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41. 发明授权

US06513236B2 Method of manufacturing bump-component mounted body and device for manufacturing the same 失效
标题翻译：凸块部件安装体的制造方法及其制造装置
公开(公告)号：US06513236B2
公开(公告)日：2003-02-04
申请号：US09777062
申请日：2001-02-05
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H05K310
CPC分类号： H01L24/75 , H01L21/563 , H01L24/29 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75315 , H01L2224/7598 , H01L2224/81209 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H05K3/284 , H05K3/303 , H05K2203/0278 , H05K2203/085 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , H01L2924/00 , H01L2224/05599
摘要： Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.
摘要翻译：安装在支撑基板上的电路板上的凸起部件被柔性分隔壁覆盖。在分隔壁的内侧和外侧之间设置压力差，因此凸块部件被压靠在电路板上。当在这种状态下进行加热时，凸起部件和电路板与导电粘合剂或焊料连接。在加热过程中，电路板不会变形。因此，可以以高产率制造凸块部件安装体。

42. 发明授权

US06281448B1 Printed circuit board and electronic components 有权
标题翻译：印刷电路板和电子元件
公开(公告)号：US06281448B1
公开(公告)日：2001-08-28
申请号：US09371603
申请日：1999-08-10
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H05K116
CPC分类号： H01L24/80 , H01L23/3107 , H01L23/49827 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/115 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4658 , H05K2201/0367 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/1461 , Y10T29/49126 , Y10T29/49165 , Y10T29/49345 , H01L2924/00
摘要： A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.
摘要翻译：印刷电路板具有：具有第一通孔的基材层; 以及具有第二通孔的绝缘层，所述绝缘层设置在所述基材层的一个表面上，其中所述第二通孔的横截面面积小于所述第一通孔的横截面面积，以及其中所述第一和第二通孔用导电材料填充。

43. 发明授权

US5551626A Diffusion joining method and a paste used therefor 失效
标题翻译：扩散接合方法和用于其的糊状物
公开(公告)号：US5551626A
公开(公告)日：1996-09-03
申请号：US394482
申请日：1995-02-27
申请人： Yo Hasegawa , Masahiro Nagasawa , Masahide Tsukamoto
发明人： Yo Hasegawa , Masahiro Nagasawa , Masahide Tsukamoto
IPC分类号： B23K20/16 , B23K35/00 , B23K35/02 , H05K1/09 , H05K3/40 , H05K3/46 , H05K3/34
CPC分类号： B23K20/16 , B23K35/007 , H05K3/4069 , B23K2201/36 , B23K35/025 , H05K1/095 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623
摘要： The present invention relates to a diffusion joining method of Cu or Cu alloy surface and a conductive paste used therefor, especially applied to a method for preparing a multilayer printed wiring board. The present invention is characterized by providing the contacting surfaces with a layer selected from the group comprising a noble metal thin layer, a metal oxide remover layer and a conductive paste layer mainly consisting of a Cu or Cu alloy particles and the metal oxide remover; and pressing the contacting metal surfaces at a temperature higher than 170.degree. C. more or less whereat the Cu atom at interface of the Cu or Cu alloy surfaces to be joined becomes to be able to diffuse, to give a joined metal body.
摘要翻译：本发明涉及Cu或Cu合金表面的扩散接合方法及其用途的导电糊，特别适用于制备多层印刷线路板的方法。本发明的特征在于，使接触表面具有选自贵金属薄层，金属氧化物去除层和主要由Cu或Cu合金颗粒和金属氧化物去除剂组成的导电浆料层的层; 并且在Cu或Cu合金表面的接合处的Cu原子变得能够扩散的情况下，或多或少地在高于170℃的温度下压接接触的金属表面，从而形成接合的金属体。

44. 发明授权

US5312643A Method of producing a transparent conductive film provided with supplementary metal lines 失效
标题翻译：制造具有辅助金属线的透明导电膜的方法
公开(公告)号：US5312643A
公开(公告)日：1994-05-17
申请号：US795022
申请日：1991-11-20
申请人： Osamu Yamamoto , Kouji Nishimura , Akira Isomi , Masahide Tsukamoto
发明人： Osamu Yamamoto , Kouji Nishimura , Akira Isomi , Masahide Tsukamoto
IPC分类号： B41M3/00 , C23C14/08 , G02F1/1343 , G09F9/30 , H05K1/09 , H05K3/12 , H05K3/24 , B05D5/12 , C23C14/00
CPC分类号： B41M3/003 , C23C14/086 , G02F1/13439 , H05K1/092 , H05K3/12 , H05K3/244
摘要： A method of producing a transparent conductive film provided with supplementary metal lines, comprises the steps of forming a transparent conductive film composed mainly of indium oxide, tin oxide, or antimony oxide on a transparent substrate and forming metal lines through printing on the transparent conductive film by an intaglio or litho offset printing procedure a line pattern of metallorganic ink composed mainly of an organic noble metal containing gold, silver, or platinum and baking it for metallization.
摘要翻译：一种制造具有辅助金属线的透明导电膜的方法，包括以下步骤：在透明基板上形成主要由氧化铟，氧化锡或氧化锑构成的透明导电膜，并通过印刷在透明导电膜上形成金属线通过凹版或光刻胶版印刷方法，主要由含有金，银或铂的有机贵金属组成的金属有机油墨的线图案，并将其烧成金属化。

