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41. 发明授权

US09735623B2 Power transmitting method and power transmitter for communication with power receiver 有权
公开(公告)号：US09735623B2
公开(公告)日：2017-08-15
申请号：US13473062
申请日：2012-05-16
申请人： Kang-Ho Byun , Kyung-Woo Lee , Young-Min Lee , Se-Ho Park , Yu-Su Kim , Sung-Ku Yeo
发明人： Kang-Ho Byun , Kyung-Woo Lee , Young-Min Lee , Se-Ho Park , Yu-Su Kim , Sung-Ku Yeo
IPC分类号： H02J17/00 , H02J5/00 , H04B5/00 , B60L11/18 , H02J7/02
CPC分类号： H02J50/12 , B60L11/182 , H02J5/005 , H02J7/025 , H02J17/00 , H02J50/40 , H02J50/60 , H02J50/80 , H04B5/0037
摘要： A method and power transmitter for efficiently controlling power transmission to one or more power receivers in a wireless multi-power transmission system are provided. The method includes performing, when a predetermined measurement cycle arrives, a load measurement; comparing a current load measurement value with a previous load measurement value; determining whether the current load measurement value is increased over the previous load measurement value by at least as much as a first predetermined threshold; gradually increasing, when the load measurement value is increased over the previous load measurement value by at least as much as the first threshold, a transmission power value until a request for a subscription to a wireless multi-power transmission network from a power reception target within a predetermined time limit; and stopping, when the request for the subscription is not received before the time limit is exceeded, power transmission to the power reception target.

42. 发明授权

US09509151B2 Wireless power receiver and control method thereof 有权
标题翻译：无线电力接收机及其控制方法
公开(公告)号：US09509151B2
公开(公告)日：2016-11-29
申请号：US13608432
申请日：2012-09-10
申请人： Kyung-Woo Lee , Eun-Tae Won , Young-Min Lee , Se-Ho Park , Noh-Gyoung Kang , Kang-Ho Byun
发明人： Kyung-Woo Lee , Eun-Tae Won , Young-Min Lee , Se-Ho Park , Noh-Gyoung Kang , Kang-Ho Byun
IPC分类号： H02J7/00 , H02J7/02 , H04B5/00 , H04W48/16 , H04W48/20
CPC分类号： H02J50/12 , H02J7/0013 , H02J7/025 , H02J50/10 , H02J50/20 , H02J50/50 , H02J50/60 , H02J50/80 , H02J2007/0001 , H02J2007/0096 , H04B5/0031 , H04B5/0037 , H04W48/16 , H04W48/20 , Y02B40/90
摘要： Methods and apparatus are provided for controlling a wireless power receiver for wirelessly receiving power. A drive power for driving the wireless power receiver is received from a wireless power transmitter. A communication network is established with the wireless power transmitter. A wireless power network that is controlled by the wireless power transmitter is joined. A charge power is received from the wireless power transmitter.
摘要翻译：提供了用于控制用于无线接收电力的无线电力接收器的方法和装置。从无线电力发射机接收用于驱动无线电力接收机的驱动电源。与无线电力发射机建立通信网络。由无线电力发射机控制的无线电力网络被连接起来。从无线电力发射机接收到充电电力。

