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41. 发明申请

US20060109465A1 Fluorescence analysis optical multiplexer/demultiplexer, fluorescence analysis optical module, fluorescence analyzer, fluorescence/photothermal conversion spectroscopic analyzer, and fluorescence analysis chip 有权
公开(公告)号：US20060109465A1
公开(公告)日：2006-05-25
申请号：US11329456
申请日：2006-01-09
申请人： Takashi Fukuzawa , Jun Yamaguchi , Akihiko Hattori , Takao Miwa
发明人： Takashi Fukuzawa , Jun Yamaguchi , Akihiko Hattori , Takao Miwa
IPC分类号： G01N21/64
CPC分类号： G01N21/645 , G01N2021/6482 , G01N2021/6484
摘要： A fluorescence analysis optical multiplexer/demultiplexer, a fluorescence analysis optical module, a fluorescence analyzer, a fluorescence/photothermal conversion spectroscopic analyzer, and a fluorescence analysis chip, according to which LIF analysis can be carried out easily and with high sensitivity, and moreover photothermal conversion spectroscopic analysis can be carried out easily and simultaneously with the LIF analysis. A microchemical system 100 as the fluorescence analyzer is comprised of a fluorescence analysis optical module 100a, a probe 50 that condenses exciting light onto a sample solution in a channel 204 inside a fluorescence analysis chip 20, and a sample stage 21 on which the fluorescence analysis chip 20 is mounted. The fluorescence analysis optical module 100a is comprised of an exciting light source 53 that outputs exciting light of dominant wavelength λ1, a fluorescence analysis optical multiplexer/demultiplexer 56 for use in the fluorescence analyzer which analyzes fluorescence of dominant wavelength λ2 (λ2>λ1) emitted from the sample upon the sample being irradiated with the exciting light via the probe 50, a detector 54 that receives the fluorescence, an optical fiber 106 that connects the fluorescence analysis optical multiplexer/demultiplexer 56 to the exciting light source 53, an optical fiber 107 that connects the fluorescence analysis optical multiplexer/demultiplexer 56 to the probe 50, and an optical fiber 108 that connects the fluorescence analysis optical multiplexer/demultiplexer 56 to the detector 54. The channel 204 through which the sample solution is passed is coated with a reflective metal film 205.

42. 发明申请

US20050277753A1 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof 失效
公开(公告)号：US20050277753A1
公开(公告)日：2005-12-15
申请号：US11177362
申请日：2005-07-11
申请人： Satoru Amou , Shinji Yamada , Takao Ishikawa , Takao Miwa
发明人： Satoru Amou , Shinji Yamada , Takao Ishikawa , Takao Miwa
IPC分类号： C08J5/18 , C08F2/40 , C08F2/44 , C08F4/00 , C08F4/32 , C08F12/08 , C08F12/34 , C08F212/14 , C08F212/32 , C08F257/02 , C08F291/00 , C08K5/01 , H01B3/44
CPC分类号： C08K5/01 , C08F212/14 , C08F212/32 , C08F257/02 , H05K1/0373 , H05K2201/0209 , H05K2201/0254 , C08L65/00 , C08F236/02
摘要： According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

43. 发明授权

US06933601B2 Semiconductor connection substrate 失效
标题翻译：半导体连接基板
公开(公告)号：US06933601B2
公开(公告)日：2005-08-23
申请号：US10483383
申请日：2002-07-12
申请人： Toshiya Satoh , Masahiko Ogino , Takao Miwa , Takashi Naitou , Takashi Namekawa
发明人： Toshiya Satoh , Masahiko Ogino , Takao Miwa , Takashi Naitou , Takashi Namekawa
IPC分类号： H01L23/498 , H05K1/16 , H05K3/46 , H01L23/04 , H01L23/48
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49822 , H01L23/49894 , H01L2924/0002 , H01L2924/12044 , H01L2924/19011 , H01L2924/3011 , H05K1/162 , H05K3/4602 , H05K2201/09509 , H05K2201/09763 , H01L2924/00
摘要： A semiconductor connection substrate which connects a semiconductor element to a mounting substrate such as a printed substrate comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.
摘要翻译：将半导体元件连接到诸如印刷基板的安装基板的半导体连接基板包括绝缘体基板，设置在绝缘体基板上的具有不同区域的多个电极，一个或多个元件，它们被选自介于电极，电感器元件和电阻器元件，连接元件的金属布线，金属布线的一部分的金属端子部分和覆盖元件的有机绝缘体材料以及除了金属端子部分之外的金属布线部分的周边。

