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    • 43. 发明授权
    • Semiconductor memory device having an SRAM as a cache memory integrated
on the same chip and operating method thereof
    • 具有集成在同一芯片上的作为高速缓存存储器的SRAM的半导体存储器件及其操作方法
    • US5509132A
    • 1996-04-16
    • US283487
    • 1994-08-01
    • Yoshio MatsudaKazuyasu FujishimaHideto HidakaMikio Asakura
    • Yoshio MatsudaKazuyasu FujishimaHideto HidakaMikio Asakura
    • G06F12/08G11C7/10G11C8/00G11C11/401G11C11/41
    • G06F12/0893G11C7/1051
    • A cache DRAM (100) includes a DRAM memory array (11) accessed by a row address signal and a column address signal, an SRAM memory array (21) accessed by the column address signal, and an ECC circuit (30). The DRAM memory array (11) is divided into a plurality of blocks (B1 to B64), each including a plurality of columns. The SRAM memory array (21) includes 4 ways (W1 to W4). In determining a cache hit/cache miss, a column address signal is inputted. Consequently, the SRAM memory array (21) is accessed and data are read from each of the ways. When a cache hit occurs, one way is selected in response to an externally applied way address signal, and data from that way are outputted. When a cache miss occurs, the column address signal is latched and the row address signal is applied. The DRAM array (11) is accessed in accordance with the row address signal and the latched column address signal.
    • 缓存DRAM(100)包括通过行地址信号和列地址信号访问的DRAM存储器阵列(11),由列地址信号访问的SRAM存储器阵列(21)和ECC电路(30)。 DRAM存储器阵列(11)被分成多个块(B1至B64),每个块包括多个列。 SRAM存储器阵列(21)包括4路(W1至W4)。 在确定高速缓存命中/高速缓存未命中时,输入列地址信号。 因此,访问SRAM存储器阵列(21)并且从每种方式读取数据。 当发生高速缓存命中时,响应于外部施加的方式地址信号选择一种方式,并且从该方式输出数据。 当发生高速缓存未命中时,锁存列地址信号并应用行地址信号。 根据行地址信号和锁存列地址信号来访问DRAM阵列(11)。
    • 44. 发明授权
    • Bit line structure for semiconductor memory device
    • 半导体存储器件的位线结构
    • US5416734A
    • 1995-05-16
    • US28917
    • 1993-03-08
    • Hideto HidakaKazuyasu FujishimaYoshio Matsuda
    • Hideto HidakaKazuyasu FujishimaYoshio Matsuda
    • G11C5/06G11C7/18G11C11/24
    • G11C5/063G11C7/18
    • A semiconductor memory device of folded bit line structure provided with a cross portion in at least one portion of each of bit line pairs so that values of coupling capacitance with adjacent bit line pairs are equal to each other with respect to the paired bit lines.Preferably, the respective bit line pairs are equally divided into 4N and the cross parts are provided at dividing points so that bit line pairs having the cross parts at the same dividing points are arranged on alternate pairs of bit lines.Preferably, the cross parts are provided in regions for forming restore circuits or sense amplifiers.More preferably, a dummy word line for selecting dummy cells for providing reference potential is selected by the position of a selected word line.
