zhang , Yuelin Shen
IPC分类号： E21B10/573 , B24D3/10 , E21B10/55 , E21B10/567
CPC分类号： E21B10/567 , B24D99/005 , E21B10/573
摘要： A method for forming a cutting element that includes forming at least one cavity in at least one surface of a polycrystalline abrasive body; placing the polycrystalline abrasive body adjacent a substrate such that an opening of at least one cavity is adjacent the substrate at an interface, wherein an interface surface of the substrate is non-mating with the polycrystalline abrasive body; and subjecting the polycrystalline abrasive body and substrate to high pressure/high temperature conditions is disclosed.
摘要翻译：一种用于形成切割元件的方法，包括在多晶磨料体的至少一个表面中形成至少一个空腔; 将所述多晶研磨体放置在衬底附近，使得至少一个空腔的开口在界面处与所述衬底相邻，其中所述衬底的界面表面与所述多晶磨料体不配合; 并且公开了使多晶磨料体和基底经受高压/高温条件。

45. 发明授权

US07533740B2 Thermally stable polycrystalline diamond cutting elements and bits incorporating the same 有权
标题翻译：耐热稳定的多晶金刚石切割元件和结合其的钻头
公开(公告)号：US07533740B2
公开(公告)日：2009-05-19
申请号：US11350620
申请日：2006-02-08
申请人： Youhe Zhang , Yuelin Shen , Madapusi K. Keshavan , Mike Azar
发明人： Youhe Zhang , Yuelin Shen , Madapusi K. Keshavan , Mike Azar
IPC分类号： E21B10/573 , E21B10/46
CPC分类号： E21B10/5676 , E21B10/5735
摘要： Cutting elements are provided having substrates including end surfaces. TSP material layers extend over only a portion of the end surfaces or extend into the substrates below the end surfaces. Bits incorporating such cutting elements are also provided.
摘要翻译：提供具有包括端面的基板的切割元件。 TSP材料层仅在端表面的一部分上延伸，或延伸到端面下方的基板中。还提供了结合这种切割元件的钻头。

46. 发明申请

US20080006448A1 Modified Cutters 失效
标题翻译：修剪刀
公开(公告)号：US20080006448A1
公开(公告)日：2008-01-10
申请号：US11855770
申请日：2007-09-14
申请人： Youhe Zhang , Yuelin Shen
发明人： Youhe Zhang , Yuelin Shen
IPC分类号： E21B10/46 , E21B7/00
CPC分类号： E21B10/5673 , E21B10/55 , E21B10/5735
摘要： A modified cutting element that includes a base portion, an ultrahard layer disposed on said base portion, and at least one modified region disposed adjacent to a cutting face of the cutter is described. In certain applications, the ultrahard layer comprises thermally stable polycrystalline diamond.
摘要翻译：描述了一种修改的切割元件，其包括基部，设置在所述基部上的超硬层以及与切割器的切割面相邻设置的至少一个改质区域。在某些应用中，超硬层包括热稳定的多晶金刚石。

47. 发明授权

US07287610B2 Cutting elements and bits incorporating the same 有权
标题翻译：切割元素和结合其的位
公开(公告)号：US07287610B2
公开(公告)日：2007-10-30
申请号：US10954122
申请日：2004-09-29
申请人： Zan Svendsen , Yuelin Shen , Youhe Zhang
发明人： Zan Svendsen , Yuelin Shen , Youhe Zhang
IPC分类号： E21B10/36
CPC分类号： E21B10/5735 , Y10T408/909
摘要： Cutting elements and bits incorporating such cutting elements are provided. The cutting elements include a substrate having an interface surface over which is formed an ultra hard material layer. A plurality of lands are formed on the interface surface. A plurality of depressions are formed on the lands.
摘要翻译：提供了包含这种切割元件的切割元件和钻头。切割元件包括具有界面表面的基底，在其上形成超硬材料层。在界面上形成多个平台。在平台上形成多个凹陷。

48. 发明申请

US20050247492A1 Cutter having shaped working surface with varying edge chamber 有权
标题翻译：切割机具有变形边缘室的成形工作表面
公开(公告)号：US20050247492A1
公开(公告)日：2005-11-10
申请号：US11117648
申请日：2005-04-28
申请人： Yuelin Shen , Youhe Zhang , Steffen Kristiansen
发明人： Yuelin Shen , Youhe Zhang , Steffen Kristiansen
IPC分类号： E21B10/26 , E21B10/36 , E21B10/46 , E21B10/56 , E21B10/567 , E21B10/573
CPC分类号： E21B10/5673 , E21B10/5735
摘要： A cutter for a drill bit used for drilling wells in a geological formation includes an ultra hard working surface and a chamfer along an edge of the working surface, wherein the chamfer has a varied geometry along the edge. The average geometry of the chamfer varies with cutting depth. A depression in the shaped working surface is oriented with the varied chamfer and facilitates forming the varied chamfer. A non-planar interface has depressions oriented with depressions in the shaped working surface to provide support to loads on the working surface of the cutter when used.
摘要翻译：用于在地质构造中钻井的钻头的切割器包括沿着工作表面的边缘的超硬工作表面和倒角，其中所述倒角沿着所述边缘具有不同的几何形状。倒角的平均几何形状随切割深度而变化。成形工作表面中的凹陷以各种倒角定向，并且有助于形成各种倒角。非平面界面具有在成形工作表面中具有凹陷的凹陷，以在使用时为切割器的工作表面上的负载提供支撑。