44. 发明授权

US06930140B2 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof 失效
标题翻译：低介电损耗角正切树脂组合物，固化膜和固化产物，使用其的电气部件及其制造方法
公开(公告)号：US06930140B2
公开(公告)日：2005-08-16
申请号：US10649950
申请日：2003-08-28
申请人： Satoru Amou , Shinji Yamada , Takao Ishikawa , Takao Miwa
发明人： Satoru Amou , Shinji Yamada , Takao Ishikawa , Takao Miwa
IPC分类号： C08J5/18 , C08F2/40 , C08F2/44 , C08F4/00 , C08F4/32 , C08F12/08 , C08F12/34 , C08F212/14 , C08F212/32 , C08F257/02 , C08F291/00 , C08K5/01 , H01B3/44 , C08L9/00
CPC分类号： C08K5/01 , C08F212/14 , C08F212/32 , C08F257/02 , H05K1/0373 , H05K2201/0209 , H05K2201/0254 , C08L65/00 , C08F236/02
摘要： According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.
摘要翻译：根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为可以具有取代基的烃骨架，R 1是氢，甲基或乙基，m是1-4的整数，n是2或更大的整数，并且还包含至少一个选自从重均分子量不小于5,000的高分子量和填料，该树脂组合物可以得到具有良好柔软性，高拉伸强度和低介电常数和介电损耗角正切的固化产物。

45. 发明授权

US5768108A Multi-layer wiring structure 失效
标题翻译：多层布线结构
公开(公告)号：US5768108A
公开(公告)日：1998-06-16
申请号：US720028
申请日：1996-09-27
申请人： Osamu Miura , Kunio Miyazaki , Akio Takahashi , Motoyo Wajima , Ryuji Watanabe , Takao Miwa , Yuichi Satsu , Shigeo Amagi
发明人： Osamu Miura , Kunio Miyazaki , Akio Takahashi , Motoyo Wajima , Ryuji Watanabe , Takao Miwa , Yuichi Satsu , Shigeo Amagi
IPC分类号： H05K1/05 , H01L21/48 , H01L23/538 , H05K1/11 , H05K3/40 , H05K3/42 , H05K3/46 , H05K1/00 , H05K1/09 , H05K1/16
CPC分类号： H01L21/4857 , H01L23/5385 , H05K3/4641 , H01L2224/16225 , H05K1/113 , H05K2201/068 , H05K2201/09536 , H05K2201/096 , H05K3/4069 , H05K3/429 , H05K3/4623
摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.
摘要翻译：在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和高可靠性，以及制造这种基板的方法。多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域相互之间的比例。子组件通过导体经由通孔彼此连接。在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性大会组合得到增强。此外，该板可以低成本生产。

