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41. 外观设计

USD731505S1 Display screen with graphical user interface 有权
公开(公告)号：USD731505S1
公开(公告)日：2015-06-09
申请号：US29422107
申请日：2012-05-16
申请人： Kazuki Kyakuno , Yuuki Nakamura
设计人： Kazuki Kyakuno , Yuuki Nakamura

42. 发明申请

US20130168950A1 CURTAIN AIRBAG 有权
标题翻译： CURTAIN安全气囊
公开(公告)号：US20130168950A1
公开(公告)日：2013-07-04
申请号：US13822732
申请日：2011-08-25
申请人： Yuuki Nakamura , Yutaka Nakajima
发明人： Yuuki Nakamura , Yutaka Nakajima
IPC分类号： B60R21/232 , B60R21/233
CPC分类号： B60R21/232 , B60R21/233 , B60R21/2346 , B60R2021/23386
摘要： A curtain airbag for mitigating vehicle occupant ejection. The curtain airbag is stored in the upper portion of a side face section in the interior of a vehicle and is inflated and deployed along the side face section. The curtain airbag includes a front chamber partitioned at the frontmost side of an inflation region. The front chamber is inflated and deployed overlapping a divider-bar that separates a side window from a front pillar window.
摘要翻译：一种用于减轻车辆乘员弹出的帘式安全气囊。帘式气囊存储在车辆内部的侧面部的上部，并且沿侧面部充气展开。帘式气囊包括在充气区域的最前侧分隔开的前室。前室被充气和展开，重叠在一个将侧窗与前柱窗分开的分隔杆上。

43. 发明申请

US20130051810A1 DEVELOPING CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS 有权
标题翻译：开发盒和电子图像形成装置
公开(公告)号：US20130051810A1
公开(公告)日：2013-02-28
申请号：US13587617
申请日：2012-08-16
申请人： Yuuki Nakamura , Tetsuya Numata
发明人： Yuuki Nakamura , Tetsuya Numata
IPC分类号： G03G15/08
CPC分类号： G03G21/1647 , G03G15/0126 , G03G15/0863 , G03G21/1676
摘要： There is provided a developing cartridge that prevents forced erroneous mounting of the developing cartridge by a user and capable of easily recognizing the erroneous mounting by the user, and an electrophotographic image forming apparatus. When an erroneous mounting is performed, the developing cartridge is returned to a mounting start side from the vicinity of a mounting end position. Therefore, the user can easily recognize the erroneous mounting. By using a pressure member for urging the developing cartridge to an image carrier for detection of the erroneous mounting, deformation or damage of a main assembly or the developing cartridge can be suppressed.
摘要翻译：提供了一种显影盒，其防止使用者强迫错误地安装显影盒，并且能够容易地识别使用者的错误安装以及电子照相图像形成装置。当执行错误的安装时，显影盒从安装结束位置附近返回到安装开始侧。因此，用户可以容易地识别错误的安装。通过使用用于将显影盒推压到图像载体的压力构件来检测错误的安装，可以抑制主组件或显影盒的变形或损坏。

44. 发明授权

US08326178B2 Covering member and cartridge 有权
标题翻译：覆盖构件和墨盒
公开(公告)号：US08326178B2
公开(公告)日：2012-12-04
申请号：US12546150
申请日：2009-08-24
申请人： Yuuki Nakamura , Yoshifumi Takeyama
发明人： Yuuki Nakamura , Yoshifumi Takeyama
IPC分类号： G03G21/18 , G03G15/02 , G03G15/08
CPC分类号： G03G21/1832 , G03G21/1821
摘要： A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, includes an image bearing member; a frame; process means contactable to and actable on the image bearing member; a covering member detachably mounted to the frame to protect a surface of the image bearing member; and a spacing portion provided on the covering member and inserted between the image bearing member and the process means to space the image bearing member and the process means from each other, the spacing portion being movable relative to the covering member while being interposed between the image bearing member and the process means when the covering member is removed from the frame.
摘要翻译：可拆卸地安装到电子照相成像设备的主组件上的盒，包括图像承载部件; 一个框架; 处理装置可接触并可在图像承载部件上起作用; 可拆卸地安装到框架以保护图像承载部件的表面的覆盖部件; 以及设置在所述覆盖部件上并且插入在所述图像承载部件和所述处理装置之间以将所述图像承载部件和所述处理装置彼此间隔开的间隔部分，所述间隔部分可相对于所述覆盖部件移动，同时插入在所述图像承载构件和当覆盖构件从框架移除时的处理装置。

