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    • 46. 发明授权
    • Source bus formation for a flash memory using silicide
    • 用于使用硅化物的闪存的源总线形成
    • US06579778B1
    • 2003-06-17
    • US09634991
    • 2000-08-08
    • Nicholas H. TripsasMark Ramsbey
    • Nicholas H. TripsasMark Ramsbey
    • H01L2176
    • H01L27/11521H01L27/115
    • A semiconductor flash memory device is formed with shallow trench isolation (STI) and a low-resistance source bus line (Vss Bus). Embodiments include forming core and peripheral field oxide regions, as by conventional STI techniques, bit lines by ion implantation, polysilicon floating gates above the channel regions and polysilicon word lines. The Vss Bus is then formed by etching away portions of the field oxide between corresponding source regions of adjacent bit lines to expose portions of the substrate, ion implanting impurities into the source regions and the exposed substrate, forming insulating spacers on the sides of the floating gates and word lines, and forming a metal silicide layer, such as titanium silicide, on the implanted source regions and exposed portions of the substrate to form a continuous conductor between the source regions. The metal silicide layer provides a low-resistance Vss, thereby improving device performance, while the implanted impurities ensure that the substrate will not short circuit to source and drain regions through the metal silicide.
    • 半导体闪速存储器件形成有浅沟槽隔离(STI)和低电阻源总线(Vss Bus)。 实施例包括如常规STI技术形成核心和外围场氧化物区域,通过离子注入的位线,在沟道区域上方的多晶硅浮动栅极和多晶硅字线。 然后通过蚀刻除去相邻位线的相应源极区域之间的场氧化物的部分以暴露衬底的部分,离子将杂质注入到源极区域和暴露的衬底中,形成Vss母线,在浮动的侧面上形成绝缘衬垫 栅极和字线,以及在注入的源极区域和衬底的暴露部分上形成诸如硅化钛的金属硅化物层,以在源极区域之间形成连续的导体。 金属硅化物层提供低电阻Vss,从而提高器件性能,而注入的杂质确保衬底不会通过金属硅化物短路到源极和漏极区。