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    • 41. 发明授权
    • Lithographic plate materials and method for making lithographic plates using the same
    • 平版印刷材料及使用其制造平版印刷版的方法
    • US06508170B2
    • 2003-01-21
    • US09814112
    • 2001-03-22
    • Toshimichi KatsuokaJunichi NoudaHironori Sato
    • Toshimichi KatsuokaJunichi NoudaHironori Sato
    • B41N114
    • B41C1/1066
    • There is provided a lithographic plate material which can be desensitized by distilled water or a fountain solution used for other lithographic plates, without desensitizing using an etching solution, and with less scumming in non-image portions of the print. The lithographic plate material has an image-receptive layer formed on a support and containing polyvinyl alcohol cross-linked by tetra alkoxy silane hydroxylate, titanium oxide microparticles, and silica having an average particle size of 1 nm to 100 nm. The image-receptive layer has a surface with an arithmetic mean roughness of not less than 0.40 &mgr;m and less than 1.20 &mgr;m, a contact angle of less than 50 degrees with distilled water at room temperature, and ink-receptiveness for hot-melt and lipophilic ink.
    • 提供了一种平版印刷材料,其可以通过蒸馏水或用于其它平版印刷版的润版液进行脱敏,而不会使用蚀刻溶液脱敏,并且在印刷品的非图像部分中具有较少的浮渣。 平版印刷版材料具有在载体上形成的图像接收层,并且含有通过四烷氧基硅烷羟基化物,氧化钛微粒和平均粒径为1nm至100nm的二氧化硅交联的聚乙烯醇。 图像接收层具有算术平均粗糙度不小于0.40μm和小于1.20μm的表面,在室温下与蒸馏水接触角小于50度,以及用于热熔和亲脂性的油墨接受性 墨水。
    • 42. 发明授权
    • Wiring board
    • 接线板
    • US08809692B2
    • 2014-08-19
    • US13325431
    • 2011-12-14
    • Erina YamadaKazunaga HigoHironori Sato
    • Erina YamadaKazunaga HigoHironori Sato
    • H05K1/09H01L23/15H01L23/498
    • H01L23/15H01L23/49816H01L23/49894H01L2924/0002H01L2924/00
    • A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may include a conductor layer, a solder resist layer laminated thereon, and a conductor post provided at least within the through-hole and that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder and includes a lower conductor post located within the through-hole and an upper conductor post located above the lower conductor post and projected outside the layer; the lower conductor post includes an external alloy layer disposed on an external side surface thereof; and the conductor post is brought into intimate contact with an internal side surface of the through-hole via the external alloy layer.
    • 提供了包括对应于高密度封装的导体柱的布线板。 布线板可以包括导体层,层压在其上的阻焊层,以及至少设置在通孔内的导体柱,并且电连接到布置在设置在通孔中的通孔的下部的导体层 在该层中,其中阻焊层包含热固性树脂; 所述导体柱包括锡,铜或焊料,并且包括位于所述通孔内的下导体柱和位于所述下导体柱上方并突出在所述层外侧的上导体柱; 下导体柱包括设置在其外侧表面上的外部合金层; 并且导体柱经由外部合金层与通孔的内侧表面紧密接触。