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    • 45. 发明授权
    • Pass bandwidth control in decoupled stacked bulk acoustic resonator devices
    • 在解耦堆叠体声波谐振器装置中通过带宽控制
    • US07362198B2
    • 2008-04-22
    • US10965449
    • 2004-10-13
    • John D. Larson, IIIStephen L. Ellis
    • John D. Larson, IIIStephen L. Ellis
    • H03H9/54
    • H03H9/605H03H9/02102H03H9/132H03H9/175H03H9/584H03H9/587H03H9/589
    • The decoupled stacked bulk acoustic resonator (DSBAR) device has a lower film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and an acoustic decoupler between the FBARs. Each of the FBARs has opposed planar electrodes and a layer of piezoelectric material between the electrodes. The acoustic decoupler has acoustic decoupling layers of acoustic decoupling materials having different acoustic impedances. The acoustic impedances and thicknesses of the acoustic decoupling layers determine the acoustic impedance of the acoustic decoupler, and, hence, the pass bandwidth of the DSBAR device. Process-compatible acoustic decoupling materials can then be used to make acoustic decouplers with acoustic impedances (and pass bandwidths) that are not otherwise obtainable due to the lack of process-compatible acoustic decoupling materials with such acoustic impedances.
    • 解耦堆叠体声波谐振器(DSBAR)器件具有较低的膜体声波谐振器(FBAR),堆叠在下FBAR上的上FBAR和FBAR之间的声耦合器。 每个FBAR具有相对的平面电极和电极之间的压电材料层。 声解耦器具有具有不同声阻抗的声去耦材料的声去耦层。 声学解耦层的声阻抗和厚度决定了声耦合器的声阻抗,并因此决定了DSBAR器件的通带宽度。 然后,由于缺乏具有这种声阻抗的工艺兼容的声学解耦材料,因此可以使用与工艺兼容的声学解耦材料来制造具有声阻抗(和通过带宽)的声学去耦器。
    • 47. 发明授权
    • Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth
    • 具有可控通带宽度的堆叠体声波谐振器带通滤波器
    • US07019605B2
    • 2006-03-28
    • US10699289
    • 2003-10-30
    • John D. Larson, III
    • John D. Larson, III
    • H03H9/54
    • H03H9/587H03H9/132H03H9/584H03H9/605Y10T29/42Y10T29/49005Y10T29/49117
    • The band-pass filter has a stacked pair of film bulk acoustic resonators (FBARs) and an acoustic decoupler between the FBARs. Each of the FBARs has opposed planar electrodes and a layer of piezoelectric material between the electrodes. The acoustic decoupler has a single layer of acoustic decoupling material having a nominal thickness equal to an odd integral multiple of one quarter of the wavelength in the acoustic decoupling material of an acoustic wave having a frequency equal to the center frequency. The acoustic decoupling material comprises plastic. The acoustic decoupler controls the coupling of acoustic energy between the FBARs. Specifically, the acoustic decoupler couples less acoustic energy between the FBARs than would be coupled by direct contact between the FBARs. The reduced acoustic coupling gives the band-pass filter desirable in-band and out-of-band properties.
    • 带通滤波器具有叠层的薄膜体声共振器(FBAR)和FBAR之间的声耦合器。 每个FBAR具有相对的平面电极和电极之间的压电材料层。 声学解耦器具有单层声学解耦材料,其具有等于具有等于中心频率的频率的声波的声学去耦材料中四分之一波长的奇数整数倍的标称厚度。 声学解耦材料包括塑料。 声耦合器控制FBAR之间的声能耦合。 具体来说,声耦合器耦合FBAR之间较少的声能,而不是FBAR之间的直接接触。 减少的声耦合给出带通滤波器所需的带内和带外特性。
    • 49. 发明授权
    • Backing for acoustic transducer array
    • 支撑声换能器阵列
    • US5267221A
    • 1993-11-30
    • US835157
    • 1992-02-13
    • Miller David G.John D. Larson, III
    • Miller David G.John D. Larson, III
    • A61B8/00B06B1/06G01N29/24G10K11/00H04R17/00
    • B06B1/0622G10K11/002
    • An acoustic transducer assembly is provided having a one or two dimensional array of transducer elements, an electrical circuit element such as a circuit element and a backing for interconnecting transducer elements to corresponding contacts or traces of the circuit element. The backing is a block of acoustic attenuating material having a conductor extending therethrough between each transducer element and the corresponding circuit contact. The block has acoustic properties, including acoustic impedance and acoustic velocity, to achieve a desired degree of acoustic match with the transducer elements and/or to permit coupling of acoustic energy from the conductors into the block. The block may be of a single material or may have different volumes of two or more materials having different acoustic properties to achieve desired results. Multiple thin conductors or conducting fibers or foils may be utilized for each transducer element to reduce or eliminate acoustic coupling into the conductors. Acoustic coupling into the conductors may also be reduced by providing off-center contact with the transducer elements. Removal of acoustic energy from the conductors may be facilitated by covering each conductor with a material having a lower acoustic velocity than the conductor, which material is impedance matched to at least a portion of adjacent backing material.