46. 发明授权

US5046343A Insert-molded card key 失效
标题翻译：嵌入式卡片钥匙
公开(公告)号：US5046343A
公开(公告)日：1991-09-10
申请号：US410105
申请日：1989-09-20
申请人： Takao Miwa
发明人： Takao Miwa
IPC分类号： E05B19/00 , A45C11/32
CPC分类号： A45C11/326 , Y10T16/555 , Y10T24/1379 , Y10T70/7876 , Y10T70/8676
摘要： An insert-molded card key in which a key and a card are mutually operatively connected, the card key comprising a key wherein a key support member formed of resin and a key body formed of metal are insert-molded, a card body having a key receiving portion formed in a portion of a card for the key, and a connecting portion for connecting the key support member of the key and the card body so that they may be rotated with each other, the key being rotatable with respect to the card body and being received in the key receiving portion. There is therefore provided an insert-molded card key which has an excellent usability, is conveniently carried, can be prevented from being lost, misplaced. etc., and can be reduced in manufacturing cost.
摘要翻译：一种插入式卡片钥匙，其中钥匙和卡片相互操作地连接，卡片钥匙包括钥匙，其中由树脂形成的钥匙支撑构件和由金属形成的钥匙主体被插入模制，具有钥匙的卡片主体形成在所述键的卡的一部分中的接收部分，以及用于将键的键支撑构件和卡体连接以使得它们可以彼此旋转的连接部分，所述键可相对于卡体转动并被接收在密钥接收部分中。因此，提供了具有优异的可用性的插入成型卡钥匙，便于携带，可以防止丢失，错放。等等，并且可以降低制造成本。

47. 发明授权

US4891055A Method of forming glass product having smooth surface 失效
标题翻译：形成平滑表面的玻璃制品的方法
公开(公告)号：US4891055A
公开(公告)日：1990-01-02
申请号：US267161
申请日：1988-11-04
申请人： Kazuo Shibaoka , Takao Miwa , Toshio Akimoto , Noriaki Eto
发明人： Kazuo Shibaoka , Takao Miwa , Toshio Akimoto , Noriaki Eto
IPC分类号： C03B23/025 , C03B23/03
CPC分类号： C03B23/0258 , C03B23/0305 , C03B23/0307 , Y02P40/57
摘要： In a method of forming a glass product having a smooth surface according to this invention, a glass plate is placed on a male mold which is formed to have dimensions corresponding to the inner dimensions of the glass product and contacts its inner peripheral edge portion, an outer peripheral portion to be deformed of the glass plate is heated to a temperature higher than that of a central portion, serving as the smooth surface, of the glass plate so as to be deformed on the male mold by its weight, and the deformed glass plate is pressed by a female mold formed to have dimensions corresponding to the outer dimensions of the glass product.
摘要翻译：在根据本发明的形成具有光滑表面的玻璃制品的方法中，将玻璃板放置在阳模上，阳模形成为具有与玻璃制品的内部尺寸相对应的尺寸并与其内周边缘部分接触的尺寸，将玻璃板变形的外周部分加热到高于玻璃板的平滑表面的中心部分的温度，以便通过其重量在阳模上变形，并且变形的玻璃板由被形成为具有与玻璃制品的外部尺寸相对应的尺寸的阴模压制。

48. 发明授权

US4102944A Low profile unsaturated polyester resin composition 失效
标题翻译：低调不饱和聚酯树脂组合物
公开(公告)号：US4102944A
公开(公告)日：1978-07-25
申请号：US723934
申请日：1976-09-16
申请人： Yoshiya Fukuyama , Katsuo Akagane , Takao Miwa
发明人： Yoshiya Fukuyama , Katsuo Akagane , Takao Miwa
IPC分类号： C04B26/18 , C08F299/00 , C08F299/04 , C08G63/00 , C08G63/52 , C08L67/00 , C08L67/02 , C08L67/06
CPC分类号： C08L67/06
摘要： A low profile unsaturated polyester resin composition comprising (A) a reaction product between (1) a saturated polyester having a molecular weight of 3,000 - 50,000 obtained from a saturated polycarboxylic acid and a polyhydric alcohol and (2) an unsaturated monoglycidyl compounds, (B) an unsaturated polyester, and (C) an unsaturated monomer copolymerizable with the reaction product (A) and the unsaturated polyester (B) which gives a molded articles of improved surface smoothness and dimensional stability without deterioration of strength peculiar to unsaturated polyester resins.
摘要翻译：低分子量不饱和聚酯树脂组合物，其包含（A）（1）饱和多元羧酸和多元醇得到的分子量为3,000〜50,000的饱和聚酯与（2）不饱和单缩水甘油基化合物（B）的反应产物）不饱和聚酯，和（C）可与反应产物（A）和不饱和聚酯（B）共聚的不饱和单体，其产生具有改善的表面平滑度和尺寸稳定性的模塑制品，而不会降低不饱和聚酯树脂特有的强度。

