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    • 41. 发明授权
    • Semiconductor device having an arrangement for preventing operational
errors
    • 具有用于防止操作错误的装置的半导体装置
    • US4691304A
    • 1987-09-01
    • US739092
    • 1985-05-30
    • Ryoichi HoriKiyoo Itoh
    • Ryoichi HoriKiyoo Itoh
    • G11C11/413G05F3/20G06F1/26G11C7/02G11C11/407G11C11/408H01L27/02H02M3/07G11C7/00
    • H01L27/0218G05F3/205H02M3/07
    • This invention relates to a semiconductor device formed on a semiconductor chip which is provided with at least a voltage transformation arrangement for transforming an external power supply voltage into an internal power supply voltage. At least a portion of circuits formed in the chip operate by using the internal power supply voltage rather than the external power supply voltage. Semiconductor devices, in particular DRAMs (dynamic random access memories), in which said internal power supply voltage is supplied are controlled so that the starting time of the internal power supply voltage at the moment of the switch-on of the external power supply is later than the starting time of the external power supply voltage, and/or the time necessary for the internal power supply voltage to increase to a predetermined operational level at said moment is longer than that required for said external power supply voltage to increase to a predetermined operational level.
    • 本发明涉及形成在半导体芯片上的半导体器件,该半导体器件至少具有用于将外部电源电压变换为内部电源电压的电压变换装置。 芯片中形成的至少一部分电路通过使用内部电源电压而不是外部电源电压来工作。 控制提供所述内部电源电压的半导体装置,特别是DRAM(动态随机存取存储器),使得外部电源的接通时的内部电源电压的起始时间稍晚 比外部电源电压的开始时间和/或内部电源电压在所述时刻增加到预定操作电平所需的时间长于所述外部电源电压所需的时间增加到预定的操作 水平。
    • 42. 发明授权
    • Monolithic semiconductor memory
    • 单片半导体存储器
    • US4590588A
    • 1986-05-20
    • US515519
    • 1983-07-20
    • Kiyoo ItohRyoichi Hori
    • Kiyoo ItohRyoichi Hori
    • G11C5/06G11C7/10G11C7/18G11C5/02
    • G11C7/18G11C5/063G11C7/10G11C7/1006
    • A semiconductor memory is disclosed having data lines divided lengthwise, which data lines cross word lines in a memory cell array and are selectively coupled to memory cells. A plurality of second data lines are arranged, one for each of predetermined groups of the data lines, to exchange data through first switches. Also one or more third data lines are arranged orthogonally to the second data lines to exchange data with the second data lines through second switches. Read/write controllers are coupled to the third data lines. Data is read and written for desired memory cells by selective drive of the word lines and the first and second switches.
    • 公开了半导体存储器,其具有纵向分割的数据线,哪些数据线与存储单元阵列中的字线交叉并且选择性地耦合到存储器单元。 布置多个第二数据线,每个数据线的预定组中的每一个通过第一开关交换数据。 还有一个或多个第三数据线与第二数据线正交地布置,以通过第二开关与第二数据线交换数据。 读/写控制器耦合到第三条数据线。 通过选择性地驱动字线和第一和第二开关来读取和写入所需存储单元的数据。
    • 44. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06740958B2
    • 2004-05-25
    • US10115101
    • 2002-04-04
    • Shinji NakazatoHideaki UchidaYoshikazu SaitoMasahiro YamamuraYutaka KobayashiTakahide IkedaRyoichi HoriGoro KitsukawaKiyoo ItohNobuo TanbaTakao WatanabeKatsuhiro ShimohigashiNoriyuki Homma
    • Shinji NakazatoHideaki UchidaYoshikazu SaitoMasahiro YamamuraYutaka KobayashiTakahide IkedaRyoichi HoriGoro KitsukawaKiyoo ItohNobuo TanbaTakao WatanabeKatsuhiro ShimohigashiNoriyuki Homma
    • H01L2900
    • H01L27/0623H01L27/0214H01L27/0218H01L27/0922H01L27/105H01L27/10805
    • Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements. As a second aspect of the present invention, first carrier absorbing areas (to absorb minority carriers) are located between the memory array and the switching circuit of the peripheral circuit, and second carrier absorbing areas are provided to surround input protective elements of the device. As a third embodiment of the present invention, a plurality of isolation regions of the same conductivity type are provided, with unequal voltages applied to these isolation regions, or unequal voltages applied to the substrate, on the one hand, and to these isolation regions, on the other.
