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    • 41. 发明申请
    • SILICON PRECURSORS AND METHOD FOR LOW TEMPERATURE CVD OF SILICON-CONTAINING FILMS
    • 有机硅前驱体和含硅薄膜低温CVD的方法
    • US20080081106A1
    • 2008-04-03
    • US11695379
    • 2007-04-02
    • Ziyun WangAshutosh MisraRavi Laxman
    • Ziyun WangAshutosh MisraRavi Laxman
    • B05D5/12C07F7/02
    • C07F7/10C07F7/0838
    • Novel silicon precursors for low temperature deposition of silicon films are described herein. The disclosed precursors possess low vaporization temperatures, preferably less than about 500° C. In addition, embodiments of the silicon precursors incorporate a —Si—Y—Si— bond, where Y may comprise an amino group, a substituted or unsubstituted hydrocarbyl group, or oxygen. In an embodiment a silicon precursor has the formula: where Y is a hydrocarbyl group, a substituted hydrocarbyl group, oxygen, or an amino group; R1, R2, R3, and R4 are each independently a hydrogen group, a hydrocarbyl group, a substituted hydrocarbyl group, a heterohydrocarbyl group, wherein R1, R2, R3, and R4 may be the same or different from one another; X1, X2, X3, and X4 are each independently, a hydrogen group, a hydrocarbyl group, a substituted hydrocarbyl group, or a hydrazino group, wherein X1, X2, X3, and X4 may be the same or different from one another.
    • 本文描述了用于低温沉积硅膜的新型硅前体。 所公开的前体具有低的汽化温度,优选小于约500℃。此外,硅前体的实施方案包含-Si-Y-Si-键,其中Y可以包含氨基,取代或未取代的烃基, 或氧气。 在一个实施方案中,硅前体具有下式:其中Y是烃基,取代的烃基,氧或氨基; R 1,R 2,R 3和R 4各自独立地为氢基团,烃基基团 ,取代的烃基,杂烃基,其中R 1,R 2,R 3和R 4都是 >可以相同或不同; X 1,X 2,X 3和X 4各自独立地为氢,烃基 基团,取代的烃基或肼基,其中X 1,X 2,X 3和X 4, / SUB>可以相同或不同。
    • 42. 发明申请
    • METHOD OF FORMING A TANTALUM-CONTAINING LAYER ON A SUBSTRATE
    • 在基材上形成含钽的层的方法
    • US20110244681A1
    • 2011-10-06
    • US13056934
    • 2009-07-15
    • Nicolas BlascoAnthony Correia-AnacletoAudrey PinchartAndreas ZaunerZiyun Wang
    • Nicolas BlascoAnthony Correia-AnacletoAudrey PinchartAndreas ZaunerZiyun Wang
    • H01L21/3205
    • C23C16/45553C23C16/18
    • A method for forming a tantalum-containing layer on a substrate, the method comprising at least the steps of: a) providing a vapor comprising at least one precursor compound of the formula Cp(R1)mTa(NR22)2(═NR3) (I): wherein: R1 is an organic ligand, each one independently selected in the group consisting of H, linear or branched hydrocarbyl radical comprising from 1 to 6 carbon atoms; R2 is an organic ligand, each one independently selected in the group consisting of H, linear or branched hydrocarbyl radical comprising from 1 to 6 carbon atoms; R3 is an organic ligand selected in the group consisting of H, linear or branched hydrocarbyl radical comprising from 1 to 6 carbon atoms; b) reacting the vapor comprising the at least one compound of formula (I) with the substrate, according to an atomic layer deposition process, to form a layer of a tantalum-containing complex on at least one surface of said substrate.
    • 一种在基底上形成含钽层的方法,所述方法至少包括以下步骤:a)提供包含至少一种式Cp(R1)mTa(NR22)2(= NR3)(= I):其中:R 1是有机配体,每个独立地选自H,包含1至6个碳原子的直链或支链烃基; R2是有机配体,每个独立地选自H,包含1至6个碳原子的直链或支链烃基; R3是选自H,包含1至6个碳原子的直链或支链烃基的有机配体; b)根据原子层沉积方法使包含至少一种式(I)化合物的蒸气与基材反应,以在所述基材的至少一个表面上形成含钽复合物层。
    • 44. 发明授权
    • Method of forming a tantalum-containing layer on a substrate
    • 在基板上形成含钽层的方法
    • US09085823B2
    • 2015-07-21
    • US13056934
    • 2009-07-15
    • Nicolas BlascoAnthony Correia-AnacletoAudrey PinchartAndreas ZaunerZiyun Wang
    • Nicolas BlascoAnthony Correia-AnacletoAudrey PinchartAndreas ZaunerZiyun Wang
    • H01L21/3205C23C16/455C23C16/18
    • C23C16/45553C23C16/18
    • A method for forming a tantalum-containing layer on a substrate, the method comprising at least the steps of: a) providing a vapor comprising at least one precursor compound of the formula Cp(R1)mTa(NR22)2(═NR3) (I): wherein: R1 is an organic ligand, each one independently selected in the group consisting of H, linear or branched hydrocarbyl radical comprising from 1 to 6 carbon atoms; R2 is an organic ligand, each one independently selected in the group consisting of H, linear or branched hydrocarbyl radical comprising from 1 to 6 carbon atoms; R3 is an organic ligand selected in the group consisting of H, linear or branched hydrocarbyl radical comprising from 1 to 6 carbon atoms; b) reacting the vapor comprising the at least one compound of formula (I) with the substrate, according to an atomic layer deposition process, to form a layer of a tantalum-containing complex on at least one surface of said substrate.