45. 发明授权

US5229167A Method of forming a film pattern on a substrate 失效
标题翻译：在基板上形成薄膜图案的方法
公开(公告)号：US5229167A
公开(公告)日：1993-07-20
申请号：US500246
申请日：1990-03-27
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H05K3/02 , G02F1/1343 , G03F7/004 , H05K1/09 , H05K3/04
CPC分类号： H05K3/048 , G02F1/13439 , G03F7/0047
摘要： A film pattern of a desired material is formed on a substrate by forming a pattern of powder of inorganic material on the substrate, forming at least a single layer of film of desired material on the substrate on which the pattern of the powder of inorganic material is formed so that a part of the film of the desired material is formed on at least a part of the pattern of the powder of inorganic material, and mechanically removing the pattern film of the powder of inorganic material together with a part of the film of the desired material formed thereon.

46. 发明授权

US4016094A Electro-optical device 失效
标题翻译：电光装置
公开(公告)号：US4016094A
公开(公告)日：1977-04-05
申请号：US559394
申请日：1975-03-17
申请人： Masahide Tsukamoto , Tetsuro Ohtsuka , Kazuhisa Morimoto , Yoshinobu Murakami
发明人： Masahide Tsukamoto , Tetsuro Ohtsuka , Kazuhisa Morimoto , Yoshinobu Murakami
IPC分类号： C09K19/26 , C09K19/42 , G02F1/16 , C09K3/34 , G02F1/13
CPC分类号： C09K19/26 , C09K19/42
摘要： An electro-optical device using a liquid crystal consisting of 99.9 to 30 wt.% of at least one nematic liquid crystal and 0.1 to 70 wt. % of at least one optically active liquid crystal compound, (+)-p-alkoxy-p'-(2-methylbutyl)azoxybenzene. Such a device has a better display performance than similar devices because the mixture has a threshold voltage and a rapid response to an electric signal applied to the device, and so it is very practical for a matrix display device.
摘要翻译：使用由99.9〜30重量％的至少一种向列型液晶组成的液晶和0.1〜70重量％％的至少一种光学活性液晶化合物，（+） - 对 - 烷氧基-P' - （2-甲基丁基）氧化苯。这种装置具有比类似装置更好的显示性能，因为混合物具有阈值电压和对施加到装置的电信号的快速响应，因此对于矩阵显示装置是非常实用的。

47. 发明授权

US3973830A Electro-optic device 失效
标题翻译：电光装置
公开(公告)号：US3973830A
公开(公告)日：1976-08-10
申请号：US570961
申请日：1975-04-23
申请人： Masahide Tsukamoto , Tetsuro Ohtsuka , Kazuhisa Morimoto , Yoshinobu Murakami
发明人： Masahide Tsukamoto , Tetsuro Ohtsuka , Kazuhisa Morimoto , Yoshinobu Murakami
IPC分类号： C09K19/58 , G02F1/13 , C09K3/34
CPC分类号： C09K19/58 , C09K19/586
摘要： The present invention provides an improved electrooptical device having a cell for containing a liquid crystal and consisting of two light-transparent plates opposed to each other and having electrically conductive electrodes on the inner surfaces thereof, the electrodes on at least one inner surface being transparent, and spacer means between said opposed electrodes; and a power supply coupled to said electrodes for applying an electric voltage to said electrodes, whereas the improvement comprises a liquid crystal in said cell between said electrodes consisting of 99.95 to 65 wt.% of at least one nematic liquid crystal and 0.05 to 35 wt.% of at least one optically active compound of the formula; ##SPC1##Wherein X is CH=N, --N=N--or ##EQU1##
摘要翻译：本发明提供了一种改进的电光装置，其具有用于容纳液晶的单元，并且由彼此相对的两个透光板组成，并且在其内表面上具有导电电极，至少一个内表面上的电极是透明的，和在所述相对电极之间的隔离装置; 以及耦合到所述电极的电源，用于向所述电极施加电压，而改进包括在所述电极之间的所述电极中的液晶由99.95至65重量％的至少一个向列型液晶和0.05至35重量％％的至少一种下式的光学活性化合物; 其中X是CH = N，-N = N - 或-N = N-＆Darr＆O。

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