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    • 41. 发明授权
    • NAND-type nonvolatile semiconductor memory device
    • NAND型非易失性半导体存储器件
    • US07999303B2
    • 2011-08-16
    • US12353586
    • 2009-01-14
    • Shoko KikuchiYasushi NakasakiKoichi Muraoka
    • Shoko KikuchiYasushi NakasakiKoichi Muraoka
    • H01L29/788
    • H01L27/11568H01L21/28282H01L29/513H01L29/517H01L29/78
    • The present invention provides a high-performance MONOS-type NAND-type nonvolatile semiconductor memory device using an aluminum oxide film as a part of gate insulating film in a select transistor and as a block insulating film in a memory transistor. The NAND-type nonvolatile semiconductor memory device has, on a semiconductor substrate, a plurality of memory cell transistors connected to each other in series and a select transistor. The memory cell transistor includes a first insulating film on the semiconductor substrate, a charge trapping layer, a second insulating film made of aluminum oxide,a first control gate electrode, and a first source/drain region. The select transistor includes a third insulating film on the semiconductor substrate, a fourth insulating film made of an aluminum oxide containing at least one of a tetravalent cationic element, a pentavalent cationic element, and N (nitrogen), a second control gate electrode, and a second source/drain region.
    • 本发明提供一种在选择晶体管中使用氧化铝膜作为栅绝缘膜的一部分的高性能MONOS型NAND型非易失性半导体存储器件,并且作为存储晶体管中的块绝缘膜。 NAND型非易失性半导体存储器件在半导体衬底上具有串联连接的多个存储单元晶体管和选择晶体管。 存储单元晶体管包括半导体衬底上的第一绝缘膜,电荷俘获层,由氧化铝制成的第二绝缘膜,第一控制栅极电极和第一源极/漏极区域。 选择晶体管包括半导体衬底上的第三绝缘膜,由包含四价阳离子元素,五价阳离子元素和N(氮)中的至少一种的氧化铝制成的第四绝缘膜,第二控制栅电极和 第二源极/漏极区域。
    • 45. 发明授权
    • Nonvolatile semiconductor memory
    • 非易失性半导体存储器
    • US07750394B2
    • 2010-07-06
    • US12189400
    • 2008-08-11
    • Tatsuo ShimizuKoichi Muraoka
    • Tatsuo ShimizuKoichi Muraoka
    • H01L29/94
    • H01L29/792H01L21/28273H01L21/28282H01L29/513H01L29/517
    • A nonvolatile semiconductor memory device includes: a semiconductor substrate; and a memory cell. The memory cell includes: a source region and a drain region formed at a distance from each other on the semiconductor substrate; a tunnel insulating film formed on a channel region of the semiconductor substrate, the channel region being located between the source region and the drain region; a charge storage film formed on the tunnel insulating film; a charge block film formed on the charge storage film; and a control electrode that is formed on the charge block film. The control electrode includes a Hf oxide film or a Zr oxide film having at least one element selected from the first group consisting of V, Cr, Mn, and Tc added thereto, and having at least one element selected from the second group consisting of F, H, and Ta added thereto.
    • 非易失性半导体存储器件包括:半导体衬底; 和存储单元。 存储单元包括:在半导体衬底上形成为彼此间隔一定距离的源极区域和漏极区域; 隧道绝缘膜,形成在所述半导体衬底的沟道区上,所述沟道区位于所述源极区和所述漏极区之间; 形成在隧道绝缘膜上的电荷存储膜; 形成在电荷存储膜上的电荷阻挡膜; 以及形成在电荷阻挡膜上的控制电极。 控制电极包括Hf氧化物膜或Zr氧化物膜,其具有从添加有V,Cr,Mn和Tc的第一组中选择的至少一种元素,并且具有至少一种选自F ,H和Ta。