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41. 发明授权

US07922297B2 Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor 有权
标题翻译：喷墨装置包括具有位于相应的功率晶体管上的加热器堆的硅芯片
公开(公告)号：US07922297B2
公开(公告)日：2011-04-12
申请号：US11958876
申请日：2007-12-18
申请人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1642 , B41J2/1645 , B41J2002/14387 , B41J2202/13
摘要： A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.
摘要翻译：硅芯片具有多个喷墨结构。多个喷墨结构的每个喷墨结构包括具有电加热器元件的加热器堆叠。功率晶体管电连接到电加热元件。平坦化层介于功率晶体管和加热器叠层之间。平坦化层具有形成加热器叠层的平面基面。

42. 发明申请

US20090153622A1 INK EJECTION DEVICE INCLUDING A SILICON CHIP HAVING A HEATER STACK POSITIONED OVER A CORRESPONDING POWER TRANSISTOR 有权
标题翻译：墨水喷射装置，包括具有相应功率晶体管定位的加热器堆叠的硅芯片
公开(公告)号：US20090153622A1
公开(公告)日：2009-06-18
申请号：US11958876
申请日：2007-12-18
申请人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Yimin Guan , Kristi Maggard Rowe , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1642 , B41J2/1645 , B41J2002/14387 , B41J2202/13
摘要： A silicon chip has a plurality of inkjetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.
摘要翻译：硅芯片具有多个喷墨结构。多个喷墨结构的每个喷墨结构包括具有电加热器元件的加热器堆叠。功率晶体管电连接到电加热元件。平坦化层介于功率晶体管和加热器叠层之间。平坦化层具有形成加热器叠层的平面基面。

43. 发明授权

US07267431B2 Multi-fluid ejection device 有权
标题翻译：多流体喷射装置
公开(公告)号：US07267431B2
公开(公告)日：2007-09-11
申请号：US10881961
申请日：2004-06-30
申请人： Frank Edward Anderson , Jeffery James Buchanan , Curtis Ray Droege , David Emerson Greer , Kin Ming Kwan , Gregory Alan Long , Ganesh Vinayak Phatak , Paul Timothy Spivey , Carl Edmond Sullivan , Kent Lee Ubellacker , Melissa Marie Waldeck
发明人： Frank Edward Anderson , Jeffery James Buchanan , Curtis Ray Droege , David Emerson Greer , Kin Ming Kwan , Gregory Alan Long , Ganesh Vinayak Phatak , Paul Timothy Spivey , Carl Edmond Sullivan , Kent Lee Ubellacker , Melissa Marie Waldeck
IPC分类号： B41J2/05 , B41J2/015
CPC分类号： B41J2/17513
摘要： A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.
摘要翻译：多流体和喷射头基板，其与多流体本体流体连通地连通，用于从其中喷射多个流体。多流体包括至少两个分离的流体室。独立的流体供应路径从每个流体室引导，以提供流体到喷射头基板中的多个流体流动路径。喷射头基板被附接在身体的喷射头部区域附近。喷射头基板中的流体流动路径具有大于每毫米约一个流动路径的流路密度。

44. 发明授权

US06684504B2 Method of manufacturing an imageable support matrix for printhead nozzle plates 有权
标题翻译：制造用于打印头喷嘴板的可成像支撑矩阵的方法
公开(公告)号：US06684504B2
公开(公告)日：2004-02-03
申请号：US09829158
申请日：2001-04-09
申请人： Carl Edmond Sullivan , Herbert Gordon Toews, III
发明人： Carl Edmond Sullivan , Herbert Gordon Toews, III
IPC分类号： B21D5376
CPC分类号： B41J2/1631 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1645 , Y10S29/016 , Y10T29/49401
摘要： An imageable support matrix for printhead nozzle plates and a method for manufacturing the printhead. The ink jet printhead comprises a substrate including an ink via therein; a first layer of imageable material, the first layer of imageable material having ink conducting voids therein and defining support structures adjacent the ink via; and a second layer of imageable material disposed on the first layer of imageable material, the second layer of imageable material including ink jet nozzles therein. The method includes providing a substrate; applying a first layer of imageable material on the substrate; masking the applied first layer of imageable material; and developing the masked first layer of imageable material to provide ink conducting voids in the first layer of imageable material and hardened areas of support. The method further includes creating an ink via in the substrate; applying a second layer of imageable material on the first layer of imageable material; and forming nozzles in the second layer of imageable material.
摘要翻译：用于打印头喷嘴板的可成像支撑矩阵和用于制造打印头的方法。喷墨打印头包括其中包括墨水通道的基板; 第一层可成像材料，第一层可成像材料在其中具有油墨导电空隙，并限定邻近油墨通孔的支撑结构; 以及设置在第一可成像材料层上的可成像材料的第二层，第二层可成像材料包括喷墨嘴。该方法包括提供基板; 在所述基底上施加第一层可成像材料; 掩蔽应用的可成像材料的第一层; 以及显影掩模的第一可成像材料层，以在可成像材料的第一层和硬化的支撑层中提供导墨空隙。该方法还包括在基底中产生墨通孔; 在第一可成像材料层上施加第二层可成像材料; 并在第二层成像材料中形成喷嘴。

