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41. 发明申请

US20120202015A1 METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN 审中-公开
标题翻译：用于制造粘合体的方法，用粘合剂图案制造基材的方法和具有粘合剂图案的基材
公开(公告)号：US20120202015A1
公开(公告)日：2012-08-09
申请号：US13365311
申请日：2012-02-03
申请人： Aya IKEDA , Shinjiro Fujii , Takashi Kawamori , Takashi Masuko
发明人： Aya IKEDA , Shinjiro Fujii , Takashi Kawamori , Takashi Masuko
IPC分类号： B32B3/00 , B44C1/22
CPC分类号： C09J5/00 , C09J7/35 , C09J2201/28 , C09J2201/61 , C09J2479/086 , H01L21/6835 , H01L2924/10253 , Y10T428/24802
摘要： The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed.
摘要翻译：根据本发明的粘合体的制造方法是通过粘合剂图案将第一被粘物和第二被粘物彼此接合的粘合体的制造方法，包括以下步骤：提供含有热固性第一被粘物上的成分; 在与第一被粘物接触的表面相对的粘合剂层的表面上设置在用于保护粘合剂层的预定部分的保护层不被蚀刻的状态下通过蚀刻粘合剂层来形成粘合剂图案的步骤 ; 以及在除去保护层之后将第二被粘物粘接到粘合剂图案的步骤。

42. 发明授权

US08073686B2 Apparatus, method and computer program product for feature extraction 有权
标题翻译：用于特征提取的装置，方法和计算机程序产品
公开(公告)号：US08073686B2
公开(公告)日：2011-12-06
申请号：US12366037
申请日：2009-02-05
申请人： Yusuke Kida , Takashi Masuko
发明人： Yusuke Kida , Takashi Masuko
IPC分类号： G10L11/04 , G10L19/00
CPC分类号： G10L15/02 , G10L25/06 , G10L25/90
摘要： A feature extraction apparatus includes a spectrum calculating unit that calculates, based on an input speech signal, a frequency spectrum having frequency components obtained at regular intervals on a logarithmic frequency scale for each of frames that are defined by regular time intervals, and thereby generates a time series of the frequency spectrum; a cross-correlation coefficients calculating unit that calculates, for each target frame of the frames, a cross-correlation coefficients between frequency spectra calculated for two different frames that are in vicinity of the target frame and a predetermined frame width apart from each other; and a shift amount predicting unit that predicts a shift amount of the frequency spectra on the logarithmic frequency scale with respect to the predetermined frame width by use of the cross-correlation coefficients.
摘要翻译：特征提取装置包括频谱计算单元，该频谱计算单元基于输入的语音信号，以规则的时间间隔以规律的间隔对每个由规则的时间间隔定义的帧进行频率分量的频谱，从而生成时间序列的频谱; 互相关系数计算单元，对于帧的每个目标帧，计算针对在目标帧附近的两个不同帧计算的频谱与彼此分开的预定帧宽度的互相关系数; 以及偏移量预测单元，其通过使用互相关系数来预测相对于预定帧宽度的对数频谱上的频谱的偏移量。

43. 发明授权

US08046225B2 Prosody-pattern generating apparatus, speech synthesizing apparatus, and computer program product and method thereof 有权
标题翻译：韵律图案生成装置，语音合成装置及其计算机程序产品及其方法
公开(公告)号：US08046225B2
公开(公告)日：2011-10-25
申请号：US12068600
申请日：2008-02-08
申请人： Takashi Masuko , Masami Akamine
发明人： Takashi Masuko , Masami Akamine
IPC分类号： G10L13/08
CPC分类号： G10L13/10
摘要： Normalization parameters are generated at a normalization-parameter generating unit by calculating the mean values and the standard deviations of an initial prosody pattern and a prosody pattern of a training sentence of a speech corpus. Then, the variance range or variance width of the initial prosody pattern is normalized at the prosody-pattern normalizing unit in accordance with the normalization parameters. As a result, a prosody pattern similar to speech of human beings and improved in naturalness can be generated with a small amount of calculation.
摘要翻译：归一化参数通过计算语料库的训练句的初始韵律模式和韵律模式的平均值和标准偏差在标准化参数生成单元处产生。然后，根据归一化参数，在韵律模式归一化单元处对初始韵律模式的方差范围或方差宽度进行归一化。结果，可以通过少量的计算产生与人的言语和自然性相似的韵律模式。