45. 发明申请

US20120295400A1 METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用粘合膜生产半导体芯片的方法，该方法中使用的半导体的粘合膜及其制造半导体器件的方法
公开(公告)号：US20120295400A1
公开(公告)日：2012-11-22
申请号：US13475753
申请日：2012-05-18
申请人： Keiichi Hatakeyama , Yuuki Nakamura
发明人： Keiichi Hatakeyama , Yuuki Nakamura
IPC分类号： H01L21/78 , C09J7/00
CPC分类号： H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/29006 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/8388 , H01L2224/83885 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The method for producing a semiconductor chip with an adhesive film includes preparing a laminate of a divided semiconductor wafer, an adhesive film and a dicing tape, the adhesive film having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate. The divided semiconductor wafer has been obtained by cutting the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut.
摘要翻译：制造具有粘合膜的半导体芯片的方法包括制备分割的半导体晶片，粘合剂膜和切割带的层压体，所述粘合剂膜的厚度为1-15μm，拉伸断裂伸长率为小于5％，拉伸断裂伸长率小于最大载荷伸长率的110％; 并且通过在层叠体的层叠方向上拾取多个半导体芯片来分割半导体用粘合膜。已经通过将半导体晶片切割成比半导体晶片的厚度小的半导体晶片，并且通过研磨未形成切口的半导体晶片的另一侧来达到切割而获得分割的半导体晶片。

46. 发明申请

US20120183328A1 COVER AND CARTRIDGE 有权
标题翻译：盖子和盒子
公开(公告)号：US20120183328A1
公开(公告)日：2012-07-19
申请号：US13434033
申请日：2012-03-29
申请人： Yuuki Nakamura , Yoshifumi Takeyama
发明人： Yuuki Nakamura , Yoshifumi Takeyama
IPC分类号： G03G21/18
CPC分类号： G03G21/1828
摘要： An electrophotographic image forming apparatus detachably mountable to a main assembly of the apparatus, includes a rotatable image bearing member on which a latent image is to be formed; charging means for contacting said image bearing member to charge a surface of said image bearing member; a frame supporting said image bearing member and said charging means; a covering member, demountably mounted to said frame, for protecting the surface of said image bearing member; and a spacer member including a spacing portion, movably provided on said covering member, for entering between said image bearing member and said charging means to space them therebetween, and a retaining portion, contacting said covering member when said spacing portion is not between said image bearing member and said charging means, for preventing said spacer member from disengaging from said covering member.
摘要翻译：可拆卸地安装到装置的主组件上的电子照相图像形成装置包括可在其上形成潜像的可旋转图像承载构件; 用于接触所述图像承载部件以对所述图像承载部件的表面充电的充电装置; 支撑所述图像承载部件和所述充电装置的框架; 可拆卸地安装到所述框架的用于保护所述图像承载部件的表面的覆盖部件; 以及间隔部件，包括可移动地设置在所述覆盖部件上的间隔部分，用于进入所述图像承载部件和所述充电装置之间以将它们间隔开;以及保持部分，当所述间隔部分不在所述图像之间时与所述覆盖部件接触轴承构件和所述充电装置，用于防止所述间隔构件从所述覆盖构件脱离。

47. 发明申请

US20100267199A1 METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 有权
标题翻译：用粘合膜生产半导体芯片的方法，该方法中使用的半导体的粘合膜及其制造半导体器件的方法
公开(公告)号：US20100267199A1
公开(公告)日：2010-10-21
申请号：US12682256
申请日：2008-10-07
申请人： Keiichi Hatakeyama , Yuuki Nakamura
发明人： Keiichi Hatakeyama , Yuuki Nakamura
IPC分类号： H01L21/50 , H01L21/302 , B32B5/00
CPC分类号： H01L21/67132 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0052 , H01L21/6836 , H01L21/78 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/8388 , H01L2224/83885 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10156 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The method for producing a semiconductor chip with an adhesive film of the present invention comprises steps of: preparing a laminate in which a semiconductor wafer, an adhesive film for a semiconductor and a dicing tape are laminated in that order, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load, and the semiconductor wafer having a reformed section for dividing the semiconductor wafer into the plurality of semiconductor chips, which is formed by irradiating with laser light; dividing the semiconductor wafer into the plurality of semiconductor chips without dividing the adhesive film for a semiconductor by expanding the dicing tape in a direction in which the plurality of semiconductor chips are each separated; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing a semiconductor chip with an adhesive film.
摘要翻译：本发明的具有粘合膜的半导体芯片的制造方法包括以下步骤：制备半导体晶片，半导体用粘合膜和切割带依次层叠的层叠体，半导体用粘接膜厚度为1〜15μm，断裂伸长率小于5％，拉伸断裂伸长率小于最大载荷下伸长率的110％，半导体晶片具有重整部分用于将半导体晶片分成通过用激光照射形成的多个半导体芯片; 通过在多个半导体芯片分离的方向上扩展切割带，将半导体晶片分割成多个半导体芯片，而不分割半导体用粘合膜; 并且通过在层叠体的层压方向上拾取多个半导体芯片来分割半导体用粘合膜，由此制备具有粘合剂膜的半导体芯片。

