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41. 外观设计

USD323507S Remote controller for tape recorder 失效
公开(公告)号：USD323507S
公开(公告)日：1992-01-28
申请号：US345540
申请日：1989-04-28
申请人： Masafumi Ito , Koji Suzuki , Shigeru Hasegawa , Minoru Sube , Katsuhiro Takashima
设计人： Masafumi Ito , Koji Suzuki , Shigeru Hasegawa , Minoru Sube , Katsuhiro Takashima

42. 外观设计

USD321191S Digital audio disc player 失效
公开(公告)号：USD321191S
公开(公告)日：1991-10-29
申请号：US387633
申请日：1989-07-31
申请人： Masafumi Ito , Shigeru Hasegawa , Minoru Sube , Hiroyuki Watanabe
设计人： Masafumi Ito , Shigeru Hasegawa , Minoru Sube , Hiroyuki Watanabe

43. 外观设计

USD321189S Digital audio disc player 失效
公开(公告)号：USD321189S
公开(公告)日：1991-10-29
申请号：US381162
申请日：1989-07-18
申请人： Masafumi Ito , Shigeru Hasegawa , Minoru Sube
设计人： Masafumi Ito , Shigeru Hasegawa , Minoru Sube

44. 外观设计

USD318664S Digital audio disc player 失效
公开(公告)号：USD318664S
公开(公告)日：1991-07-30
申请号：US224799
申请日：1988-07-25
申请人： Masafumi Ito , Shigeru Hasegawa , Minoru Sube
设计人： Masafumi Ito , Shigeru Hasegawa , Minoru Sube

45. 发明授权

US4014031A Electrophotographic typesetting method and apparatus therefor 失效
标题翻译：电子显示方法及其设备
公开(公告)号：US4014031A
公开(公告)日：1977-03-22
申请号：US609041
申请日：1975-08-29
申请人： Shigeru Hasegawa , Katsuyoshi Takai , Hiroharu Yamazaki , Sueo Kikkawa , Eizo Suyama
发明人： Shigeru Hasegawa , Katsuyoshi Takai , Hiroharu Yamazaki , Sueo Kikkawa , Eizo Suyama
IPC分类号： B41B17/00 , B41B17/06 , G03G15/22 , B41B13/00 , B41B21/24
CPC分类号： B41B17/06
摘要： A method and apparatus for making monocolor prints in a desired color wherein a web of photoconductive material is supplied as a photosensitive material, a desired length of segment is sheared from said web of photoconductive material, said material segment is electrically charged, the charged material is exposed by a phototypesetting machine to light through desired characters, numerals and/or other symbols in an original plate of said machine, and said exposed material is developed by the use of electrophotographic toner having a desired color.

46. 发明申请

US20140138707A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20140138707A1
公开(公告)日：2014-05-22
申请号：US14131581
申请日：2012-07-05
申请人： Takayoshi Miki , Yasushi Nakayama , Takeshi Oi , Kazuhiro Tada , Shiori Idaka , Shigeru Hasegawa , Tomohiro Kobayashi , Yukio Nakashima
发明人： Takayoshi Miki , Yasushi Nakayama , Takeshi Oi , Kazuhiro Tada , Shiori Idaka , Shigeru Hasegawa , Tomohiro Kobayashi , Yukio Nakashima
IPC分类号： H01L25/18 , H01L23/28
CPC分类号： H01L23/28 , H01L23/3121 , H01L23/3135 , H01L23/36 , H01L23/3735 , H01L25/072 , H01L25/18 , H01L2224/48227 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A power semiconductor module is provided which is capable of keeping low the degrees of increases in temperatures of wide bandgap semiconductor elements, reducing the degree of increase in chip's total surface area of the wide bandgap semiconductor elements, and being fabricated at low costs, when Si semiconductor elements and the wide bandgap semiconductor elements are placed within one and the same power semiconductor module. The Si semiconductor elements are placed in a central region of the power semiconductor module, and the wide bandgap semiconductor elements are placed on opposite sides relative to the central region or in edge regions surrounding the central region.
摘要翻译：提供功率半导体模块，其能够保持宽带隙半导体元件的温度升高程度，降低宽带隙半导体元件的芯片总表面积的增加程度，并且以低成本制造，当Si 半导体元件和宽带隙半导体元件放置在同一个功率半导体模块内。 Si半导体元件被放置在功率半导体模块的中心区域中，并且宽带隙半导体元件相对于中心区域或围绕中心区域的边缘区域放置在相对侧上。

47. 发明授权

US07196412B2 Multi-chip press-connected type semiconductor device 有权
标题翻译：多芯片压接式半导体器件
公开(公告)号：US07196412B2
公开(公告)日：2007-03-27
申请号：US10926071
申请日：2004-08-26
申请人： Shigeru Hasegawa , Hideaki Kitazawa
发明人： Shigeru Hasegawa , Hideaki Kitazawa
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L25/072 , H01L23/051 , H01L23/36 , H01L23/492 , H01L2924/0002 , H01L2924/13055 , H01L2924/00
摘要： A multi-chip press-connected type semiconductor device comprises: a plurality of active element chips to control an electric current flowing in one direction; a plurality of diode chips that transmit the current in a direction opposite to the current transmitting direction of said active element chip; and electrode plates for said active element chip and for said diode chip, said electrode plates pressing from above and under with said plurality of active element chips and said plurality of diode chips being interposed therebetween; wherein said diode chips are disposed in all of outermost peripheral chip positions with no-existence of other chips adjacent to at least one side of a chip in a chip disposing region, and are disposed in internal layout positions surrounded with the outermost peripheral chip positions, and said diode chips to be disposed in the internal layout positions are arranged in order of a total number of other chips from the smallest that exist adjacently to at least one of a side and a vertex of a chip.
摘要翻译：多芯片压接型半导体器件包括：多个有源元件芯片，用于控制沿一个方向流动的电流; 多个二极管芯片，其在与所述有源元件芯片的当前发送方向相反的方向上传输电流; 以及用于所述有源元件芯片和所述二极管芯片的电极板，所述电极板通过所述多个有源元件芯片从所述多个有源元件芯片和所述多个二极管芯片的上下按压; 其中所述二极管芯片设置在所有最外周芯片位置，在芯片布置区域中不存在与芯片的至少一侧相邻的其它芯片，并且被布置在被最外周芯片位置包围的内部布局位置，并且要布置在内部布局位置的所述二极管芯片按照与芯片的侧面和顶点中的至少一个相邻存在的最小的其他芯片的总数的顺序排列。

