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41. 发明授权

US07097900B2 Sheet and electronic component packaging container 有权
标题翻译：板和电子元件包装容器
公开(公告)号：US07097900B2
公开(公告)日：2006-08-29
申请号：US10343308
申请日：2002-06-14
申请人： Minoru Oda , Katsuhisa Ogita , Takeshi Miyakawa , Tetsuo Fujimura , Mikio Shimizu
发明人： Minoru Oda , Katsuhisa Ogita , Takeshi Miyakawa , Tetsuo Fujimura , Mikio Shimizu
IPC分类号： B32B27/18 , B32B27/30 , B32B27/32 , B32B33/00 , B65D85/00
CPC分类号： B32B27/08 , Y10T428/24942 , Y10T428/265 , Y10T428/31507 , Y10T428/3154 , Y10T428/31544 , Y10T428/31855 , Y10T428/31935 , Y10T428/31938
摘要： In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.
摘要翻译：为了防止电子部件的静电损伤，与电子部件接触的容器表面的层是具有比较高的表面电阻率的层，具有比层压在其下方的电导率高的层，表面层的表面电阻率高于其下面的层的表面电阻率。认为在具有这种结构的电子部件包装容器中，电气部件上带电的静电从电子部件逐渐排出到电子部件包装容器的表面而不会突然放电，从而防止静电损伤。表面层优选地包括在一系列摩擦带电中靠近电子部件的材料。

42. 发明授权

US07026260B2 Method of manufacturing semiconductor device using thermal treatment that features lower speed wafer rotation at low temperatures and higher speed wafer rotation at high temperatures 失效
标题翻译：使用热处理的半导体器件的制造方法，其在低温下具有较低速度的晶片旋转，并且在高温下具有较高速度的晶片旋转
公开(公告)号：US07026260B2
公开(公告)日：2006-04-11
申请号：US10755395
申请日：2004-01-13
申请人： Mikio Shimizu
发明人： Mikio Shimizu
IPC分类号： H01L21/477
CPC分类号： H01L21/67248 , H01L21/324 , H01L21/8238
摘要： A technique capable of preventing breakage of a semiconductor wafer in a single-wafer RTP apparatus is provided. Open-loop control is made in a temperature rising process, in which the temperature of the semiconductor wafer is 500° C. or lower, and a revolution speed of the semiconductor wafer is relatively reduced to 100 rpm or lower even if the bowing of the semiconductor wafer occurs. Therefore, a centrifugal force exerted on the semiconductor wafer is reduced, whereby it becomes possible to prevent the semiconductor wafer from dropping from a stage of the single-wafer RTP apparatus. Additionally, closed-loop control is made in the temperature rising process, in which the temperature of the semiconductor wafer is higher than 500° C., and in a main treatment process, and further the revolution speed of the semiconductor wafer is relatively increased. By so doing, the almost uniform in-plane temperature of the semiconductor wafer can be achieved and the bowing of the semiconductor wafer can be prevented.
摘要翻译：提供了能够防止单晶片RTP装置中的半导体晶片破损的技术。在半导体晶片的温度为500℃以下的升温工序中进行开环控制，即使将半导体晶片的弯曲值设定为100rpm以下，半导体晶片的旋转速度相对降低至100rpm以下发生半导体晶片。因此，减小了施加在半导体晶片上的离心力，从而可以防止半导体晶片从单晶片RTP装置的阶段落下。此外，在半导体晶片的温度高于500℃的升温工艺中进行闭环控制，在主处理工艺中，进一步提高半导体晶片的转速。通过这样做，可以实现半导体晶片的几乎均匀的面内温度，并且可以防止半导体晶片的弯曲。

