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    • 41. 发明授权
    • Wiring board
    • 接线板
    • US08809692B2
    • 2014-08-19
    • US13325431
    • 2011-12-14
    • Erina YamadaKazunaga HigoHironori Sato
    • Erina YamadaKazunaga HigoHironori Sato
    • H05K1/09H01L23/15H01L23/498
    • H01L23/15H01L23/49816H01L23/49894H01L2924/0002H01L2924/00
    • A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may include a conductor layer, a solder resist layer laminated thereon, and a conductor post provided at least within the through-hole and that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder and includes a lower conductor post located within the through-hole and an upper conductor post located above the lower conductor post and projected outside the layer; the lower conductor post includes an external alloy layer disposed on an external side surface thereof; and the conductor post is brought into intimate contact with an internal side surface of the through-hole via the external alloy layer.
    • 提供了包括对应于高密度封装的导体柱的布线板。 布线板可以包括导体层,层压在其上的阻焊层,以及至少设置在通孔内的导体柱,并且电连接到布置在设置在通孔中的通孔的下部的导体层 在该层中,其中阻焊层包含热固性树脂; 所述导体柱包括锡,铜或焊料,并且包括位于所述通孔内的下导体柱和位于所述下导体柱上方并突出在所述层外侧的上导体柱; 下导体柱包括设置在其外侧表面上的外部合金层; 并且导体柱经由外部合金层与通孔的内侧表面紧密接触。