49. 发明授权

US08722137B2 Hydrated water-absorption polymer containing resin composition, porous body and insulated wire using same, method of making the wire and coaxial cable 有权
标题翻译：包含树脂组合物的水合吸水聚合物，使用其的多孔体和绝缘线，制造线和同轴电缆的方法
公开(公告)号：US08722137B2
公开(公告)日：2014-05-13
申请号：US12314774
申请日：2008-12-16
申请人： Yoshihisa Kato , Yuki Honda , Tomiya Abe , Takao Miwa
发明人： Yoshihisa Kato , Yuki Honda , Tomiya Abe , Takao Miwa
IPC分类号： B05D5/12
CPC分类号： C08J9/0061 , C08J9/28 , C08J2201/0504 , C08J2471/00 , H01B3/427 , H01B3/447 , H01B7/288
摘要： A hydrated water-absorption polymer containing resin composition includes a liquid cross-link curable resin composition, and a water-absorption polymer dispersed in the liquid cross-link curable resin composition. The water-absorption polymer is preliminarily hydrated and swollen. The water-absorption polymer before being hydrated and swollen includes an average particle diameter of not more than 10 μm. The water-absorption polymer includes an amount of water absorption of 10 to 100 g/g.
摘要翻译：含有水合吸水性聚合物的树脂组合物包括液体交联固化树脂组合物和分散在液体交联树脂组合物中的吸水性聚合物。吸水性聚合物预先水合并溶胀。在水合和溶胀之前的吸水聚合物包括不大于10μm的平均粒径。吸水性聚合物的吸水量为10〜100g / g。

50. 发明申请

US20120090871A1 HYDROUS WATER ABSORBENT POLYMER DISPERSED ULTRAVIOLET CURABLE RESIN COMPOSITION, INSULATED ELECTRIC WIRE USING THE SAME, METHOD FOR PRODUCING THE WIRE, AND COAXIAL CABLE 审中-公开
标题翻译：水性吸水聚合物分散的超紫外线可固化树脂组合物，使用其的绝缘电线，生产线和同轴电缆的方法
公开(公告)号：US20120090871A1
公开(公告)日：2012-04-19
申请号：US13099634
申请日：2011-05-03
申请人： Yoshihisa KATO , Tomiya Abe , Takao Miwa , Osamu Seya
发明人： Yoshihisa KATO , Tomiya Abe , Takao Miwa , Osamu Seya
IPC分类号： H01B7/18 , H01B3/30 , B05D3/02 , H01B13/06 , B05D3/06 , C08J3/28 , H01B7/00
CPC分类号： H01B3/447 , C08J3/28 , C08J2375/04
摘要： A hydrous water absorbent polymer dispersed ultraviolet curable resin composition includes an ultraviolet curable resin composition, and a hydrous water absorbent polymer swollen by water beforehand, and dispersed in the ultraviolet curable resin composition so that the hydrous water absorbent polymer dispersed ultraviolet curable resin composition has a moisture content of not less than 50 percent. The water absorption rate of the ultraviolet curable resin composition is not more than 2 percent.
摘要翻译：含水吸水性聚合物分散紫外线固化树脂组合物包括紫外线固化树脂组合物和预先用水溶胀的含水吸水性聚合物，并分散在紫外线固化树脂组合物中，使得含水吸水性聚合物分散的紫外线固化树脂组合物具有含水量不低于50％。紫外线硬化性树脂组合物的吸水率为2％以下。

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