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    • 43. 发明申请
    • NITRIDE-BASED LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 基于氮化物的发光装置及其制造方法
    • US20090095976A1
    • 2009-04-16
    • US12335845
    • 2008-12-16
    • June-o SONGTae-yeon Seong
    • June-o SONGTae-yeon Seong
    • H01L33/00
    • H01L33/42H01L33/32
    • Provided are a nitride-based light-emitting device including a transparent electrode made of a transparent conductive oxide having a higher work function than indium tin oxide and a method of manufacturing the same. The nitride-based light-emitting device has a sequentially stacked structure of a substrate, an n-type clad layer, an active layer, a p-type clad layer, and an ohmic contact layer. The ohmic contact layer is formed as a film made of a transparent conductive oxide having a higher work function than indium tin oxide or as a film made of the transparent conductive oxide doped with a metal dopant. Therefore, ohmic contact characteristics with the p-type clad layer are enhanced, thereby ensuring excellent current-voltage characteristics. Furthermore, the high light transmittance of the transparent electrode can increase the emission efficiency of the device.
    • 提供了一种氮化物系发光器件及其制造方法,该氮化物系发光器件包括由比氧化铟锡更高的功函数的透明导电氧化物制成的透明电极。 氮化物系发光器件具有基板,n型覆盖层,有源层,p型覆盖层和欧姆接触层的顺序层叠结构。 欧姆接触层形成为具有比铟锡氧化物更高的功函数的透明导电氧化物或由掺杂有金属掺杂剂的透明导电氧化物制成的膜制成的膜。 因此,与p型覆盖层的欧姆接触特性提高,从而确保优异的电流 - 电压特性。 此外,透明电极的高透光率可以提高器件的发光效率。
    • 45. 发明授权
    • Nitride light emitting device and manufacturing method thereof
    • 氮化物发光器件及其制造方法
    • US07372081B2
    • 2008-05-13
    • US11002795
    • 2004-12-03
    • June-o SongTae-yeon SeongDong-seok Leem
    • June-o SongTae-yeon SeongDong-seok Leem
    • H01L33/00
    • H01L33/42H01L33/32
    • A nitride LED having a laminated structure in which a substrate, a n-type cladding layer, an active layer, a p-type cladding layer, and a multi-ohmic contact layer are sequentially stacked, and a manufacturing method thereof, are provided. In the nitride LED, the multi-ohmic contact layer includes multiple layers of a first transparent film layer/silver/second transparent film layer. In the nitride LED and a manufacturing method thereof, ohmic contact characteristics with respect to the p-type cladding layer are enhanced, thereby exhibiting a good current-voltage characteristic. Also, since the transparent electrodes have a high light transmitting property, the light emitting efficiency of the device is increased.
    • 提供具有层叠结构的氮化物LED及其制造方法,其中衬底,n型包覆层,有源层,p型覆层和多欧姆接触层顺序堆叠。 在氮化物LED中,多欧姆接触层包括多层第一透明膜层/银/第二透明膜层。 在氮化物LED及其制造方法中,相对于p型包层的欧姆接触特性提高,从而表现出良好的电流 - 电压特性。 此外,由于透明电极具有高透光性,所以器件的发光效率提高。
    • 50. 发明申请
    • Flip-chip nitride light emitting device and method of manufacturing thereof
    • 倒装氮化物发光器件及其制造方法
    • US20050133803A1
    • 2005-06-23
    • US11016956
    • 2004-12-21
    • Tae-yeon SeongJune-o Song
    • Tae-yeon SeongJune-o Song
    • H01L21/285H01L29/221H01L33/06H01L33/32H01L33/36
    • H01L33/40H01L21/28575H01L33/32
    • A flip-chip light emitting device and a method of manufacturing thereof are provided. The flip-chip nitride light emitting device includes a substrate, an n type clad layer, an active layer, a p type clad layer, a multi ohmic contact layer, and a reflective layer, which are stacked in this order, wherein the multi ohmic contact layer is obtained by repeatedly stacking at least one stack unit of a reforming metal layer and a transparent conductive thin film, and wherein the reforming metal layer mainly contains silver (Ag). According to the flip-chip light emitting device and the method of manufacturing thereof, since the ohmic contact characteristics associated with a p type clad layer can be improved, it is possible to increase wire bonding efficiency and yield in a packaging process. In addition, since a low non-contact resistance and a good current-voltage characteristic can be obtained, it is possible to improve light emitting efficiency and to expand life time of the flip-chip light emitting device.
    • 提供了一种倒装芯片发光器件及其制造方法。 倒装氮化物发光器件包括依次堆叠的衬底,n型覆盖层,有源层,ap型覆盖层,多欧姆接触层和反射层,其中多欧姆接触 通过重复堆叠重整金属层和透明导电薄膜的至少一个堆叠单元获得层,其中重整金属层主要含有银(Ag)。 根据倒装芯片发光器件及其制造方法,由于能够提高与p型覆盖层相关的欧姆接触特性,所以能够提高封装工序中的引线接合效率和收率。 此外,由于可以获得低的非接触电阻和良好的电流 - 电压特性,所以可以提高发光效率并延长倒装芯片发光器件的使用寿命。