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41. 发明授权

US08928609B2 Combining touch screen and other sensing detections for user interface control 有权
标题翻译：结合触摸屏和其他感应检测功能，实现用户界面控制
公开(公告)号：US08928609B2
公开(公告)日：2015-01-06
申请号：US13544713
申请日：2012-07-09
申请人： Francesco Italia , Giuseppe Noviello , Chee Yu Ng , Benedetto Vigna
发明人： Francesco Italia , Giuseppe Noviello , Chee Yu Ng , Benedetto Vigna
IPC分类号： G06F3/041
CPC分类号： G06F3/044 , G06F3/0416
摘要： A touch sensitive display includes a capacitive touch sensor configured to output capacitance values. A motion sensor makes a motion detection and generates a motion signal including a motion value indicative of sensed motion detection. A touch detection circuit is coupled to receive the capacitance values and motion values. The touch detection circuit processes the capacitance values to make a hovering detection and a touching detection with respect to the display. The touch detection circuit further generates an output signal including the motion value correlated in time with each of the hovering detection and touching detection. The output signal may be processed as a user interface control signal. The output signal may also be processed to determine an impulsive strength of the touching detection as a function of an elapsed time between hover and touch and the measured motion values.
摘要翻译：触敏显示器包括被配置为输出电容值的电容式触摸传感器。运动传感器进行运动检测并产生运动信号，该运动信号包括指示检测到的运动检测的运动值。耦合触摸检测电路以接收电容值和运动值。触摸检测电路处理电容值以对显示进行悬停检测和触摸检测。触摸检测电路进一步生成包括与悬停检测和触摸检测中的每一个相关的运动值的输出信号。可以将输出信号作为用户界面控制信号进行处理。还可以处理输出信号以确定触摸检测的脉冲强度作为在悬停和触摸之间经过的时间以及所测量的运动值的函数。

42. 发明申请

US20120223402A1 CAPACITIVE SEMICONDUCTOR PRESSURE SENSOR 有权
标题翻译：电容式半导体压力传感器
公开(公告)号：US20120223402A1
公开(公告)日：2012-09-06
申请号：US13446976
申请日：2012-04-13
申请人： Flavio Francesco Villa , Gabriele Barlocchi , Pietro Corona , Benedetto Vigna , Lorenzo Baldo
发明人： Flavio Francesco Villa , Gabriele Barlocchi , Pietro Corona , Benedetto Vigna , Lorenzo Baldo
IPC分类号： H01L29/84
CPC分类号： G01L9/0073 , G01L9/0045
摘要： A capacitive semiconductor pressure sensor, comprising: a bulk region of semiconductor material; a buried cavity overlying a first part of the bulk region; and a membrane suspended above said buried cavity, wherein, said bulk region and said membrane are formed in a monolithic substrate, and in that said monolithic substrate carries structures for transducing the deflection of said membrane into electrical signals, wherein said bulk region and said membrane form electrodes of a capacitive sensing element, and said transducer structures comprise contact structures in electrical contact with said membrane and with said bulk region.
摘要翻译：一种电容半导体压力传感器，包括：半导体材料的主体区域; 覆盖大块区域的第一部分的掩埋腔; 以及悬浮在所述掩埋腔上方的膜，其中所述体积区域和所述膜形成在整体式衬底中，并且所述整体式衬底承载用于将所述膜的偏转转换成电信号的结构，其中所述体积区域和所述膜形成电容感测元件的电极，并且所述换能器结构包括与所述膜电连接并与所述体积区域接触的接触结构。

43. 发明申请

US20100284553A1 ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF 有权
标题翻译：微电子式电容式电容式传感器的组装及其封装
公开(公告)号：US20100284553A1
公开(公告)日：2010-11-11
申请号：US12777058
申请日：2010-05-10
申请人： Sebastiano Conti , Benedetto Vigna , Mario Francesco Cortese
发明人： Sebastiano Conti , Benedetto Vigna , Mario Francesco Cortese
IPC分类号： H04R19/04
CPC分类号： B81C1/00158 , B81B3/0018 , B81B7/0061 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48479 , H01L2924/00014 , H01L2924/16151 , H01L2924/16152 , H04R1/04 , H04R1/06 , H04R1/086 , H04R1/2838 , H04R19/005 , H04R19/04 , H04R2201/003 , H01L2224/48471 , H01L2224/4554 , H01L2924/00012
摘要： A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.
摘要翻译：微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，与第一表面流体连通，微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

