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41. 发明授权

US08785957B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US08785957B2
公开(公告)日：2014-07-22
申请号：US13612988
申请日：2012-09-13
申请人： Toshio Hata , Masayuki Ito , Masataka Miyata
发明人： Toshio Hata , Masayuki Ito , Masataka Miyata
IPC分类号： H01L33/00
CPC分类号： H01L33/501 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： Disclosed is a light-emitting device having a wide luminous-intensity distribution characteristic with a simple structure. The light-emitting device includes a resin package in which an LED chip, a first inner portion of a first lead terminal, and a second inner portion of a second lead terminal are accommodated and which has a second recess portion formed so that a portion including a first recess portion of the first inner portion of the first lead terminal as well as a portion of the second inner portion of the second lead terminal are exposed to a bottom portion of the second recess portion, and a resin portion containing phosphors and filled in the first recess portion of the first lead terminal and in the second recess portion of the resin package. A photoreflective filler is contained in a region opposed to the LED chip of the resin portion including the phosphors.
摘要翻译：公开了具有宽的发光强度分布特性的结构简单的发光装置。发光装置包括其中容纳LED芯片，第一引线端子的第一内部部分和第二引线端子的第二内部部分的树脂封装，并且具有第二凹部，所述第二凹部形成为包括第一引线端子的第一内部部分的第一凹部以及第二引线端子的第二内部部分的一部分暴露于第二凹部的底部，并且包含含有荧光体并填充的树脂部分第一引线端子的第一凹部和树脂封装的第二凹部中。在与包括荧光体的树脂部分的LED芯片相对的区域中包含光反射填料。

42. 发明授权

US08680546B2 Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus 有权
标题翻译：发光装置，面光源，以及制造发光装置用封装的方法
公开(公告)号：US08680546B2
公开(公告)日：2014-03-25
申请号：US12490192
申请日：2009-06-23
申请人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
摘要翻译：本发明的发光装置具有：（i）朝向比基板高的位置发光的半导体装置，（ii）多个外部连接端子，具有：设置在基板上的光反射层，其反映由半导体器件发射的光; 以及至少覆盖所述光反射层并透射由所述光反射层反射的光的覆盖层。此外，半导体器件设置在覆盖层上，并且经由连接部分电连接到外部连接端子，半导体器件和连接部分用密封树脂密封以被覆盖。因此，发光装置具有提高光线的效率，能够防止反射层的变化，劣化，反射率的降低。

43. 发明申请

US20130264934A1 LIGHT EMITTING DEVICE, LED LIGHT SOURCE FOR PLANT CULTIVATION, AND PLANT FACTORY 有权
标题翻译：发光装置，植物植物用LED光源及植物工厂
公开(公告)号：US20130264934A1
公开(公告)日：2013-10-10
申请号：US13988405
申请日：2011-11-15
申请人： Shinji Osaki , Toyonori Uemura , Toshio Hata , Tomokazu Nada , Tatsuya Morioka , Makoto Matsuda , Shinya Ishizaki , Makoto Agatani , Hitoshi Matsushita
发明人： Shinji Osaki , Toyonori Uemura , Toshio Hata , Tomokazu Nada , Tatsuya Morioka , Makoto Matsuda , Shinya Ishizaki , Makoto Agatani , Hitoshi Matsushita
IPC分类号： H01L33/50 , H05B33/12
CPC分类号： H01L33/504 , A01G7/045 , H01L25/0753 , H01L33/502 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H05B33/12 , Y02P60/149 , H01L2924/00014 , H01L2924/00
摘要： A substrate-type LED light source (10) includes: at least one blue LED chip (2) which has an emission peak in a range from 400 nm to 480 nm so as to correspond to a blue light region absorption peak of chlorophyll; a red phosphor (7b) which emit, upon receiving excitation light from the at least one blue LED chip (2), light having a peak wavelength in a range from 620 nm to 700 nm so as to correspond to a red light region absorption peak of chlorophyll; and a resin layer (7) in which the red phosphor 7b is dispersed and which covers the at least one blue LED chip (2).
摘要翻译：基板型LED光源（10）包括：至少一个蓝色LED芯片（2），其具有在400nm至480nm范围内的发射峰值，以对应于叶绿素的蓝光区域吸收峰; 在从至少一个蓝色LED芯片（2）接收到激发光的情况下，发射峰值波长在620nm〜700nm范围内的红色荧光体（7b），以对应于红色光区域吸收峰的叶绿素; 以及其中分散有红色荧光体7b并覆盖至少一个蓝色LED芯片（2）的树脂层（7）。

