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    • 43. 发明授权
    • Automatic processor for silver halide photosensitive photographic
material
    • 自动处理器用于卤化银感光感光材料
    • US6126339A
    • 2000-10-03
    • US385618
    • 1999-08-30
    • Hiroaki Kobayashi
    • Hiroaki Kobayashi
    • G03D5/04G03D3/02
    • G03D5/04
    • In an apparatus for automatically processing a silver halide photographic light sensitive material by plural processes, provided with a conveyor for relatively conveying the material to the plural processes; and a processing solution supplying device for supplying a processing solution onto the material in at least one of the plural processes, the processing solution supplying device having plural jetting channels, each jetting channel comprising a jetting chamber in which the processing solution is accommodated, a jetting head provided with plural orifices each communicating with the jetting chamber, and a converting element to change the volume of the jetting chamber so that the processing solution is jetted through the plural orifices from the jetting chamber to an outside; each orifice has a length L and a diameter R and a ratio (L/R) is made within a range of 5 to 200.
    • 在用于通过多个工艺自动处理卤化银照相感光材料的设备中,设置有用于将材料相对地输送到多个工艺的输送机; 以及处理溶液供给装置,用于在多个处理中的至少一个中将处理溶液供给到所述材料上,所述处理液供给装置具有多个喷射通道,每个喷射通道包括其中容纳有所述处理溶液的喷射室, 头部设置有与喷射室连通的多个孔,以及改变喷射室的体积的转换元件,使得处理溶液通过多个喷嘴从喷射室喷射到外部; 每个孔口具有长度L和直径R,并且比率(L / R)在5至200的范围内。
    • 44. 发明授权
    • Method for melt-decontaminating metal contaminated with radioactive
substance
    • 用放射性物质污染的金属进行熔融净化的方法
    • US5640710A
    • 1997-06-17
    • US561863
    • 1995-11-22
    • Hiroaki KobayashiHiroshi IgarashiMichiru Fujita
    • Hiroaki KobayashiHiroshi IgarashiMichiru Fujita
    • G21F9/30A62D3/00
    • G21F9/308
    • A flux for effectively melt-decontaminating a zircaloy contaminated with a radioactive contaminant Pu.sub.2 O.sub.3 is provided. The flux comprises a mixture of a metal flux of a metal (e.g. Ca or Mg) having a higher chemical activity than plutonium at a temperature above the melting point of the zircaloy with a halide flux of metallic compound (e.g. SnF.sub.2, PbF.sub.2, CoF.sub.2, CsF.sub.2) of a halogen element having a higher atomic number than fluorine and has a smaller absolute value of the standard free energy of formation than a fluorination product of plutonium (i.e. PuOF). The addition of the flux to a molten zircaloy causes plutonium contained in the melt to be converted, through a two-step reaction, to PuOF which can be then separated as slag.
    • 提供了用于有效地熔化去污染被放射性污染物Pu2O3污染的锆石的助熔剂。 焊剂包括在高于锆氧化物熔点的温度下具有比钚高的化学活性的金属(例如Ca或Mg)的金属助熔剂与金属化合物的卤化物焊剂(例如SnF 2,PbF 2,CoF 2, CsF2)具有比氟原子数更高的卤素元素,并且与钚的氟化产物(即PuOF)相比,具有比标准自由能的绝对值更小的绝对值。 将熔剂添加到熔融锆氧化铝中导致熔体中所含的钚通过两步反应转化成PuOF,然后将其分离为渣。
    • 45. 发明授权
    • Wire bonding apparatus
    • 接线装置
    • US5529236A
    • 1996-06-25
    • US322514
    • 1994-10-14
    • Hiroaki Kobayashi
    • Hiroaki Kobayashi
    • H01L21/60B23K20/00H01L21/00B23K31/12
    • H01L24/85B23K20/007H01L24/78H01L2224/48091H01L2224/48247H01L2224/48465H01L2224/78301H01L2224/85H01L2924/00014H01L2924/01005H01L2924/01006H01L2924/01019H01L2924/01027H01L2924/01033H01L2924/01039H01L2924/01057H01L2924/01082H01L2924/04953
    • A wire bonding apparatus for semiconductor devices have a supporting block for holding a workpiece to which wires are bonded, a drive for driving the supporting block for holding the workpiece, the drive being capable of vertically moving and stopping the supporting block at a predetermined position, an optical means disposed above the supporting block and used for recognizing the pattern of the workpiece held on the supporting block, a storage means for prestoring each level of the workpiece so that the positions of not less than two places intended for recognition on the workpiece having difference in level conforms to the focal point of the optical means, and a control unit for controlling the drive for driving the supporting block, moving the workpiece to the position stored in the storage means and stopping the workpiece at that position. The supporting block is supported by a stroke bearing comprising a fixed part and a moving part which is moved and guided in the direction perpendicular to the fixed part. The drive for driving the supporting block comprises a cam shaft, a drive cam secured onto the cam shaft and generating a uniform velocity cam curve, a cam follower for coming contact with the drive cam, the cam follower being provided on the supporting block side, and a cam-driving pulse motor capable of rotating the cam shaft and electrically controlling the angle of rotation of the drive cam.
