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    • 46. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • 半导体集成电路设备
    • US20070278580A1
    • 2007-12-06
    • US11756196
    • 2007-05-31
    • Masaki KONDORyo FukudaYohji WatanabeMitsutoshi Nakamura
    • Masaki KONDORyo FukudaYohji WatanabeMitsutoshi Nakamura
    • H01L23/62H02H3/20
    • H01L27/0251H01L23/62H01L2924/0002H01L2924/00
    • A semiconductor integrated circuit device according to an embodiment of the present invention includes: a semiconductor substrate; an internal circuit formed on the semiconductor substrate, a first potential and a second potential being supplied to the internal circuit, thereby applying an operating voltage to the internal circuit; a fuse disposed above a semiconductor region of a first conductivity type, and electrically connected to the internal circuit, the semiconductor region being supplied with the second potential and being formed in the semiconductor substrate; and a protective element formed in the semiconductor region of the first conductivity type and protecting the internal circuit in response to positive and negative abnormal voltages generated in a wiring through which the fuse and the internal circuit are connected to each other.
    • 根据本发明实施例的半导体集成电路器件包括:半导体衬底; 形成在所述半导体衬底上的内部电路,向所述内部电路供给第一电位和第二电位,从而向所述内部电路施加工作电压; 保险丝,其设置在第一导电类型的半导体区域上方,并且电连接到所述内部电路,所述半导体区域被提供有所述第二电位并形成在所述半导体衬底中; 以及形成在第一导电类型的半导体区域中的保护元件,并且响应于在熔丝和内部电路彼此连接的布线中产生的正和负异常电压来保护内部电路。
    • 49. 发明授权
    • Wire harness circuit configuration method and wire harness
    • 线束电路配置方法和线束
    • US06494722B1
    • 2002-12-17
    • US09640174
    • 2000-08-17
    • Masami SakamotoYutaka MatsuokaMitsutoshi NakamuraYoshinobu Seki
    • Masami SakamotoYutaka MatsuokaMitsutoshi NakamuraYoshinobu Seki
    • H01R1200
    • B60R16/0207
    • A method of assembling a wire harness circuit includes providing a plurality of module plates, attaching wire connection terminals to predetermined wires of a plurality of wire sub-harnesses, inserting one or more wire connection terminals into selected wire housing grooves on the module plates, laminating the module plates on each other so as to form a laminated body, and inserting at least one connection member into the laminated body through openings in the module plates to electrically connect selected wire connection terminals on respective module plates. A wire harness according to the invention includes a plurality of wire sub-harnesses, each wire sub-harness comprising a plurality of wires, a plurality of wire connection terminals engageable with preselected wires to establish an electrical connection, a plurality of module plates laminated on each other so as to form a laminated body, and at least one connection member insertable into the laminated body through openings in the module plates to electrically connect selected wire connection terminals on respective module plates.
    • 组装线束电路的方法包括提供多个模块板,将线连接端子连接到多个线束的预定导线,将一个或多个线连接端子插入到模块板上的选定的线容纳槽中,层压 模块板彼此形成层叠体,并且通过模块板中的开口将至少一个连接构件插入到层压体中,以电连接各个模块板上的选定的电线连接端子。 根据本发明的线束包括多个线束,每个线子束包括多根线,多个线连接端可与预选线接合以建立电连接,多个模块板层压在 彼此形成层压体,并且至少一个连接构件通过模块板中的开口插入到层压体中,以电连接相应模块板上的所选择的电线连接端子。