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    • 45. 发明授权
    • Heat dissipation device and power module
    • 散热装置和电源模块
    • US07961474B2
    • 2011-06-14
    • US12684160
    • 2010-01-08
    • Tadafumi YoshidaHiroki Tashiro
    • Tadafumi YoshidaHiroki Tashiro
    • H05K7/20H01L23/36
    • F28F1/126F28F3/025F28F2265/26H01L2924/0002H05K7/209H01L2924/00
    • A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.
    • 在其另一面上设置有在顶板和底板之间夹置并接合到散热片的散热器,该绝缘基板具有设置在其一个面上的半导体元件。 散热片是波纹状散热片,其包括第一区域,该第一区域包括接合到底板的接合峰部,并且具有基本上等于顶板和底板之间的距离的振幅方向的高度,第二区域 区域,其包括与底板隔开预定间隙的非接合峰部分,并且具有小于顶板和底板之间的距离的振幅方向上的高度。