44. 发明申请

US20110187009A1 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE 失效
标题翻译：胶粘组合物，薄膜粘合剂，粘合片和半导体器件
公开(公告)号：US20110187009A1
公开(公告)日：2011-08-04
申请号：US13057322
申请日：2009-04-30
申请人： Takashi Masuko , Shigeki Katogi
发明人： Takashi Masuko , Shigeki Katogi
IPC分类号： H01L29/02 , C08K5/3415 , C09J163/04 , C09J179/08 , B32B27/38 , B32B27/00
CPC分类号： C09J4/06 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C09J7/20 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2463/00 , C09J2479/08 , H01L21/6836 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68377 , H01L2224/27436 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48221 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83885 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , Y10T428/287 , Y10T428/2896 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100° C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group.
摘要翻译：本发明的粘合剂组合物包含（A）Tg不高于100℃的热塑性树脂和（B）热固性组分，其中（B）热固性组分包括（B1）具有烯丙基的化合物和（B2）具有马来酰亚胺基团的化合物。

46. 发明授权

US07921012B2 Apparatus and method for speech recognition using probability and mixed distributions 有权
标题翻译：使用概率和混合分布进行语音识别的装置和方法
公开(公告)号：US07921012B2
公开(公告)日：2011-04-05
申请号：US11857104
申请日：2007-09-18
申请人： Hiroshi Fujimura , Takashi Masuko
发明人： Hiroshi Fujimura , Takashi Masuko
IPC分类号： G10L15/28
CPC分类号： G10L15/32
摘要： A speech recognition apparatus includes a first storing unit configured to store a first acoustic model invariable regardless of speaker and environment, a second storing unit configured to store a classification model that has shared parameters and non-shared parameters with the first acoustic model to classify second acoustic models, a recognizing unit configured to calculate a first likelihood with regard to the input speech by applying the first acoustic model to the input speech and obtain calculation result on the shared parameter and a plurality of candidate words that have relatively large values as the first likelihood, and a calculating unit configured to calculate a second likelihood for each of the groups with regard to the input speech by use of the calculation result on the shared parameters and the non-shared parameters of the classification model.
摘要翻译：语音识别装置包括：第一存储单元，被配置为存储不管扬声器和环境如何不变的第一声学模型;第二存储单元，被配置为存储具有共享参数和非共享参数的分类模型与第一声学模型，以对第二声学模型进行分类声学模型，识别单元，被配置为通过将第一声学模型应用于输入语音来计算关于输入语音的第一可能性，并且获得关于共享参数的计算结果和具有相对较大值的多个候选词作为第一以及计算单元，被配置为通过使用关于共享参数的计算结果和分类模型的非共享参数来计算关于输入语音的每个组的第二似然。

47. 发明申请

US20110065260A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
公开(公告)号：US20110065260A1
公开(公告)日：2011-03-17
申请号：US12950398
申请日：2010-11-19
申请人： Takashi KAWAMORI , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi KAWAMORI , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： H01L21/78 , B29C65/52
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

48. 发明申请

US20100239858A1 FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME 失效
标题翻译：类似粘胶，粘合片和使用相同的半导体器件
公开(公告)号：US20100239858A1
公开(公告)日：2010-09-23
申请号：US12376347
申请日：2006-08-04
申请人： Takashi Masuko , Minoru Sugiura , Shigeki Katogi , Masami Yusa
发明人： Takashi Masuko , Minoru Sugiura , Shigeki Katogi , Masami Yusa
IPC分类号： B32B7/12 , C09J7/02 , C08G18/00 , C08L63/00 , C08L75/04
CPC分类号： H01L21/6836 , C08G18/10 , C08G18/4854 , C08G59/08 , C08G59/621 , C08G73/1035 , C08G73/1046 , C08G73/14 , C08L63/04 , C08L75/04 , C08L2666/22 , C09J7/10 , C09J175/04 , C09J179/08 , C09J2203/326 , C09J2205/114 , C09J2453/00 , C09J2475/00 , C09J2479/08 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/274 , H01L2224/27436 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , Y10T428/2848 , C08G18/346 , H01L2924/00 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2924/069 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.
摘要翻译：本发明的目的是提供能够实现加工性和耐回流性优异组合的膜状粘合剂。本发明的膜状粘合剂用于将半导体元件粘合到被粘物上，并且包括含有选自聚氨酯酰亚胺树脂，聚氨酯酰胺酰亚胺树脂和聚氨酯酰亚胺 - 聚氨酯酰胺酰亚胺树脂中的至少一种树脂的粘合剂层。