44. 再颁专利

USRE41856E1 Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced 有权
公开(公告)号：USRE41856E1
公开(公告)日：2010-10-26
申请号：US10229396
申请日：2002-08-26
申请人： Paolo Ferrari , Benedetto Vigna , Pietro Montanini , Marco Ferrera
发明人： Paolo Ferrari , Benedetto Vigna , Pietro Montanini , Marco Ferrera
IPC分类号： G01P15/125 , G01P9/04
CPC分类号： H01L21/764 , B81B2201/0235 , B81B2201/0242 , B81C1/00246 , B81C2201/0109 , B81C2201/0177 , B81C2203/0735 , B81C2203/0778 , G01P15/0802 , G01P15/125 , G01P2015/0814 , H01L21/76202
摘要： A movable mass forming a seismic mass is formed starting from an epitaxial layer and is covered by a weighting region of tungsten which has high density. To manufacture the mass, buried conductive regions are formed in the substrate. Then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions are formed on the buried conductive regions so as to partially cover them. An epitaxial layer is then grown, using a nucleus region. A tungsten layer is deposited and defined and, using a silicon carbide layer as mask, the suspended structure is defined. Finally, the sacrificial region is removed, forming an air gap.

45. 发明申请

US20090294186A1 Touch position determining device and method, and electronic touch-sensitive device 审中-公开
标题翻译：触摸位置确定装置和方法以及电子触敏装置
公开(公告)号：US20090294186A1
公开(公告)日：2009-12-03
申请号：US11990384
申请日：2006-08-08
申请人： Luca Fontanella , Fabio Pasolini , Benedetto Vigna , Enrico Chiesa
发明人： Luca Fontanella , Fabio Pasolini , Benedetto Vigna , Enrico Chiesa
IPC分类号： G08C21/00 , G06F15/00 , G06F3/043
CPC分类号： G06F3/0433
摘要： In a device for determining the position of a touch on a contact surface, a plurality of vibration sensors are configured to detect mechanical vibrations generated by the touch on the contact surface and to generate corresponding vibration signals, and a processing circuit is connected to the vibration sensors and is configured to determine the touch position via a time-of-flight algorithm, based on differences between times of detection of the mechanical vibrations by the vibration sensors.
摘要翻译：在用于确定接触表面上的触摸位置的装置中，多个振动传感器被配置为检测由接触表面上的触摸产生的机械振动并产生相应的振动信号，并且处理电路连接到振动传感器，并且被配置为基于通过振动传感器检测到机械振动的时间差异，经由飞行时间算法来确定触摸位置。

46. 发明申请

US20080315333A1 SUBSTRATE-LEVEL ASSEMBLY FOR AN INTEGRATED DEVICE, MANUFACTURING PROCESS THEREOF AND RELATED INTEGRATED DEVICE 有权
标题翻译：集成器件的基板级组件及其制造工艺及相关的集成器件
公开(公告)号：US20080315333A1
公开(公告)日：2008-12-25
申请号：US12102709
申请日：2008-04-14
申请人： Chantal Combi , Benedetto Vigna , Federico Giovanni Ziglioli , Lorenzo Baldo , Manuela Magugliani , Ernesto Lasalandra , Caterina Riva
发明人： Chantal Combi , Benedetto Vigna , Federico Giovanni Ziglioli , Lorenzo Baldo , Manuela Magugliani , Ernesto Lasalandra , Caterina Riva
IPC分类号： H01L23/10 , H01L21/50
CPC分类号： B81B7/0061 , B81B7/02 , B81B2201/0235 , B81B2201/0264 , B81C1/0023 , H01L2224/48091 , H01L2224/73265 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidically isolated from the first empty space, is provided over the respective membrane of the further integrated device.
摘要翻译：一种基板级组件，其具有具有顶面的半导体材料的器件基板并且容纳第一集成器件，所述第一集成器件包括形成在所述器件衬底内的掩埋腔，以及悬挂在所述顶面附近的所述掩埋腔上的膜。封盖衬底在顶面上方连接到器件衬底，以便以这样的方式覆盖第一集成器件，使得在膜上方设置第一空白空间。电接触元件将集成器件与衬底级组件的外部电连接。在一个实施例中，器件衬底集成了至少一个设置有相应膜的集成器件，并且在另一个集成器件的相应膜上提供了与第一空白空间流体隔离的另外的空白空间。

