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    • 44. 发明申请
    • Overmold component seal in an electronic device housing
    • 电子设备外壳中的二次密封组件密封
    • US20060291093A1
    • 2006-12-28
    • US11168283
    • 2005-06-28
    • Mo XuJohaan KoongChinHup ChuaKhaiYi AuYeongKokWah Tan
    • Mo XuJohaan KoongChinHup ChuaKhaiYi AuYeongKokWah Tan
    • G11B17/00G11B17/08G11B5/012
    • G11B25/043G11B5/11G11B5/4833G11B33/1466
    • In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.
    • 通常,本发明涉及用于在包覆成型部件的部件之间形成密封件的技术。 包覆成型部件包括形成一个或多个通孔的第一部分和包覆模制到第一部分的第二部分。 通孔可以是例如螺孔或者包覆成型材料入口孔。 在第二部分包覆成型之前,由第一部分形成的通孔被粘合剂包围。 在包覆模制之后,粘合剂将第一部分的表面局部地粘合到包覆模制部分上以围绕通孔进行密封。 例如,包覆成型部件可以与盖组合以形成限定内部环境的盘驱动器或其他电子装置的壳体。 在该示例中,粘合剂防止外部污染物通过通孔进入内部环境。
    • 45. 发明授权
    • Formed in place vibration damper or dampers
    • 形成振动阻尼器或阻尼器
    • US07529062B2
    • 2009-05-05
    • US11110298
    • 2005-04-20
    • Mo Xu
    • Mo Xu
    • G11B33/14
    • G11B33/08G11B25/043G11B33/12
    • A formed in place damper for a data storage device. The damper is formed of an elastomeric bead which is cured to a cover or component to form a damper body having contoured shape or surface formed by an outer surface of the cured elastomeric bead. The damper is formed in place to a cover of the data storage device so that when the cover is assembled to a base, the damper is interposed between the cover or housing and a disc spindle assembly, actuator or voice coil motor. Alternatively the damper is formed to drive components, such as the disc spindle assembly, actuator or voice coil motor.
    • A形成用于数据存储装置的阻尼器。 阻尼器由弹性体珠形成,其被固化到盖或部件以形成具有由固化的弹性体珠的外表面形成的轮廓形状或表面的阻尼体。 阻尼器形成在数据存储装置的盖上,使得当盖组装到基座上时,阻尼器插入在盖或壳体与盘主轴组件,致动器或音圈马达之间。 或者,阻尼器形成为驱动部件,例如盘主轴组件,致动器或音圈电机。
    • 47. 发明授权
    • Overmold component seal in an electronic device housing
    • 电子设备外壳中的二次密封组件密封
    • US07359144B2
    • 2008-04-15
    • US11168283
    • 2005-06-28
    • Mo XuJohaan S. J. KoongChinHup ChuaKhaiYi AuYeongKokWah Tan
    • Mo XuJohaan S. J. KoongChinHup ChuaKhaiYi AuYeongKokWah Tan
    • G11B33/14B29C45/14
    • G11B25/043G11B5/11G11B5/4833G11B33/1466
    • In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.
    • 通常,本发明涉及用于在包覆成型部件的部件之间形成密封件的技术。 包覆成型部件包括形成一个或多个通孔的第一部分和包覆模制到第一部分的第二部分。 通孔可以是例如螺孔或者包覆成型材料入口孔。 在第二部分包覆成型之前,由第一部分形成的通孔被粘合剂包围。 在包覆模制之后,粘合剂将第一部分的表面局部地粘合到包覆模制部分上以围绕通孔进行密封。 例如,包覆成型部件可以与盖组合以形成限定内部环境的盘驱动器或其他电子装置的壳体。 在该示例中,粘合剂防止外部污染物通过通孔进入内部环境。