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41. 发明授权

US06495462B1 Components with releasable leads 失效
标题翻译：具有可释放引线的部件
公开(公告)号：US06495462B1
公开(公告)日：2002-12-17
申请号：US09566273
申请日：2000-05-05
申请人： Belgacem Haba , Hamid Eslampour , Konstantine Karavakis
发明人： Belgacem Haba , Hamid Eslampour , Konstantine Karavakis
IPC分类号： H01L21302
CPC分类号： H05K3/4092 , H01L23/32 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/3011 , H01L2924/00
摘要： A microelectronic component is made by providing a starting structure having a dielectric layer and leads on a surface of the dielectric layer. Ends of the leads are connected to contacts on a microelectronic element, such as the contacts on a semiconductor chip or wafer. The dielectric layer is then etched to partially detach the leads from the dielectric layer, leaving at least one end of each lead permanently connected to the dielectric layer. The remainder of the lead may be fully or partially detached from the dielectric layer. If the remainder of the lead is only partially detached, the connecting elements that connects the leads to the polymeric layer can be broken or peeled away from the leads during the step of moving the microelectronic element and dielectric layer away from one another. A microelectronic element assemble by includes a support structure having a dielectric layer and terminals disposed on the dielectric layer; a microelectronic element and a plurality of leads connecting contacts on the microelectronic element to terminals on the dielectric layer. The dielectric layer has a central region and a periphery region which surrounds the central region. The periphery region is disposed beneath the periphery of the microelectronic element.
摘要翻译：通过提供具有介电层的起始结构并在电介质层的表面上引出微电子部件。引线的端部连接到微电子元件上的触点，例如半导体芯片或晶片上的触点。然后蚀刻电介质层以将引线部分地从电介质层分离，留下每个引线的至少一端永久地连接到电介质层。引线的剩余部分可以与电介质层完全或部分分离。如果引线的剩余部分仅部分分离，则在将微电子元件和电介质层彼此远离的步骤期间，将引线连接到聚合物层的连接元件可以从引线断开或剥离。微电子元件组装通过包括具有电介质层的支撑结构和设置在电介质层上的端子; 微电子元件和将微电子元件上的触点连接到电介质层上的端子的多个引线。电介质层具有围绕中心区域的中心区域和周边区域。周边区域设置在微电子元件的外围的下方。

42. 发明授权

US06423907B1 Components with releasable leads 有权
标题翻译：具有可释放引线的部件
公开(公告)号：US06423907B1
公开(公告)日：2002-07-23
申请号：US09549633
申请日：2000-04-14
申请人： Belgacem Haba , Konstantine Karavakis
发明人： Belgacem Haba , Konstantine Karavakis
IPC分类号： H01R1204
CPC分类号： H05K3/4092 , H01L23/32 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/3011 , Y10T29/49121 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.
摘要翻译：用于连接到微电子元件的连接部件是通过在聚合物层的表面上提供导线并蚀刻聚合物层以将引线部分地从聚合物层分离的方式制成的，每个引线的一部分可释放地连接到聚合物层上一个小的聚合物连接元件，可以从铅中破碎或剥离。连接元件的引线可以由通过涂覆工艺施加的绝缘护套覆盖，并且绝缘护套也可以被导电层覆盖，使得每个引线变成微型同轴电缆。这种布置提供了对干扰的抗扰性，并且便于高速运行。

43. 发明授权

US5971253A Microelectronic component mounting with deformable shell terminals 失效
标题翻译：具有可变形外壳端子的微电子部件安装
公开(公告)号：US5971253A
公开(公告)日：1999-10-26
申请号：US777307
申请日：1996-12-27
申请人： Kenneth B. Gilleo , Konstantine Karavakis
发明人： Kenneth B. Gilleo , Konstantine Karavakis
IPC分类号： H01L23/498 , H05K3/34 , B23K31/02 , B23K31/12
CPC分类号： H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K3/3436
摘要： A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.
摘要翻译：诸如半导体芯片组件的微电子元件组件使用在其中结合有电导元件的电介质片的连接部件。每个导电元件可以包括柔性壳。可以形成柔性壳体以确保与配合接触垫片的可靠接合。