47. 发明申请

US20080261345A1 METHOD FOR MANUFACTURING A SEMICONDUCTOR PRESSURE SENSOR 有权
标题翻译：制造半导体压力传感器的方法
公开(公告)号：US20080261345A1
公开(公告)日：2008-10-23
申请号：US12163110
申请日：2008-06-27
申请人： Flavio Francesco Villa , Gabriele Barlocchi , Pietro Corona , Benedetto Vigna , Lorenzo Baldo
发明人： Flavio Francesco Villa , Gabriele Barlocchi , Pietro Corona , Benedetto Vigna , Lorenzo Baldo
IPC分类号： H01L21/00
CPC分类号： G01L9/0073 , G01L9/0045
摘要： Method for manufacturing a semiconductor pressure sensor, wherein, in a silicon substrate, trenches are dug and delimit walls; a closing layer is epitaxially grown, that closes the trenches at the top and forms a suspended membrane; a heat treatment is performed so as to cause migration of the silicon of the walls and to form a closed cavity underneath the suspended membrane; and structures are formed for transducing the deflection of the suspended membrane into electrical signals.
摘要翻译：制造半导体压力传感器的方法，其中在硅衬底中，挖沟和界定壁; 闭合层外延生长，封闭顶部的沟槽并形成悬浮膜; 进行热处理以使壁的硅迁移并在悬浮膜下方形成封闭空腔; 并且形成用于将悬浮膜的偏转转换成电信号的结构。

48. 发明授权

US07242066B2 Manufacturing method of a microelectromechanical switch 有权
标题翻译：微机电开关的制造方法
公开(公告)号：US07242066B2
公开(公告)日：2007-07-10
申请号：US11343400
申请日：2006-01-31
申请人： Chantal Combi , Benedetto Vigna
发明人： Chantal Combi , Benedetto Vigna
IPC分类号： H03L29/84
CPC分类号： H01H59/0009
摘要： The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.
摘要翻译：微机电开关的制造方法包括在第一半导体基板上制造悬挂杆，第一半导体基板的一端配备有接触电极，以及从第一半导体基板突出的框架。具有导电轨道的第二半导体衬底包括第二输入/输出电极和第三起始电极，以及电连接到导电轨道的第一和第二间隔件。框架与第一间隔件邻接，使得第四接触电极响应于通过第三起动电极提供给吊杆的电信号而抵靠第二输入/输出电极。

49. 发明授权

US06610556B2 Method for manufacturing a microintegrated structure with buried connections, in particular an integrated microactuator for a hard-disk drive unit 有权
公开(公告)号：US06610556B2
公开(公告)日：2003-08-26
申请号：US10124781
申请日：2002-04-16
申请人： Benedetto Vigna , Paolo Ferrari
发明人： Benedetto Vigna , Paolo Ferrari
IPC分类号： H01L2100
CPC分类号： H02N1/008 , G11B5/5552 , G11B21/106 , G11B21/21
摘要： The method is intended for manufacturing a microintegrated structure, typically a microactuator for a hard-disk drive unit and includes the steps of: forming interconnection regions in a substrate of semiconductor material; forming a monocrystalline epitaxial region; forming lower sinker regions in the monocrystalline epitaxial region and in direct contact with the interconnection regions; forming insulating material regions on a structure portion of the monocrystalline epitaxial region; growing a pseudo-epitaxial region formed by a polycrystalline portion above the structure portion of the monocrystalline epitaxial region and elsewhere a monocrystalline portion; and forming upper sinker regions in the polycrystalline portion of the pseudo-epitaxial region and in direct contact with the lower sinker regions. In this way no PN junctions are present inside the polycrystalline portion of the pseudo-epitaxial region and the structure has a high breakdown voltage.

50. 发明授权

US06437418B1 High quality factor, integrated inductor and production method thereof 有权
标题翻译：高品质因素，集成电感及其制作方法
公开(公告)号：US06437418B1
公开(公告)日：2002-08-20
申请号：US09170914
申请日：1998-10-13
申请人： Paolo Ferrari , Armando Manfredi , Benedetto Vigna
发明人： Paolo Ferrari , Armando Manfredi , Benedetto Vigna
IPC分类号： H01L2900
CPC分类号： H01L28/10 , H01L23/5227 , H01L23/645 , H01L27/0688 , H01L2924/0002 , H01L2924/00
摘要： The integrated inductor comprises a coil of metal which is formed in the second metal level. The coil is supported by a bracket extending above spaced from a semiconductor material body by an air gap obtained by removing a sacrificial region formed in the first metal level. The bracket is carried by the semiconductor material body through support regions which are arranged peripherally on the bracket and are separated from one another by through apertures which are connected to the air gap. A thick oxide region extends above the semiconductor material body, below the air gap, to reduce the capacitive coupling between the inductor and the semiconductor material body. The inductor thus has a high quality factor, and is produced by a process compatible with present microelectronics processes.
摘要翻译：集成电感器包括形成在第二金属层中的金属线圈。线圈由通过去除在第一金属层中形成的牺牲区域而获得的气隙的由半导体材料体间隔开延伸的支架支撑。托架由半导体材料体通过支撑区域承载，该支撑区域周向地布置在支架上并且通过连接到气隙的孔彼此分离。厚氧化物区域在半导体材料体的上方延伸到气隙下方，以减小电感器和半导体材料体之间的电容耦合。因此，电感器具有高品质因素，并且通过与当前微电子工艺兼容的工艺来产生。

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