44. 发明授权

US08421102B2 Semiconductor light-emitting device having a member in a periphery made of a material whose color, transparency or adhesiveness changes overtime due to light or heat emission from the emitting element 有权
标题翻译：半导体发光器件具有由周边部件构成的材料，其颜色，透明度或粘合性由于来自发光元件的光或热发射而随时间变化
公开(公告)号：US08421102B2
公开(公告)日：2013-04-16
申请号：US12618043
申请日：2009-11-13
申请人： Toshio Hata , Nobuaki Aoki
发明人： Toshio Hata , Nobuaki Aoki
IPC分类号： H01L29/267
CPC分类号： H01L33/44 , F21K9/232 , F21K9/64 , F21S8/02 , F21V3/02 , F21V3/04 , F21Y2115/10 , H01L2224/48091 , H01L2924/00014
摘要： A light-emitting device in accordance with an embodiment of the present invention includes a semiconductor light-emitting element, and a member in the periphery of the semiconductor light-emitting element is made of a material whose color, transparency or adhesiveness changes over time as it is subjected to light or heat emitted by the semiconductor light-emitting element.
摘要翻译：根据本发明实施例的发光器件包括半导体发光元件，并且半导体发光元件周围的部件由颜色，透明度或粘合性随时间而变化的材料制成它受到由半导体发光元件发出的光或热。

45. 发明授权

US08421088B2 Surface mounting type light emitting diode 有权
标题翻译：表面贴装型发光二极管
公开(公告)号：US08421088B2
公开(公告)日：2013-04-16
申请号：US12035320
申请日：2008-02-21
申请人： Masahiro Konishi , Toshio Hata , Taiji Morimoto
发明人： Masahiro Konishi , Toshio Hata , Taiji Morimoto
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/644 , H01L2224/48091 , H01L2924/00014
摘要： This invention provides a surface mounting type light emitting diode excellent in heat radiation performance, reliability and productivity. The surface mounting type light emitting diode includes an insulating base member, a semiconductor light emitting element having a bottom face fixedly bonded to a top face of the base member, and a metallic reflector joined to the top face of the base member with a heat conduction type adhesive sheet interposed therebetween, to surround the semiconductor light emitting element. Heat generated from the semiconductor light emitting element is transferred to the reflector via the base member and the heat conduction type adhesive sheet, and then is radiated to the outside. The metallic reflector can efficiently radiate the heat to the outside. The cutting margin provided for the reflector facilitates a dicing process, which improves productivity.
摘要翻译：本发明提供了散热性能，可靠性和生产率优异的表面安装型发光二极管。表面安装型发光二极管包括绝缘基底构件，具有固定地接合到基底构件的顶面的底面的半导体发光元件和与基底构件的顶面接合的金属反射体，具有热传导以夹持半导体发光元件。从半导体发光元件产生的热量经由基底部件和导热型粘合片传递到反射体，然后被照射到外部。金属反射器可以有效地将热量辐射到外部。为反射器提供的切割边缘有助于切割过程，从而提高生产率。

46. 发明申请

US20110244606A1 CHIP-TYPE LED AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：芯片型LED及其制造方法
公开(公告)号：US20110244606A1
公开(公告)日：2011-10-06
申请号：US13162295
申请日：2011-06-16
申请人： Makoto MATSUDA , Toshio Hata
发明人： Makoto MATSUDA , Toshio Hata
IPC分类号： H01L33/52
CPC分类号： H01L33/486 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.
摘要翻译：在根据本发明的实施例的芯片型LED中，在绝缘基板中形成用于安装LED芯片的第一凹部孔和用于连接细金属丝的第二凹部孔，用作第一布线在包括第一凹槽的部分形成图案，在包括第二凹槽的部分形成用作第二布线图案的金属片，在第一凹槽内的金属片上安装LED芯片， LED芯片通过细金属线电连接到第二凹槽内的金属片，包括第一凹部孔和包括第二凹部孔的细金属线的LED芯片封装在包含荧光材料的第一透明树脂中包含第一透明树脂的绝缘基板的表面被封装在第二透明树脂中。

47. 发明申请

US20110180817A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20110180817A1
公开(公告)日：2011-07-28
申请号：US13011124
申请日：2011-01-21
申请人： Shinya ISHIZAKI , Makoto Agatani , Tomokazu Nada , Toshio Hata
发明人： Shinya ISHIZAKI , Makoto Agatani , Tomokazu Nada , Toshio Hata
IPC分类号： H01L27/15
CPC分类号： H01L25/0753 , F21K9/232 , F21K9/238 , F21V3/00 , F21V5/048 , F21V23/005 , F21V29/74 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/167 , H01L27/15 , H01L27/156 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48137 , H01L2924/3011 , H01L2924/00
摘要： A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.
摘要翻译：发光器件包括：陶瓷衬底; 多个LED芯片; 与所述多个LED芯片并联连接的印刷电阻器; 由透光率低的树脂制成的树脂树脂; 含荧光材料的树脂层; 以及阳极侧电极和阴极侧电极（a），其设置在所述陶瓷基板的主面上，以在所述主面上沿着第一方向彼此面对，以及（b）设置在所述主表面的下方至少一个坝树脂和含荧光材料的树脂层。通过在基板上设置串联并联连接的多个LED的结构，可以提供能够实现亮度不均匀性的抑制和发光效率的提高的发光装置。