44. 发明授权

US09631279B2 Methods for forming embedded traces 有权
公开(公告)号：US09631279B2
公开(公告)日：2017-04-25
申请号：US14297516
申请日：2014-06-05
申请人： Kenneth S. Bahl , Konstantine Karavakis , Steve Carney
发明人： Kenneth S. Bahl , Konstantine Karavakis , Steve Carney
IPC分类号： H05K3/10 , C23C18/16 , C23C18/38 , C23C18/20 , H05K3/18 , H05K3/46
CPC分类号： C23C18/1608 , C23C18/204 , C23C18/38 , H05K3/185 , H05K3/4602 , H05K2201/0236 , H05K2201/0376 , H05K2203/025 , H05K2203/0716 , H05K2203/107 , Y10T29/49165
摘要： A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

45. 发明授权

US09398703B2 Via in a printed circuit board 有权
标题翻译：通过印刷电路板
公开(公告)号：US09398703B2
公开(公告)日：2016-07-19
申请号：US14281802
申请日：2014-05-19
申请人： Konstantine Karavakis , Kenneth S. Bahl
发明人： Konstantine Karavakis , Kenneth S. Bahl
IPC分类号： H05K1/03 , H05K3/38 , H05K3/42
CPC分类号： H05K3/426 , H05K1/09 , H05K1/115 , H05K3/0047 , H05K3/387 , H05K2201/0221 , H05K2201/0236 , H05K2203/0709 , Y10T29/49167
摘要： A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.
摘要翻译：印刷电路板中的通孔由延伸穿过电介质层压材料中的孔的图案化金属层组成，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。催化粘合剂层将电介质层叠材料的一部分涂覆在孔周围。图案化的金属层放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。

46. 发明授权

US07114250B2 Method of making components with releasable leads 失效
公开(公告)号：US07114250B2
公开(公告)日：2006-10-03
申请号：US10858167
申请日：2004-06-01
申请人： Belgacem Haba , Konstantine Karavakis
发明人： Belgacem Haba , Konstantine Karavakis
IPC分类号： H01R9/00
CPC分类号： H05K3/4092 , H01L23/32 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/3011 , Y10T29/49121 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.

47. 发明授权

US07112879B2 Microelectronic assemblies having compliant layers 有权
标题翻译：具有柔性层的微电子组件
公开(公告)号：US07112879B2
公开(公告)日：2006-09-26
申请号：US10873883
申请日：2004-06-22
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L23/52 , H01L23/02
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： A microelectronic package includes a microelectronic element having contacts accessible at a surface thereof, a layer overlying the microelectronic element, the layer having a first surface and a sloping peripheral edge extending away from the first surface of the layer, and conductive terminals overlying the microelectronic element, wherein the layer supports the conductive terminals over the microelectronic element. The package also includes conductive traces having first ends electrically connected with the contacts of the microelectronic element and second ends electrically connected with the conductive terminals, with at least one of the conductive traces having a section that is in contact with and extends along the sloping peripheral edge of the layer, and a compliant material disposed between the conductive terminals and the microelectronic element so that the conductive terminals are movable relative to the microelectronic element.
摘要翻译：微电子封装包括具有可在其表面可访问的触点的微电子元件，覆盖微电子元件的层，该层具有远离该第一表面延伸的第一表面和倾斜周边边缘以及覆盖该微电子元件的导电端子其中所述层支撑所述微电子元件上的导电端子。封装还包括导电迹线，其导电迹线具有与微电子元件的触点电连接的第一端和与导电端子电连接的第二端，其中至少一个导电迹线具有与倾斜周边接触并沿着倾斜周边延伸的部分所述层的边缘以及设置在所述导电端子和所述微电子元件之间的柔性材料，使得所述导电端子可相对于所述微电子元件移动。

