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41. 发明申请

US20090152534A1 Producing Layered Structures With Lamination 有权
标题翻译：生产分层结构
公开(公告)号：US20090152534A1
公开(公告)日：2009-06-18
申请号：US11959187
申请日：2007-12-18
申请人： Michael L. Chabinyc , Tse Nga Ng
发明人： Michael L. Chabinyc , Tse Nga Ng
IPC分类号： H01L51/46
CPC分类号： H01L51/0024
摘要： A layered structure can include laminated first and second substructures and an array with cell regions. The first substructure can include layered active circuitry, the second a top electrode layer. One or both substructure's surface that contacts the other can be on a polymer-containing layer, structured to generate free charge carriers and/or to transport charge carriers. A cell region of the array can include portions of each substructure; the cell region's portion of the first substructure can include a subregion of electrically conductive material and a subregion of semiconductive material, its portion of the second can include part of the top electrode layer. The layered structure can include one or more lamination artifacts on or in the polymer-containing layer; the lamination artifacts can include artifacts of contact pressure, or heat, or of surface shape, and the interface surface can be without vias.
摘要翻译：分层结构可以包括层叠的第一和第二子结构以及具有单元区域的阵列。第一子结构可以包括分层有源电路，第二个是电极顶层。与另一个接触的一个或两个子结构的表面可以在聚合物含有层上，其被构造成产生无电荷载流子和/或输送电荷载体。阵列的单元区域可以包括每个子结构的部分; 第一子结构的单元区域的部分可以包括导电材料的次级区域和半导体材料的次级区域，其第二区域的部分可以包括顶部电极层的一部分。层状结构可以包括在含聚合物层上或其中的一个或多个层压伪影; 层压伪影可以包括接触压力或热或表面形状的伪像，并且界面表面可以没有通孔。

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