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    • 43. 发明授权
    • Wafer-level quasi-planarization and passivation for multi-height structures
    • 多高度结构的晶圆级准平面化和钝化
    • US06846740B2
    • 2005-01-25
    • US10460880
    • 2003-06-14
    • Hilmi Volkan DemirOnur FidanerDavid Andrew Barclay MillerVijit SabnisJun-Fei Zheng
    • Hilmi Volkan DemirOnur FidanerDavid Andrew Barclay MillerVijit SabnisJun-Fei Zheng
    • H01L21/3105H01L21/336H01L21/44H01L21/4763H01L21/768H01L21/3202
    • H01L21/76819H01L21/31058
    • Methods in accordance with the present invention provide a quasi-planarized surface between one or more semiconductor devices and at least a portion of surrounding passivation material, where the devices have different elevations above a substrate. A hard mask defines the planarized surface as the interface between the hard mask and both the passivation layer and the device, after a passivation layer etching process. The resulting planarized surface has a small to zero step height, is insensitive to passivation layer non-uniformity and etch non-uniformity, provides full passivation of the device side wall, provides protection for the device against etch-induced damage, and prevents the detrimental effects of passivation layer voids. The methods are applicable to semiconductor device fabrication for electronic and photonic/optoelectronic systems such as, but not limited to, cell phones, networking systems, high brightness (HB) LEDs, laser diodes (LDs), photodiodes, modulator diodes and multifunction solar cells.
    • 根据本发明的方法提供一个或多个半导体器件与周围钝化材料的至少一部分之间的准平面化表面,其中器件在衬底之上具有不同的高度。 在钝化层蚀刻工艺之后,硬掩模将平坦化表面定义为硬掩模与钝化层和器件之间的界面。 所得到的平坦化表面具有小至零的阶梯高度,对钝化层不均匀性和蚀刻不均匀性不敏感,提供器件侧壁的完全钝化,为器件提供防蚀蚀引起的损伤的保护,并防止有害的 钝化层空隙的影响。 该方法适用于电子和光子/光电子系统的半导体器件制造,例如但不限于蜂窝电话,网络系统,高亮度(HB)LED,激光二极管(LD),光电二极管,调制二极管和多功能太阳能电池 。
    • 44. 发明授权
    • Semiconductor etch speed modification
    • 半导体蚀刻速度修改
    • US06806204B1
    • 2004-10-19
    • US10611837
    • 2003-06-30
    • Jun-Fei ZhengJesper Hanberg
    • Jun-Fei ZhengJesper Hanberg
    • H01L21302
    • H01L21/3081H01L21/30612
    • In accordance with embodiments of the methods of the present invention, a sacrificial layer provides an etch speed modification to effectively etch multiple semiconductor devices having dissimilar materials to a common layer or substrate with a common etch process. The time to etch remove a second exposed portion is compared with the time to etch remove a first exposed portion, and a sacrificial layer is deposited on the first exposed portion having a time to etch remove substantially equal to the difference. The sacrificial layer is provided to have predetermined material composition, material property and layer thickness, among other things, to provide a desired time to etch remove. The methods also provide for self-aligned via formation providing highly defined vias by the etch removal of sacrificial material rather than direct etching of the vie. The methods also provide planarization between two or more devices.
    • 根据本发明的方法的实施例,牺牲层提供蚀刻速度修改以通过公共蚀刻工艺有效地将具有不同材料的多个半导体器件蚀刻到公共层或衬底。 将蚀刻去除第二暴露部分的时间与蚀刻时间相比较去除第一暴露部分,并且牺牲层沉积在第一暴露部分上,其蚀刻时间基本上等于该差异。 提供牺牲层以具有预定的材料组成,材料性质和层厚度,以提供蚀刻去除所需的时间。 这些方法还提供了自对准通孔形成,通过蚀刻去除牺牲材料而不是直接蚀刻,提供高度限定的通孔。 这些方法还提供两个或多个设备之间的平坦化。
    • 45. 发明授权
    • Method of making MOSFET gate electrodes with tuned work function
    • 制造具有调谐功能的MOSFET栅电极的方法
    • US06794232B2
    • 2004-09-21
    • US10383842
    • 2003-03-07
    • Jun-Fei ZhengBrian DoyleGang BaiChunlin Liang
    • Jun-Fei ZhengBrian DoyleGang BaiChunlin Liang
    • H01I21337
    • H01L21/82345H01L21/823425H01L27/088
    • Insulated gate field effect transistors having gate electrodes with at least two layers of materials provide gate electrode work function values that are similar to those of doped polysilicon, eliminate the poly depletion effect and also substantially prevent impurity diffusion into the gate dielectric. Bi-layer stacks of relatively thick Al and thin TiN for n-channel FETs and bi-layer stacks of relatively thick Pd and thin TiN, or relatively thick Pd and thin TaN for p-channel FETs are disclosed. Varying the thickness of the thin TiN or TaN layers between a first and second critical thickness may be used to modulate the work function of the gate electrode and thereby obtain the desired trade-off between channel doping and drive currents in FETs.
    • 具有至少两层材料的栅电极的绝缘栅场效应晶体管提供类似于掺杂多晶硅的栅电极功函数值,消除多余耗效应并且还基本上防止杂质扩散入栅电介质。 公开了用于n沟道FET的相对厚的Al和薄TiN的双层堆叠以及相对厚的Pd和薄TiN的双层堆叠,或者用于p沟道FET的相对厚的Pd和薄TaN。 改变第一和第二临界厚度之间的薄TiN或TaN层的厚度可以用于调制栅电极的功函数,从而在FET中的沟道掺杂和驱动电流之间获得期望的权衡。