43. 发明授权

US06759130B2 Resin composition, molded product thereof and electroconductive sheet 有权
公开(公告)号：US06759130B2
公开(公告)日：2004-07-06
申请号：US10235631
申请日：2002-09-06
申请人： Kazuhiro Kosugi , Takeshi Miyakawa , Masanori Higano , Mikio Shimizu
发明人： Kazuhiro Kosugi , Takeshi Miyakawa , Masanori Higano , Mikio Shimizu
IPC分类号： B32B900
CPC分类号： B32B27/08 , B32B27/20 , B32B27/302 , B32B27/36 , B32B27/365 , B32B2307/202 , B32B2307/538 , B32B2313/04 , B32B2325/00 , B32B2355/02 , B32B2369/00 , B32B2439/06 , B42D1/08 , Y10S428/902 , Y10T428/30 , Y10T428/31504 , Y10T428/31507 , Y10T428/31855 , Y10T428/31935 , Y10T428/31938
摘要： An electroconductive sheet comprising a substrate layer of a thermoplastic resin comprising an acrylonitrile-butadiene-styrene copolymer type resin and/or a polystyrene type resin and having laminated on at least one side of the substrate layer, a surface layer of an electroconductive resin composition comprising a polycarbonate type resin and from 5 to 50 wt % of carbon black.

44. 发明授权

US06488775B2 Semiconductor-manufacturing device 失效
公开(公告)号：US06488775B2
公开(公告)日：2002-12-03
申请号：US09860800
申请日：2001-05-18
申请人： Akira Shimizu , Mikio Shimizu
发明人： Akira Shimizu , Mikio Shimizu
IPC分类号： C23C1600
CPC分类号： H01L21/67017 , C23C16/455 , C23C16/45578
摘要： A batch-processing type semiconductor-manufacturing device includes a cylindrical reaction chamber with its upper end closed and its bottom end open, a substrate-supporting boat loading multiple substrates, which are inserted within the reaction chamber, and an injector for spraying a reaction gas to the substrates, which injector is provided parallel to the substrate-supporting boat within the reaction chamber. The injector is supported by an injector holder, and both the injector and the injector holder are fitted by a male-female fitting structure.

45. 发明授权

US06485832B1 Resin composition, molded product thereof and electroconductive sheet 有权
标题翻译：树脂组合物，其成型品和导电片
公开(公告)号：US06485832B1
公开(公告)日：2002-11-26
申请号：US09926775
申请日：2001-12-18
申请人： Kazuhiro Kosugi , Takeshi Miyakawa , Masanori Higano , Mikio Shimizu
发明人： Kazuhiro Kosugi , Takeshi Miyakawa , Masanori Higano , Mikio Shimizu
IPC分类号： B32B2736
CPC分类号： B32B27/08 , B32B27/20 , B32B27/302 , B32B27/36 , B32B27/365 , B32B2307/202 , B32B2307/538 , B32B2313/04 , B32B2325/00 , B32B2355/02 , B32B2369/00 , B32B2439/06 , B42D1/08 , Y10S428/902 , Y10T428/30 , Y10T428/31504 , Y10T428/31507 , Y10T428/31855 , Y10T428/31935 , Y10T428/31938
摘要： An electroconductive sheet comprising a substrate layer of a thermoplastic resin comprising an acrylonitrile-butadiene-styrene copolymer type resin and/or a polystyrene type resin and having laminated on at least one side of the substrate layer, a surface layer of an electroconductive resin composition comprising a polycarbonate type resin and from 5 to 50 wt % of carbon black.
摘要翻译：一种导电片，其包含由包含丙烯腈 - 丁二烯 - 苯乙烯共聚物型树脂和/或聚苯乙烯类树脂的热塑性树脂的基材层，并且层压在基材层的至少一侧上，导电树脂组合物的表面层包含聚碳酸酯型树脂和5〜50重量％的炭黑。

46. 发明授权

US06402208B1 Latch for oven 失效
标题翻译：锁定烤箱
公开(公告)号：US06402208B1
公开(公告)日：2002-06-11
申请号：US09456147
申请日：1999-12-07
申请人： Mikio Shimizu
发明人： Mikio Shimizu
IPC分类号： E05C1910
CPC分类号： F24C15/022 , E05B15/0086 , E05B2047/0069 , E05C5/00 , Y10S292/49 , Y10S292/66 , Y10S292/69 , Y10T292/0929 , Y10T292/0932 , Y10T292/1039
摘要： A latch for an oven comprises a support plate mounted within the oven. A bracket member is pivotably supported on the support plate. A handle is fixed to the bracket member and is manually operable to move the latch between the latching and unlatching positions. A latch arm is movably supported on the support plate and connected to the bracket member to be moved between the latching and unlatching positions in accordance with the movement of the bracket member. A spring is connected between the support plate and the bracket member for biasing the bracket member toward the latching or unlatching position, selectively. First and second arcuate guide projections are integrally formed with the support plate beneath the bracket member for guiding the bracket member.
摘要翻译：用于烘箱的闩锁包括安装在烤箱内的支撑板。托架构件可枢转地支撑在支撑板上。把手固定到支架构件上，并且可手动操作以在闩锁位置和解锁位置之间移动闩锁。锁定臂可移动地支撑在支撑板上并且连接到支架构件，以根据支架构件的移动在闩锁位置和解锁位置之间移动。弹簧连接在支撑板和支架构件之间，用于选择性地将支架构件朝向锁定或解锁位置偏压。第一和第二弓形引导突起与托架构件下方的支撑板一体地形成，用于引导托架构件。