    • 一种折叠位线结构的半导体存储器件,其在位线对中的每一个的至少一部分中具有交叉部分,使得与相邻位线对的耦合电容值相对于成对位线彼此相等。 优选地,各位线对被等分成4N,并且在分割点处提供交叉部分,使得在相同分割点处具有交叉部分的位线对被布置在交替的位线对上。 优选地,十字部分设置在用于形成恢复电路或感测放大器的区域中。 更优选地,通过所选字线的位置选择用于选择用于提供参考电位的虚拟单元的虚拟字线。
    • 48. 发明授权
    • Semiconductor memory device for simple cache system
    • 半导体存储器件,用于简单缓存系统
    • US06404691B1
    • 2002-06-11
    • US08472770
    • 1995-06-07
    • Kazuyasu FujishimaYoshio MatsudaMikio Asakura
    • Kazuyasu FujishimaYoshio MatsudaMikio Asakura
    • G11C700
    • G06F12/0893G11C7/1021
    • A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
    • 一种半导体存储器件包括:DRAM存储单元阵列,包括以多行和多列布置的多个动态型存储单元;以及SRAM存储单元阵列,其包括排列成多行和列的静态型存储单元。 DRAM存储单元阵列被分成多个块,每个块包括多个列。 SRAM存储单元阵列被分成多个块,每个块包括对应于DRAM存储单元阵列中的多个块的多个列。 SRAM存储单元阵列用作高速缓冲存储器。 在缓存命中时,数据被访问到SRAM存储单元阵列。 在缓存未命中时,数据被存取到DRAM存储单元阵列。 在这种情况下,对应于DRAM存储单元阵列中的每个块中的一行的数据被传送到SRAM存储单元阵列中相应块中的一行。
    • 49. 发明授权
    • Semiconductor memory device for simple cache system
    • 半导体存储器件,用于简单缓存系统
    • US5226147A
    • 1993-07-06
    • US564657
    • 1990-08-09
    • Kazuyasu FujishimaYoshio MatsudaMikio Asakura
    • Kazuyasu FujishimaYoshio MatsudaMikio Asakura
    • G06F12/08G11C7/10
    • G06F12/0893G11C7/1021
    • A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
    • 一种半导体存储器件包括:DRAM存储单元阵列,包括以多行和多列布置的多个动态型存储单元;以及SRAM存储单元阵列,其包括排列成多行和列的静态型存储单元。 DRAM存储单元阵列被分成多个块,每个块包括多个列。 SRAM存储单元阵列被分成多个块,每个块包括对应于DRAM存储单元阵列中的多个块的多个列。 SRAM存储单元阵列用作高速缓冲存储器。 在缓存命中时,数据被访问到SRAM存储单元阵列。 在缓存未命中时,数据被存取到DRAM存储单元阵列。 在这种情况下,对应于DRAM存储单元阵列中的每个块中的一行的数据被传送到SRAM存储单元阵列中相应块中的一行。
    • 50. 发明授权
    • Bit line structure for semiconductor memory device including
cross-points and multiple interconnect layers
    • 包括交叉点和多个互连层的半导体存储器件的位线结构
    • US5214601A
    • 1993-05-25
    • US876690
    • 1992-04-28
    • Hideto HidakaKazuyasu FujishimaYoshio Matsuda
    • Hideto HidakaKazuyasu FujishimaYoshio Matsuda
    • G11C5/06G11C7/18
    • G11C5/063G11C7/18
    • A semiconductor memory device of folded bit line structure includes a cross portion in at least one portion of each bit line pair so that values of coupling capacitance with adjacent bit line pairs are equal to each other with respect to the paired bit lines. Preferably, the respective bit line pairs are equally divided into 4N (N being an integer), although advantages of the invention may be obtained with division of the bit lines into 3N, and the cross parts are provided at dividing points so that bit line pairs having the cross parts at the same dividing points are arranged on alternate pairs of bit lines. In a preferred embodiment, the cross parts are provided in regions for forming restore circuits or sense amplifiers. In a further embodiment, a dummy word line for selecting dummy cells for providing a reference potential is selected according to the position of a selected word line.
    • 折叠位线结构的半导体存储器件包括每个位线对的至少一部分中的交叉部分,使得与相邻位线对的耦合电容值相对于成对的位线彼此相等。 优选地,各位线对被均等地划分为4N(N是整数),尽管可以通过将位线划分为3N来获得本发明的优点,并且在分割点处提供交叉部分,使得位线对 将相同分割点处的交叉部分布置在交替的位线对上。 在优选实施例中,交叉部分设置在用于形成恢复电路或感测放大器的区域中。 在另一实施例中,根据所选字线的位置选择用于选择用于提供参考电位的虚拟单元的虚拟字线。