48. 发明授权

US06847101B2 Microelectronic package having a compliant layer with bumped protrusions 有权
标题翻译：微电子封装具有带凸起凸起的柔性层
公开(公告)号：US06847101B2
公开(公告)日：2005-01-25
申请号：US10107094
申请日：2002-03-26
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L23/498 , H01L23/02 , H01L23/29 , H01L23/48 , H01L23/52
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： A microelectronic assembly includes a microelectronic element having a first surface with a plurality of contacts accessible at the first surface, and a compliant layer over the first surface of the microelectronic element, the compliant layer including a plurality of bumped protrusions and openings adjacent the bumped protrusions for providing access to the contacts, wherein each bumped protrusion includes a top surface and at least one sloping edge. The microelectronic assembly also includes conductive terminals over the top surfaces of the bumped protrusions, and a plurality of conductive bond ribbons having first ends in engagement with the contacts, second ends in engagement with the terminals and intermediate sections extending along the sloping edges for electrically interconnecting the contacts and the terminals.
摘要翻译：微电子组件包括具有第一表面的微电子元件，第一表面具有在第一表面可访问的多个触点，以及柔性层，位于微电子元件的第一表面上方，柔顺层包括多个凸起突起和与凸起凸起相邻的开口用于提供对触点的访问，其中每个凸起突起包括顶表面和至少一个倾斜边缘。微电子组件还包括在凸起突起的顶表面上方的导电端子，以及多个导电接合带，其具有与触头接合的第一端，与端子接合的第二端和沿着倾斜边缘延伸的中间部分，用于电互连触点和端子。

49. 发明授权

US06500528B1 Enhancements in sheet processing and lead formation 失效
标题翻译：片材加工和铅的形成增强
公开(公告)号：US06500528B1
公开(公告)日：2002-12-31
申请号：US09559511
申请日：2000-04-27
申请人： Konstantine Karavakis
发明人： Konstantine Karavakis
IPC分类号： B32B300
CPC分类号： H01L23/49827 , H01L23/49811 , H01L2924/0002 , Y10T428/24917 , H01L2924/00
摘要： A connection component for making microelectronic assemblies includes a dielectric structural layer having a first surface and a plurality of conductive leads having first and second ends overlying the first surface of the dielectric structural layer. An adhesive is provided between the second ends of the leads and the dielectric structural layer such that the adhesive forms connections between the second ends of the leads and the structural layer. The formed connections have areas smaller than the areas of the second ends. The second ends of the leads are releasably attached to the structural layer by the connections. Thus, the second ends of the leads may be engaged with features on a microelectronic device and the microelectronic elements may be moved away from the structural layer so as to bend the second ends of the leads away from the structural layer.
摘要翻译：用于制造微电子组件的连接部件包括具有第一表面的介电结构层和多个导电引线，其具有覆盖在介电结构层的第一表面上的第一端和第二端。在引线的第二端和电介质结构层之间提供粘合剂，使得粘合剂在引线的第二端和结构层之间形成连接。形成的连接具有小于第二端的区域的区域。引线的第二端通过连接件可释放地附接到结构层。因此，引线的第二端可以与微电子器件上的特征接合，并且微电子元件可以远离结构层移动，以使引线的第二端弯曲远离结构层。

50. 发明授权

US06373128B1 Semiconductor assemblies with reinforced peripheral regions 有权
标题翻译：具有增强外围区域的半导体组件
公开(公告)号：US06373128B1
公开(公告)日：2002-04-16
申请号：US09722906
申请日：2000-11-27
申请人： Konstantine Karavakis , Joseph Fjelstad
发明人： Konstantine Karavakis , Joseph Fjelstad
IPC分类号： H01L2348
CPC分类号： H01L24/05 , H01L23/3157 , H01L23/49827 , H01L23/562 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05599 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48599 , H01L2224/73215 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/85399
摘要： A semiconductor chip assembly with a compliant layer overlying the chip and a flexible dielectric layer overlying the compliant layer. Connecting terminals are provided on the dielectric layer for connection to a larger substrate. The connecting terminals are moveable in vertical directions toward the chip. Bonding terminals, electrically connected to the connecting terminals, are also provided on the top layer. A reinforcing element resists vertical movement of the bonding terminals, and thereby facilitates connection of leads between the bonding terminals and the chip.
摘要翻译：具有覆盖在芯片上的柔性层的半导体芯片组件和覆盖柔顺层的柔性介电层。在电介质层上提供连接端子，以连接到较大的基板。连接端子可沿垂直方向朝芯片移动。电连接到连接端子的接合端子也设置在顶层上。增强元件抵抗接合端子的垂直移动，从而便于接合端子和芯片之间的引线的连接。

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