49. 发明授权

US09022148B2 Diamond bonded construction comprising multi-sintered polycrystalline diamond 有权
标题翻译：金刚石粘结结构，包括多烧结多晶金刚石
公开(公告)号：US09022148B2
公开(公告)日：2015-05-05
申请号：US12903071
申请日：2010-10-12
申请人： Yuelin Shen , Youhe Zhang
发明人： Yuelin Shen , Youhe Zhang
IPC分类号： E21B10/46 , B01J3/06 , B24D99/00 , E21B10/567
CPC分类号： B01J3/062 , B01J2203/062 , B01J2203/0655 , B01J2203/0685 , B24D99/005 , E21B10/5676 , Y10T428/24996 , Y10T428/249967 , Y10T428/25 , Y10T428/30
摘要： Diamond bonded constructions comprise a diamond body attached to a substrate, wherein the body includes a first diamond bonded volume, and a second diamond bonded volume attached thereto. The second volume may be provided in the form of a powder or a presintered mass prior to attachment, and the first volume may be provided in the form of presintered pieces when combined with the second volume. The first volume diamond volume content is greater than about 94 percent, and is the same or greater than that of the second volume. The first volume is sintered during a first HPHT process, and the second volume is sintered and/or attached to the first volume during a second HPHT process. The first HPHT pressure is greater than the second HPHT pressure. The substrate is not an infiltration substrate used to form the first diamond volume. The diamond body may be thermally stable.
摘要翻译：金刚石粘合结构包括连接到基底的金刚石体，其中所述主体包括第一金刚石结合体积和与其连接的第二金刚石结合体。第二体积可以在附着之前以粉末或预烧结体的形式提供，并且当与第二体积组合时，第一体积可以以预烧结片的形式提供。第一批体积钻石体积含量大于约94％，与第二卷相同或更大。第一体积在第一HPHT过程期间被烧结，并且在第二HPHT过程期间将第二体积烧结和/或连接到第一体积。第一HPHT压力大于第二HPHT压力。基底不是用于形成第一金刚石体积的渗透底物。金刚石体可能是热稳定的。

50. 发明授权

US08925656B2 Diamond bonded construction with reattached diamond body 有权
标题翻译：金刚石粘结结构与重新附着的钻石体
公开(公告)号：US08925656B2
公开(公告)日：2015-01-06
申请号：US12903081
申请日：2010-10-12
申请人： Yuelin Shen , Youhe Zhang
发明人： Yuelin Shen , Youhe Zhang
IPC分类号： E21B10/36 , E21B10/46 , E21B10/567 , B22F7/06 , B24D99/00 , C22C26/00 , B22F5/00
CPC分类号： E21B10/567 , B22F7/06 , B22F2005/001 , B24D99/005 , C22C26/00 , E21B10/55 , E21B10/5676 , E21B10/573 , Y10T428/12042 , Y10T428/24545 , Y10T428/249957 , Y10T428/30
摘要： Diamond bonded construction comprise a diamond body attached to a support. In one embodiment, an initial substrate used to sinter the body is interposed between the body and support, and is thinned to less than 5 times the body thickness, or to less than the body thickness, prior to attachment to the support to relieve stress in the body. In another embodiment, the substrate is removed after sintering, and the body is attached to the support. The support has a material construction different from that of the initial substrate, wherein the initial substrate is selected for infiltration and the support for end use properties. The substrate and support include a hard material with a volume content that may be the same or different. Interfaces between the body, substrate, and/or support may be nonplanar. The body may be thermally stable, and may include a replacement material disposed therein.
摘要翻译：金刚石粘合结构包括连接到支撑件上的钻石主体。在一个实施例中，用于烧结身体的初始衬底介于身体和支撑体之间，并且在附着到支撑件之前被减薄到小于身体厚度的5倍或小于身体厚度以减轻应力身体。在另一个实施例中，在烧结之后移除基底，并且将主体附接到支撑件。支撑体具有与初始基底不同的材料结构，其中选择初始基底用于渗透和支持最终用途性质。基材和载体包括体积含量可以相同或不同的硬质材料。主体，基板和/或支撑件之间的接口可以是非平面的。主体可以是热稳定的，并且可以包括设置在其中的替换材料。

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