48. 外观设计

USD517040S1 Digital audio disc player with radio 失效
标题翻译：数字音频光盘播放器带收音机
公开(公告)号：USD517040S1
公开(公告)日：2006-03-14
申请号：US29186601
申请日：2003-07-21
申请人： Shigeru Hasegawa , Hiroyuki Watanabe
设计人： Shigeru Hasegawa , Hiroyuki Watanabe

49. 发明申请

US20050171834A1 Work status prediction apparatus, method of predicting work status, and work status prediction program 审中-公开
标题翻译：工作状态预测装置，预测工作状态的方法和工作状态预测程序
公开(公告)号：US20050171834A1
公开(公告)日：2005-08-04
申请号：US11046513
申请日：2005-01-28
申请人： Takeshi Yokota , Shigeru Hasegawa , Makoto Kudoh , Kiyoshi Shimoda
发明人： Takeshi Yokota , Shigeru Hasegawa , Makoto Kudoh , Kiyoshi Shimoda
IPC分类号： G05B19/418 , G06Q10/00 , G06Q10/06 , G06Q10/10 , G06Q50/00 , G06Q50/04 , G06F17/60
CPC分类号： G06Q10/00 , G06Q10/06312 , G06Q10/06314 , G06Q10/06315 , G06Q10/0637 , Y02P90/20
摘要： To predict a future work status, a variation amount in working efficiency set according to progress of a work regarding the workload and a variation amount in a work resource are considered, and the working efficiency is compensated according compensation of a work resource amount. Data of variation patterns of the working efficiency and the number of workers are previously defined and stored. A variation pattern for each work is selected from the variation pattern data on the basis of a work schedule data stored in the work schedule data storing section. Variation of the workload resource, the workload, and the working efficiency are stored. The prediction result is displayed. Upon excess and lack in the prediction workload over the scheduled workload in a period may be transferred from that period to the next period and from the next to that period, respectively.
摘要翻译：为了预测未来的工作状态，考虑根据工作量的工作进度设定的工作效率的变化量和工作资源的变化量，根据工作资源量的补偿来补偿工作效率。先前定义并存储了工作效率和工作人员数量变化模式的数据。根据存储在工作调度数据存储部分中的工作调度数据，从变化模式数据中选择每个工作的变化模式。存储工作负载资源的变化，工作负载和工作效率。显示预测结果。在一段时间内，由于预计工作负荷超出预期工作量，而且预计工作量不足，则可能会从该期间分别转移到下一个时期，也可能从下一个时期转移到该期间。

50. 发明申请

US20050087865A1 Multi-chip press-connected type semiconductor device 有权
标题翻译：多芯片压接式半导体器件
公开(公告)号：US20050087865A1
公开(公告)日：2005-04-28
申请号：US10926071
申请日：2004-08-26
申请人： Shigeru Hasegawa , Hideaki Kitazawa
发明人： Shigeru Hasegawa , Hideaki Kitazawa
IPC分类号： H01L23/051 , H01L23/36 , H01L23/492 , H01L25/07 , H01L25/18 , H01L27/04 , H01L29/78 , H01L23/02
CPC分类号： H01L25/072 , H01L23/051 , H01L23/36 , H01L23/492 , H01L2924/0002 , H01L2924/13055 , H01L2924/00
摘要： A multi-chip press-connected type semiconductor device comprises: a plurality of active element chips to control an electric current flowing in one direction; a plurality of diode chips that transmit the current in a direction opposite to the current transmitting direction of said active element chip; and electrode plates for said active element chip and for said diode chip, said electrode plates pressing from above and under with said plurality of active element chips and said plurality of diode chips being interposed therebetween; wherein said diode chips are disposed in all of outermost peripheral chip positions with no-existence of other chips adjacent to at least one side of a chip in a chip disposing region, and are disposed in internal layout positions surrounded with the outermost peripheral chip positions, and said diode chips to be disposed in the internal layout positions are arranged in order of a total number of other chips from the smallest that exist adjacently to at least one of a side and a vertex of a chip.
摘要翻译：多芯片压接型半导体器件包括：多个有源元件芯片，用于控制沿一个方向流动的电流; 多个二极管芯片，其在与所述有源元件芯片的当前发送方向相反的方向上传输电流; 以及用于所述有源元件芯片和所述二极管芯片的电极板，所述电极板通过所述多个有源元件芯片从所述多个有源元件芯片和所述多个二极管芯片的上下按压; 其中所述二极管芯片设置在所有最外周芯片位置，在芯片布置区域中不存在与芯片的至少一侧相邻的其它芯片，并且被布置在被最外周芯片位置包围的内部布局位置，并且要布置在内部布局位置的所述二极管芯片按照与芯片的侧面和顶点中的至少一个相邻存在的最小的其他芯片的总数的顺序排列。

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