49. 发明申请

US20100178501A1 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME 审中-公开
标题翻译：胶粘组合物，类似胶粘剂，粘合片和与其相同的半导体器件
公开(公告)号：US20100178501A1
公开(公告)日：2010-07-15
申请号：US12161246
申请日：2007-01-23
申请人： Takashi Masuko , Masanobu Miyahara , Keisuke Okubo
发明人： Takashi Masuko , Masanobu Miyahara , Keisuke Okubo
IPC分类号： C08K5/3417 , B32B27/00 , B32B27/32
CPC分类号： C09J4/06 , C08K5/3417 , C09J7/22 , C09J7/38 , C09J11/06 , C09J2205/102 , C09J2423/006 , C09J2479/08 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L23/3128 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83856 , H01L2224/8388 , H01L2224/85 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01057 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/3511 , Y10T428/2896 , Y10T428/31721 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An adhesive composition that is capable of achieving a superior combination of process characteristics such as adherend fill properties (embedability) and low-temperature lamination properties, and semiconductor device reliability such as reflow resistance, as well as a film-like adhesive, an adhesive sheet that exhibits excellent process characteristics including ready releasability from dicing sheets, and a semiconductor device that exhibits excellent productivity, superior adhesive strength when heated and superior moisture resistance, all of which use the adhesive composition. The adhesive composition comprises (A) a thermoplastic resin, (B) a bisallylnadimide represented by a general formula (I) shown below, and (C) a bifunctional or higher (meth)acrylate compound. (wherein, R1 represents a bivalent organic group containing an aromatic ring and/or a straight-chain, branched or cyclic aliphatic hydrocarbon).
摘要翻译：粘合剂组合物能够实现诸如被粘物填充性能（嵌入性）和低温层压性能的工艺特性的优异组合，以及半导体器件可靠性如耐回流性，以及膜状粘合剂，粘合片其表现出优异的加工特性，包括从切割片开始的脱模性，以及显示优异的生产率的半导体器件，加热时的优异的粘合强度和优异的耐湿性，所有这些都使用粘合剂组合物。粘合剂组合物包含（A）热塑性树脂，（B）由下述通式（I）表示的双丙烯酰亚胺酰亚胺和（C）双官能或更高级（甲基）丙烯酸酯化合物。（其中，R1表示含有芳环和/或直链，支链或环状脂族烃的二价有机基团）。

50. 发明申请

US20100143673A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：光敏胶粘剂组合物，薄膜粘合剂，粘合片，粘合剂图案，带粘合层的半导体滤波器，半导体器件和半导体器件制造方法
公开(公告)号：US20100143673A1
公开(公告)日：2010-06-10
申请号：US12594461
申请日：2008-03-19
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
IPC分类号： G03F7/085 , B32B3/10
CPC分类号： C09J4/06 , C08G59/686 , C08L63/00 , C08L2666/22 , C09J11/06 , C09J163/00 , C09J179/08 , H01L23/24 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/09701 , H01L2924/15311 , Y10T428/24851 , H01L2924/00014 , H01L2924/00
摘要： The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation.
摘要翻译：本发明的感光性粘合剂组合物包含（A）碱溶性树脂，（B）环氧树脂，（C）可辐射聚合化合物和（D）光引发剂，其中（D）光引发剂至少含有（D1 ）光引发剂，其具有通过暴露于辐射促进环氧树脂的聚合和/或固化反应的功能。

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