    • 一种用于半导体器件的引线接合装置具有用于保持接合线的工件的支撑块,用于驱动用于保持工件的支撑块的驱动器,该驱动能够将支撑块垂直移动和停止在预定位置, 光学装置,其设置在所述支撑块上方,用于识别保持在所述支撑块上的所述工件的图案;存储装置,用于预先存储所述工件的每一级,使得不少于两个用于在所述工件上识别的位置的位置具有 水平差符合光学装置的焦点,以及控制单元,用于控制用于驱动支撑块的驱动,将工件移动到存储在存储装置中的位置,并在该位置停止工件。 支撑块由包括固定部分和沿垂直于固定部分的方向移动和引导的移动部件的行程轴承支撑。 用于驱动支撑块的驱动装置包括凸轮轴,固定在凸轮轴上并产生均匀速度凸轮曲线的驱动凸轮,用于与驱动凸轮接触的凸轮从动件,凸轮从动件设置在支撑块侧上, 以及能够旋转凸轮轴并电控制驱动凸轮的旋转角度的凸轮驱动脉冲电机。
    • 46. 发明授权
    • Apparatus capable of producing different kinds of foods
    • 能够生产不同种类的食物的装置
    • US5522309A
    • 1996-06-04
    • US481388
    • 1995-07-17
    • Hiroshi MizobuchiMineo JyuuriAsahiro NishikawaYoshiaki IshinoTakeshi NakaiHiroaki Kobayashi
    • Hiroshi MizobuchiMineo JyuuriAsahiro NishikawaYoshiaki IshinoTakeshi NakaiHiroaki Kobayashi
    • A47J27/14A47J37/00A23L1/00A47J44/00
    • A47J27/14A47J37/00
    • The present invention provides an apparatus capable of producing different kinds of foods, the apparatus comprising plural number of processing devices, each having a specific function for treating or holding food materials, and one or more carrier vessels for transporting the food materials from one processing device to another, the carrier vessels having multiple functions and at least one compartment for holding the food materials treated or held in the processing devices. The apparatus is capable of producing different kinds of food products by instructing the carrier vessels to transfer food materials from one device to another according to the process requirements of the desired end products. The carrier vessel has a memory device that holds the information of the locations of devices from and to which the carrier vessels are instructed to transfer food materials. The carrier vessel or a separate control device controls the correct sequence and/or the locations of the processing devices for the carrier vessel to transport the food materials in accordance with the instructions contained in the memory device.
    • PCT No.PCT / JP94 / 01950 Sec。 371日期:1995年7月17日 102(e)日期1995年7月17日PCT 1994年11月18日PCT公布。 No.W095 / 13709 PCT出版物 日期:1995年5月26日本发明提供一种能够生产不同种类的食物的装置,该装置包括多个处理装置,每个处理装置具有用于处理或保持食物的特定功能,以及一个或多个用于运输 从一个加工装置到另一个加工装置的食品材料,具有多种功能的载体容器和用于保持处理或保持在处理装置中的食品材料的至少一个隔室。 该装置能够根据期望的最终产品的工艺要求,指示承运船将食品从一个装置转移到另一个装置,从而生产不同种类的食品。 承运船具有一个记录装置,用于保存载体容器被指示转移食物的装置的位置信息。 载体容器或单独的控制装置控制载体容器的处理装置的正确顺序和/或位置,以便根据包含在存储装置中的指令来运输食物材料。
    • 49. 发明授权
    • Die bonding apparatus
    • 焊接装置
    • US5351872A
    • 1994-10-04
    • US082285
    • 1993-06-24
    • Hiroaki Kobayashi
    • Hiroaki Kobayashi
    • H01L21/52B23K20/02H01L21/00H05K13/04H01L21/603
    • H01L21/67144B23K20/02H01L24/75H05K13/0417H01L2224/83192
    • A die bonding apparatus for bonding a semiconductor die onto a boding surface of a semiconductor lead frame by pressing the semiconductor die under a constant pressure. The apparatus includes a mounting section for mounting the semiconductor die a collet having chucking portion for holding the semiconductor die mounted on the die mounting section, a linear motor for moving the collet up and down, a separating member for separating the semiconductor die from the die mounting section, a horizontal driving section for moving the collet horizontally, a lead frame mounting section for mounting the semiconductor lead frame, a position sensor for detecting vertical positions of the collet and a linear motor control section for controlling vertical travel speed of the collet and bonding pressure of the die against the bonding surface of the semiconductor lead frame, by controllably driving the linear motor on the basis of position information of the collet detected by the position sensor.
    • 一种管芯接合装置,用于通过在一定压力下挤压半导体管芯将半导体管芯接合到半导体引线框架的焊接表面上。 该装置包括用于安装半导体管芯的安装部分,具有用于保持安装在管芯安装部分上的半导体管芯的夹持部分的夹头,用于上下移动夹头的线性马达,用于将半导体管芯与管芯分离的分离部件 安装部,用于水平地移动夹头的水平驱动部,用于安装半导体引线框的引线框架安装部,用于检测夹头的垂直位置的位置传感器和用于控制夹头的垂直行进速度的线性马达控制部, 通过基于由位置传感器检测到的夹头的位置信息可控地驱动线性电动机,使模具与半导体引线框架的接合面接合压力。