    • 一种在基底上形成含钽层的方法,所述方法至少包括以下步骤:a)提供包含至少一种式Cp(R1)mTa(NR22)2(= NR3)(= I):其中:R 1是有机配体,每个独立地选自H,包含1至6个碳原子的直链或支链烃基; R2是有机配体,每个独立地选自H,包含1至6个碳原子的直链或支链烃基; R3是选自H,包含1至6个碳原子的直链或支链烃基的有机配体; b)根据原子层沉积方法使包含至少一种式(I)化合物的蒸气与基材反应,以在所述基材的至少一个表面上形成含钽复合物层。
    • 48. 发明授权
    • Silicon precursors and method for low temperature CVD of silicon-containing films
    • 硅前体和含硅薄膜低温CVD的方法
    • US08227358B2
    • 2012-07-24
    • US13073112
    • 2011-03-28
    • Ziyun WangAshutosh MisraRavi Laxman
    • Ziyun WangAshutosh MisraRavi Laxman
    • H01L21/31H01L21/469C23C10/06
    • C07F7/10C07F7/0838
    • Novel silicon precursors for low temperature deposition of silicon films are described herein. The disclosed precursors possess low vaporization temperatures, preferably less than about 500° C. In addition, embodiments of the silicon precursors incorporate a —Si—Y—Si— bond, where Y may comprise an amino group, a substituted or unsubstituted hydrocarbyl group, or oxygen. In an embodiment a silicon precursor has the formula: where Y is a hydrocarbyl group, a substituted hydrocarbyl group, oxygen, or an amino group; R1, R2, R3, and R4 are each independently a hydrogen group, a hydrocarbyl group, a substituted hydrocarbyl group, a heterohydrocarbyl group, wherein R1, R2, R3, and R4 may be the same or different from one another; X1, X2, X3, and X4 are each independently, a hydrogen group, a hydrocarbyl group, a substituted hydrocarbyl group, or a hydrazine group, wherein X1, X2, X3, and X4 may be the same or different from one another.
    • 本文描述了用于低温沉积硅膜的新型硅前体。 所公开的前体具有低的汽化温度,优选小于约500℃。此外,硅前体的实施方案包含-Si-Y-Si-键,其中Y可以包含氨基,取代或未取代的烃基, 或氧气。 在一个实施方案中,硅前体具有下式:其中Y是烃基,取代的烃基,氧或氨基; R 1,R 2,R 3和R 4各自独立地为氢基,烃基,取代的烃基,杂烃基,其中R 1,R 2,R 3和R 4可以彼此相同或不同; X 1,X 2,X 3和X 4各自独立地为氢,烃基,取代的烃基或肼基,其中X 1,X 2,X 3和X 4可以彼此相同或不同。
    • 49. 发明授权
    • Silicon precursors and method for low temperature CVD of silicon-containing films
    • 硅前体和含硅薄膜低温CVD的方法
    • US08101788B2
    • 2012-01-24
    • US11695379
    • 2007-04-02
    • Ziyun WangAshutosh MisraRavi Laxman
    • Ziyun WangAshutosh MisraRavi Laxman
    • C07F7/04C07F7/08C07F7/10
    • C07F7/10C07F7/0838
    • Novel silicon precursors for low temperature deposition of silicon films are described herein. The disclosed precursors possess low vaporization temperatures, preferably less than about 500° C. In addition, embodiments of the silicon precursors incorporate a —Si—Y—Si— bond, where Y may comprise an amino group, a substituted or unsubstituted hydrocarbyl group, or oxygen. In an embodiment a silicon precursor has the formula: where Y is a hydrocarbyl group, a substituted hydrocarbyl group, oxygen, or an amino group; R1, R2, R3, and R4 are each independently a hydrogen group, a hydrocarbyl group, a substituted hydrocarbyl group, a heterohydrocarbyl group, wherein R1, R2, R3, and R4 may be the same or different from one another; X1, X2, X3, and X4 are each independently, a hydrogen group, a hydrocarbyl group, a substituted hydrocarbyl group, or a hydrazino group, wherein X1, X2, X3, and X4 may be the same or different from one another.
    • 本文描述了用于低温沉积硅膜的新型硅前体。 所公开的前体具有低的汽化温度,优选小于约500℃。此外,硅前体的实施方案包含-Si-Y-Si-键,其中Y可以包含氨基,取代或未取代的烃基, 或氧气。 在一个实施方案中,硅前体具有下式:其中Y是烃基,取代的烃基,氧或氨基; R 1,R 2,R 3和R 4各自独立地为氢基,烃基,取代的烃基,杂烃基,其中R 1,R 2,R 3和R 4可以彼此相同或不同; X 1,X 2,X 3和X 4各自独立地为氢原子,烃基,取代烃基或肼基,其中X 1,X 2,X 3和X 4可以彼此相同或不同。