    • 公开了一种半导体器件,例如半导体存储器件,其结构可以避免少数载流子从半导体衬底侵入形成在衬底上的器件的部件。 半导体存储器件例如可以是SRAM或DRAM,并且在衬底上包括存储器阵列和外围电路。 在本发明的一个方面中,在外围电路和存储器阵列中的至少一个之下提供与衬底相同的导电类型但具有比衬底的杂质浓度更高的杂质浓度的掩埋层。 另外的区域可以例如从掩埋层延伸到半导体衬底的表面,掩埋层和组合的另外的区域用作屏蔽以防止少数载流子穿透到器件元件。 作为本发明的第二方面,第一载流子吸收区域(以吸收少数载流子)位于存储器阵列和外围电路的开关电路之间,并且第二载流子吸收区域被设置为环绕该器件的输入保护元件。 作为本发明的第三实施例,提供了相同导电类型的多个隔离区域,一方面施加到这些隔离区域的不同电压或施加到基板的不同电压以及这些隔离区域, 在另一。
    • 50. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US5148255A
    • 1992-09-15
    • US645351
    • 1991-01-23
    • Shinji NakazatoHideaki UchidaYoshikazu SaitoMasahiro YamamuraYutaka KobayashiTakahide IkedaRyoichi HoriGoro KitsukawaKiyoo ItohNobuo TanbaTakao WatanabeKatsuhiro ShimohigashiNoriyuki Homma
    • Shinji NakazatoHideaki UchidaYoshikazu SaitoMasahiro YamamuraYutaka KobayashiTakahide IkedaRyoichi HoriGoro KitsukawaKiyoo ItohNobuo TanbaTakao WatanabeKatsuhiro ShimohigashiNoriyuki Homma
    • H01L27/02H01L27/06H01L27/092H01L27/105H01L27/108
    • H01L27/10805H01L27/0214H01L27/0623H01L27/0922H01L27/0218H01L27/105
    • Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements. As a second aspect of the present invention, first carrier absorbing areas (to absorb minority carriers) are located between the memory array and the switching circuit of the peripheral circuit, and second carrier absorbing areas are provided to surround input protective elements of the device. As a third embodiment of the present invention, a plurality of isolation regions of the same conductivity type are provided, with unequal voltages applied to these isolation regions, or unequal voltages applied to the substrate, on the one hand, and to these isolation regions, on the other.
    • 公开了一种半导体器件,例如半导体存储器件,其结构可以避免少数载流子从半导体衬底侵入形成在衬底上的器件的部件。 半导体存储器件例如可以是SRAM或DRAM,并且在衬底上包括存储器阵列和外围电路。 在本发明的一个方面中,在外围电路和存储器阵列中的至少一个之下提供与衬底相同的导电类型但具有比衬底的杂质浓度更高的杂质浓度的掩埋层。 另外的区域可以例如从掩埋层延伸到半导体衬底的表面,掩埋层和组合的另外的区域用作屏蔽以防止少数载流子穿透到器件元件。 作为本发明的第二方面,第一载流子吸收区域(以吸收少数载流子)位于存储器阵列和外围电路的开关电路之间,并且第二载流子吸收区域被设置为环绕该器件的输入保护元件。 作为本发明的第三实施例,提供了相同导电类型的多个隔离区域,一方面施加到这些隔离区域的不同电压或施加到基板的不同电压以及这些隔离区域, 在另一。