48. 发明申请

US20100133571A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20100133571A1
公开(公告)日：2010-06-03
申请号：US12625993
申请日：2009-11-25
申请人： Osamu Kawasaki , Toshio Hata
发明人： Osamu Kawasaki , Toshio Hata
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/50 , H01L33/56 , H01L33/60 , H01L2224/48227 , H01L2224/48465 , H01L2924/13091 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： To provide a light emitting device easy to produce and extracting light to its outside with high efficiency, the light-emitting device 70 of the present invention includes an insulating base 10; a light-emitting element 1 mounted on a side of the base 10; and a protection element 2 mounted on the side and protecting the light-emitting element 1. The element 2 is covered with a light-reflecting filler-containing resin 5, which is prepared by causing a flexible silicone resin to contain, before being cured, light-reflecting or light-scattering fillers 5a having a particle diameter larger than the wavelength of light emitted by the element 1. This causes light emitted from the element 1 to be reflected by the resin 5, instead of being absorbed by the element 2, so that such light is released to the outside of the light-emitting device 70. This allows the device 70 to extract light to the outside with high efficiency, and also allows for easy formation of the resin 5 having a desired pattern and position.
摘要翻译：本发明的发光装置70为了提供容易产生高效率地向其外部产生光的发光装置，具有绝缘基座10，安装在基座10一侧的发光元件1; 以及安装在侧面并保护发光元件1的保护元件2.元件2被含有光反射填料的树脂5覆盖，该树脂5通过使柔性硅树脂在固化之前包含，光反射或光散射填料5a，其粒径大于由元件1发射的光的波长。这使得从元件1发射的光被树脂5反射，而不是被元件2吸收，使得这样的光被释放到发光装置70的外部。这允许装置70以高效率将光提取到外部，并且还允许容易地形成具有期望的图案和位置的树脂5。

49. 发明申请

US20080203416A1 SURFACE MOUNTING TYPE LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：表面安装型发光二极管及其制造方法
公开(公告)号：US20080203416A1
公开(公告)日：2008-08-28
申请号：US12035216
申请日：2008-02-21
申请人： Masahiro KONISHI , Toshio Hata , Taiji Morimoto
发明人： Masahiro KONISHI , Toshio Hata , Taiji Morimoto
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/644 , H01L33/486 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014
摘要： This invention provides a surface mounting type light emitting diode excellent in heat radiation performance, reliability and productivity. The surface mounting type light emitting diode includes a metallic base member, a semiconductor light emitting element having a bottom face fixedly bonded to a top face of the base member, and a metallic reflector joined to the top face of the base member with a heat conduction type adhesive sheet interposed therebetween, to surround the semiconductor light emitting element. Heat generated from the semiconductor light emitting element is transferred to the reflector via the base member and the heat conduction type adhesive sheet, and then is radiated to the outside. The metallic reflector can efficiently radiate the heat to the outside. The cutting margin provided for the reflector facilitates a dicing process, which improves productivity.
摘要翻译：本发明提供了散热性能，可靠性和生产率优异的表面安装型发光二极管。表面安装型发光二极管包括金属基底构件，具有固定地接合到基底构件的顶面的底面的半导体发光元件和与基底构件的顶面接合的金属反射体，其具有热传导以夹持半导体发光元件。从半导体发光元件产生的热量经由基底部件和导热型粘合片传递到反射体，然后被照射到外部。金属反射器可以有效地将热量辐射到外部。为反射器提供的切割边缘有助于切割过程，从而提高生产率。

50. 发明申请

US20060226434A1 Nitride-based semiconductor light emitting device and manufacturing method thereof 审中-公开
标题翻译：氮化物系半导体发光元件及其制造方法
公开(公告)号：US20060226434A1
公开(公告)日：2006-10-12
申请号：US11403511
申请日：2006-04-12
申请人： Toshio Hata
发明人： Toshio Hata
IPC分类号： H01L33/00
CPC分类号： H01L33/32 , H01L33/0079 , H01L33/20
摘要： A present nitride-based semiconductor light emitting device includes: a pattern surface formed on a conductive substrate; a multilayered metal layer formed on the pattern surface; and a multilayered semiconductor layer formed on the multilayered metal layer, and characterized in that main surfaces of the multilayered metal layer and the multilayered semiconductor layer have smaller area than the pattern surface has, and the multilayered semiconductor layer includes a p type nitride-based semiconductor layer, a light emitting layer and an n type nitride-based semiconductor layer. Thus, a highly reliable nitride-based semiconductor light emitting device with excellent adhesion between a nitride-based semiconductor layer and a conductive substrate, and a manufacturing method thereof are provided.
摘要翻译：本发明的氮化物系半导体发光元件包括：形成在导电性基板上的图案表面; 形成在图案表面上的多层金属层; 以及形成在所述多层金属层上的多层半导体层，其特征在于，所述多层金属层和所述多层半导体层的主表面的面积比所述图案表面的面积小，并且所述多层半导体层包括p型氮化物系半导体层，发光层和n型氮化物系半导体层。因此，提供了一种在氮化物系半导体层和导电性基板之间具有优异的粘附性的高度可靠的氮化物系半导体发光元件及其制造方法。

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