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    • 49. 发明授权
    • Semiconductor light-emitting device
    • 半导体发光装置
    • US06586773B2
    • 2003-07-01
    • US10001083
    • 2001-10-31
    • Ryo SaekiHideto SugawaraYukio WatanabeTamotsu Jitosho
    • Ryo SaekiHideto SugawaraYukio WatanabeTamotsu Jitosho
    • H01L2715
    • H01L33/16H01L33/0079H01L33/30
    • A semiconductor light-emitting device, including a first substrate of a first conductivity type, a first bonding layer provided on said first substrate and consisting essentially of a GaP material of the first conductivity type, a second bonding layer provided on the first bonding layer, coincident with the first bonding layer in a crystal orientation, having the first conductivity type, and consisting essentially of a material represented by a formula InxGayP, where 0≦x, y≦1, and x+y=1, and a light-emitting layer comprising a first cladding layer, an active layer, and a second cladding layer, which are successively provided on the second bonding layer, each of the active layer and first and second cladding layers consisting essentially of a material represented by a formula InxGayAlzP, where x+y+z=1, and 0≦x, y, z≦1.
    • 一种半导体发光器件,包括第一导电类型的第一衬底,设置在所述第一衬底上并基本上由第一导电类型的GaP材料组成的第一接合层,设置在第一接合层上的第二接合层, 与具有第一导电类型的晶体取向的第一结合层重合,并且基本上由由式InxGayP表示的材料组成,其中0 <= x,y <= 1和x + y = 1,以及光 依次设置在第二接合层上的包含第一包层,有源层和第二包覆层的发光层,所述有源层和第一和第二包层中的每一个基本上由式In x Ga y Al z P ,其中x + y + z = 1,0 <= x,y,z <= 1。