47. 发明授权

US5256472A Fluorine resin type weather-resistant film 失效
标题翻译：氟树脂型耐候膜
公开(公告)号：US5256472A
公开(公告)日：1993-10-26
申请号：US873192
申请日：1992-04-24
申请人： Yoshihisa Moriya , Mikio Shimizu , Masami Inoue
发明人： Yoshihisa Moriya , Mikio Shimizu , Masami Inoue
IPC分类号： B32B27/30 , C08J5/18 , C08L27/16 , C08L33/10 , C09D127/16 , C09D133/06 , B32B27/08
CPC分类号： C08J5/18 , B32B27/30 , C09D127/16 , C09D133/06 , C08J2327/16 , C08J2333/10 , C08L27/16 , C08L33/10 , Y10T428/24967 , Y10T428/24975 , Y10T428/3154
摘要： A fluorine resin type weather-resistant film of multi-layer structure comprising a front surface layer made of a composition (A) comprising, as main components, from 50 to 95 parts by weight of a vinylidene fluoride resin and from 5 to 50 parts by weight of a methacrylate resin and a rear surface layer made of a composition (B) comprising, as main components, from 50 to 95 parts by weight of a methacrylate resin, from 5 to 50 parts by weight of a vinylidene fluoride resin and from 0.1 to 15 parts by weight of an ultraviolet absorber, wherein the overall thickness of the film of multi-layer structure is from 10 to 150 .mu.m, and the thickness of the front surface layer of the film is from 2 to 50 .mu.m.
摘要翻译：一种多层结构的氟树脂型耐候膜，包括由组合物（A）制成的前表面层，所述组合物（A）主要包含50至95重量份的偏二氟乙烯树脂和5至50重量份的甲基丙烯酸酯树脂的重量和由组合物（B）制成的背面层，所述组合物（B）主要包含50至95重量份的甲基丙烯酸酯树脂，5至50重量份的偏二氟乙烯树脂和0.1 至15重量份的紫外线吸收剂，其中多层结构的膜的总厚度为10〜150μm，膜的表面层的厚度为2〜50μm。

48. 发明授权

US4007486A Phase locking system for television signals using a digital memory technique 失效
标题翻译：使用数字存储技术的电视信号锁相系统
公开(公告)号：US4007486A
公开(公告)日：1977-02-08
申请号：US618276
申请日：1975-09-30
申请人： Masao Inaba , Atsumi Sugimoto , Mikio Shimizu , Masashi Onosato , Shigeru Miyahara , Kazuo Kashigi
发明人： Masao Inaba , Atsumi Sugimoto , Mikio Shimizu , Masashi Onosato , Shigeru Miyahara , Kazuo Kashigi
IPC分类号： H04N5/073 , H04N9/46
CPC分类号： H04N5/0736
摘要： A phase locking system locks at least one incoming composite video signal to the synchronizing signals of a second, reference wave. The incoming signal is strobed at a rate dependent upon the incoming color subcarrier into a memory, essentially on a field-by-field basis. Circuitry is provided by grouping the fields on a repeating field-tagged basis (groups of four for the NTSC signal format) to maintain signal integrity.
摘要翻译：相位锁定系统将至少一个输入复合视频信号锁定到第二参考波的同步信号。输入信号以取决于输入的彩色副载波进入存储器的速率被选通，基本上是逐场的。通过以重复的字段标记为基础（基于NTSC信号格式的四组）对字段进行分组来提供电路，以维持信号完整性。

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