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    • 50. 发明授权
    • Light emitting device and light emitting device package
    • 发光器件和发光器件封装
    • US09559254B2
    • 2017-01-31
    • US13442120
    • 2012-04-09
    • Hwan Hee Jeong
    • Hwan Hee Jeong
    • H01L29/18H01L33/00H01L33/08H01L33/38H01L33/14H01L27/15H01L33/40
    • H01L33/08H01L27/153H01L33/0079H01L33/145H01L33/382H01L33/385H01L33/405H01L2224/48091H01L2924/00014
    • A light emitting device according to the embodiment includes a first light emitting structure including a first conductive type first semiconductor layer, a first active layer under the first conductive type first semiconductor layer, and a second conductive type second semiconductor layer under the first active layer; a first reflective electrode under the first light emitting structure; a second light emitting structure including a first conductive type third semiconductor layer, a second active layer under the first conductive type third semiconductor layer, and a second conductive type fourth semiconductor layer under the second active layer; a second reflective electrode under the second light emitting structure; a contact part that electrically connects the first conductive type first semiconductor layer of the first light emitting structure to the second reflective electrode; and a first insulating ion implantation layer between the contact part and the second conductive type second semiconductor layer.
    • 根据实施例的发光器件包括第一发光结构,其包括第一导电型第一半导体层,第一导电型第一半导体层下的第一有源层和位于第一有源层下的第二导电型第二半导体层; 在第一发光结构下的第一反射电极; 第二发光结构,包括第一导电类型第三半导体层,第一导电类型第三半导体层下的第二有源层和第二有源层下的第二导电类型第四半导体层; 在第二发光结构下面的第二反射电极; 将第一发光结构的第一导电型第一半导体层与第二反射电极电连接的接触部; 以及在所述接触部和所述第二导电型第二半导体层之间的第一绝缘离子注入层。