48. 发明申请

US20100120229A1 METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMICONDUCTOR, AND COMPOSITE SHEET USING THE FILM 失效
标题翻译：制造半导体芯片的方法，用于半导体的粘合膜和使用电影的复合薄片
公开(公告)号：US20100120229A1
公开(公告)日：2010-05-13
申请号：US12594634
申请日：2008-03-31
申请人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
发明人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
IPC分类号： H01L21/78 , B32B7/10
CPC分类号： C09J201/00 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D5/0082 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/29006 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , Y10T428/28 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： There is provided a method that allows semiconductor chips to be obtained from a semiconductor wafer at high yield, while sufficiently inhibiting generation of chip cracks and burrs. The method for manufacturing a semiconductor chip comprises a step of preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the semiconductor wafer being partitioned into multiple semiconductor chips and notches being formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction, and a step of stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load.
摘要翻译：提供了一种允许以高产率从半导体晶片获得半导体芯片的方法，同时充分抑制了芯片裂纹和毛刺的产生。制造半导体芯片的方法包括制备具有半导体晶片的层叠体，半导体用粘合膜和切割带，其顺序层叠，将半导体晶片划分成多个半导体芯片，并由半导体形成沟槽使得至少一部分用于半导体的粘合膜在其厚度方向上保持未切割，并且在使多个半导体芯片分开的方向上伸出切割带的步骤，以分离用于沿着凹口的半导体。半导体用粘合膜的拉伸断裂伸长率小于5％，拉伸断裂伸长率小于最大载荷下伸长率的110％。

49. 发明申请

US20080292331A1 DEVELOPING APPARATUS, PROCESS CARTRIDGE AND IMAGE FORMING APPARATUS 有权
标题翻译：开发设备，工艺盒和图像形成装置
公开(公告)号：US20080292331A1
公开(公告)日：2008-11-27
申请号：US11941495
申请日：2007-11-16
申请人： Kanji Yokomori , Yuuki Nakamura
发明人： Kanji Yokomori , Yuuki Nakamura
IPC分类号： G03G15/08
CPC分类号： G03G15/0856 , G03G15/0862 , G03G15/0889 , G03G2215/085 , G03G2215/0897
摘要： A developing apparatus usable with an electrophotographic image forming apparatus, the apparatus including a developer accommodating container, a developer chamber including a developer carrying member carrying and feeding a developer supplied from the container to develop an electrostatic latent image formed on an electrophotographic photosensitive member, a stirrer stirring the developer in the chamber and supplying the developer from the container into the chamber through an opening in the container, a wall surface, provided in the container, for being contacted by a free end portion of the stirrer while the stirrer moves, and a detector detecting a remaining amount of the developer. The position where the free end portion of the stirrer separates from the wall surface is above the detector and inside the container.
摘要翻译：一种可用于电子照相成像装置的显影装置，该装置包括显影剂容纳容器，显影室包括显影剂承载构件，显影剂承载构件承载并供给从容器供应的显影剂以显影形成在电子照相感光构件上的静电潜像搅拌器搅拌室中的显影剂并且通过容器中的开口将容器中的显影剂从容器供应到室中，设置在容器中的壁表面，用于在搅拌器移动时与搅拌器的自由端部接触;以及探测器检测显影剂的剩余量。搅拌器的自由端与壁面分离的位置位于检测器和容器内部。

50. 发明申请

US20080139107A1 Ventilator 审中-公开
标题翻译：呼吸机
公开(公告)号：US20080139107A1
公开(公告)日：2008-06-12
申请号：US11902493
申请日：2007-09-21
申请人： Shoichi Takeda , Yukito Obinata , Tsuyoshi Arai , Yuuki Nakamura
发明人： Shoichi Takeda , Yukito Obinata , Tsuyoshi Arai , Yuuki Nakamura
IPC分类号： F24F13/24
CPC分类号： F24F13/24 , F24F7/00 , F24F2007/003
摘要： A main body casing of a ventilator is formed with an outer airflow opening and an inner airflow opening and a ventilating path for connecting these airflow openings is formed in the main body casing. The ventilator ventilates a room and prevents entry of noise from outside into the room through the ventilating path. The ventilating path is bifurcated and these two ventilating paths have different lengths from each other so that a noise sound wave entering through one of the ventilating paths and a noise sound wave entering through the other ventilating path are out of phase with each other to cancel out each other's sound wave energy when the sound waves meet.
摘要翻译：通风机的主体壳体形成有外部气流开口和内部气流开口，并且用于连接这些气流开口的通风路径形成在主体壳体中。呼吸机对房间通风，防止噪音从室外通过通风道进入室内。通气路径是分叉的，这两个通风路径具有不同的长度，使得通过一个通气路径进入的噪声声波和通过另一个通风路径进入的噪声声波彼此相位抵消当声波相遇时，彼此的声波能量。

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