45. 发明授权

US06267472B1 Ink jet heater chip module with sealant material 失效
标题翻译：喷墨加热器芯片模块采用密封材料
公开(公告)号：US06267472B1
公开(公告)日：2001-07-31
申请号：US09100070
申请日：1998-06-19
申请人： Colin Geoffrey Maher , Ashok Murthy , Darrin Wayne Oliver , Robert Allen Samples , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan
发明人： Colin Geoffrey Maher , Ashok Murthy , Darrin Wayne Oliver , Robert Allen Samples , Jeanne Marie Saldanha Singh , Carl Edmond Sullivan
IPC分类号： B41J205
CPC分类号： B41J2/1635 , B41J2/14024 , B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2202/03
摘要： A heater chip module is provided comprising a carrier adapted to be secured directly to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes inner side walls and a support section which together define an inner cavity. An edge feed heater chip is coupled to the carrier support section. The heater chip includes side walls. The support section includes first and second passages which define first and second paths for ink to travel from the container to the inner cavity. The inner cavity and the heater chip are sized such that a first side wall of the heater chip is spaced from a first inner side wall of the carrier and a second side wall of the heater chip is spaced from a second inner side wall of the carrier. A nozzle plate is coupled to the heater chip and the carrier. The nozzle plate has a width such that the nozzle plate extends over an outer surface of the carrier. Sealant material is provided in the inner cavity such that at least a portion of the first inner side wall of the carrier, at least a portion of the first side wall of the heater chip, a first section of the nozzle plate and the sealant material define a first sealed ink cavity for receiving ink passing through the first passage. Additional sealant material is provided in the inner cavity such that at least a portion of the second inner side wall of the carrier, at least a portion of the second side wall of the heater chip, a second section of the nozzle plate and the additional sealant material define a second sealed ink cavity for receiving ink passing through the second passage.
摘要翻译：提供一种加热器芯片模块，其包括适于直接固定到填充墨水的容器的载体，至少一个具有联接到载体的基座的加热器芯片，以及耦合到加热器芯片的至少一个喷嘴板。载体包括内侧壁和一起限定内腔的支撑部分。边缘进料加热器芯片联接到载体支撑部分。加热器芯片包括侧壁。支撑部分包括第一和第二通道，其限定用于油墨从容器行进到内腔的第一和第二路径。内腔和加热器芯片的尺寸使得加热器芯片的第一侧壁与载体的第一内侧壁间隔开，并且加热器芯片的第二侧壁与载体的第二内侧壁间隔开。喷嘴板连接到加热器芯片和载体。喷嘴板具有使得喷嘴板在载体的外表面上延伸的宽度。密封材料设置在内腔中，使得载体的第一内侧壁的至少一部分，加热器芯片的第一侧壁的至少一部分，喷嘴板的第一部分和密封材料限定用于接收通过第一通道的油墨的第一密封油墨腔。附加的密封剂材料设置在内腔中，使得载体的第二内侧壁的至少一部分，加热器芯片的第二侧壁的至少一部分，喷嘴板的第二部分和附加密封剂材料限定了用于接收通过第二通道的油墨的第二密封油墨腔。

46. 发明授权

US06267251B1 Filter assembly for a print cartridge container for removing contaminants from a fluid 失效
标题翻译：用于从液体中去除污染物的打印墨盒容器的过滤器组件
公开(公告)号：US06267251B1
公开(公告)日：2001-07-31
申请号：US08993431
申请日：1997-12-18
申请人： Carl Edmond Sullivan
发明人： Carl Edmond Sullivan
IPC分类号： B01D2905
CPC分类号： B41J2/14145 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2/17563 , B41J2002/14403
摘要： A filter is provided for filtering contaminants from a fluid passing through the filter. The filter comprises a silicon substrate having opposing first and second surfaces and a passage extending through it. A first etch resistant material layer is formed on the first substrate surface and includes at least one opening which extends through the first layer and communicates with the substrate passage. A second etch resistant material layer is formed on the second substrate surface and includes a plurality of pores which extend through the second layer and communicate with the substrate passage. The second layer defines a filter layer which filters contaminants from fluid passing through the second layer. A process for forming the filter is also provided.
摘要翻译：提供了一种过滤器，用于从通过过滤器的流体中过滤污染物。该滤波器包括具有相对的第一和第二表面的硅衬底和延伸通过它的通道。第一耐蚀刻材料层形成在第一衬底表面上，并且包括延伸穿过第一层并与衬底通道连通的至少一个开口。第二耐蚀刻材料层形成在第二衬底表面上并且包括延伸穿过第二层并与衬底通道连通的多个孔。第二层限定了过滤层，其过滤通过第二层的流体中的污染物。也提供了一种形成过滤器的方法。

47. 发明授权

US6039439A Ink jet heater chip module 失效
标题翻译：喷墨加热器芯片模块
公开(公告)号：US6039439A
公开(公告)日：2000-03-21
申请号：US100544
申请日：1998-06-19
申请人： Steven Robert Komplin , Ashok Murthy , Carl Edmond Sullivan
发明人： Steven Robert Komplin , Ashok Murthy , Carl Edmond Sullivan
IPC分类号： B41J2/14 , B41J2/05
CPC分类号： B41J2/14072 , B41J2/14024 , B41J2/1404 , B41J2002/14387
摘要： A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
摘要翻译：提供一种加热器芯片模块，其包括适于固定到填充墨水的容器的载体，至少一个加热器芯片，其具有联接到所述载体的底座，以及耦合到所述加热器芯片的至少一个喷嘴板。载体包括具有至少一个通道的支撑基板，该通道限定油墨从容器行进到加热器芯片的路径。加热器芯片在其底部固定到支撑基板的一部分。至少所述支撑基板的所述部分由具有与所述加热器芯片基座基本上相同的热膨胀系数的材料形成。柔性电路例如通过TAB键合或引线键合耦合到加热器芯片模块。

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