43. 发明申请

US20080206998A1 SEMICONDUCTOR FABRICATION APPARATUSES TO PERFORM SEMICONDUCTOR ETCHING AND DEPOSITION PROCESSES AND METHODS OF FORMING SEMICONDUCTOR DEVICE USING THE SAME 有权
标题翻译：用于实现半导体蚀刻和沉积工艺的半导体制造装置和使用其形成半导体器件的方法
公开(公告)号：US20080206998A1
公开(公告)日：2008-08-28
申请号：US12033266
申请日：2008-02-19
申请人： Kyung-Woo Lee , Jin-Sung Kim , Joo-Byoung Yoon , Yeong-Cheol Lee , Sang-Jun Park , Hee-Kyeong Jeon
发明人： Kyung-Woo Lee , Jin-Sung Kim , Joo-Byoung Yoon , Yeong-Cheol Lee , Sang-Jun Park , Hee-Kyeong Jeon
IPC分类号： H01L21/3065 , H01L21/30
CPC分类号： H01L21/02087 , H01J37/32009 , H01J37/32587 , H01L21/02057 , H01L21/0209
摘要： A semiconductor fabrication apparatus and a method of fabricating a semiconductor device using the same performs semiconductor etching and deposition processes at an edge of a semiconductor substrate after disposing the semiconductor substrate at a predetermined place in the semiconductor fabrication apparatus. The semiconductor fabrication apparatus has lower, middle and upper electrodes sequentially stacked. The semiconductor substrate is disposed on the middle electrode. Semiconductor etching and deposition processes are performed on the semiconductor substrate in the semiconductor fabrication apparatus. The semiconductor fabrication apparatus forms electrical fields along an edge of the middle electrode during performance of the semiconductor etching and deposition processes.
摘要翻译：半导体制造装置和使用该半导体制造装置的半导体装置的制造方法在将半导体基板设置在半导体制造装置中的预定位置之后，在半导体基板的边缘进行半导体蚀刻和沉积处理。半导体制造装置具有顺序堆叠的下部，中间和上部电极。半导体衬底设置在中间电极上。在半导体制造装置中的半导体衬底上进行半导体蚀刻和沉积处理。半导体制造装置在半导体蚀刻和沉积工艺的执行期间沿着中间电极的边缘形成电场。

44. 发明授权

US07375003B2 Methods of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07375003B2
公开(公告)日：2008-05-20
申请号：US11240048
申请日：2005-09-30
申请人： Joo-Byoung Yoon , Jin-Sung Kim , Kyung-Woo Lee , Yeong-Cheol Lee , Sang-Jun Park , Hwan-Shik Park
发明人： Joo-Byoung Yoon , Jin-Sung Kim , Kyung-Woo Lee , Yeong-Cheol Lee , Sang-Jun Park , Hwan-Shik Park
IPC分类号： H01L21/20
CPC分类号： H01L21/76897 , H01L27/10852 , H01L28/91
摘要： In a method of manufacturing a semiconductor device including a capacitor, a first mold layer is formed on a semiconductor substrate. The first mold layer is partially etched to form a first mold layer pattern including an opening for a capacitor. A first lower electrode layer is formed on the first mold layer pattern. A second lower electrode layer including a plurality of first pores is formed on the first lower electrode layer and in the opening. Upper portions of the first lower electrode layer and the second lower electrode layer are removed to form a first lower electrode and a second lower electrode in the opening. A dielectric layer and an upper electrode are successively formed on the first lower electrode and the second lower electrode. Therefore, a capacitor having an enhanced capacitance may be obtained.
摘要翻译：在制造包括电容器的半导体器件的方法中，在半导体衬底上形成第一模制层。部分蚀刻第一模具层以形成包括用于电容器的开口的第一模具层图案。第一下电极层形成在第一模层图案上。包括多个第一孔的第二下电极层形成在第一下电极层和开口中。去除第一下电极层和第二下电极层的上部，以在开口中形成第一下电极和第二下电极。电介质层和上电极依次形成在第一下电极和第二下电极上。因此，可以获得具有增大的电容的电容器。

45. 发明授权

US09024484B2 Method and apparatus for controlling wireless power of a receiver in a wireless power transmission/reception system 有权
标题翻译：用于控制无线电力发送/接收系统中的接收机的无线电力的方法和装置
公开(公告)号：US09024484B2
公开(公告)日：2015-05-05
申请号：US13490963
申请日：2012-06-07
申请人： Se-Ho Park , Young-Min Lee , Kyung-Woo Lee , Kang-Ho Byun
发明人： Se-Ho Park , Young-Min Lee , Kyung-Woo Lee , Kang-Ho Byun
IPC分类号： H01F27/42 , H02J5/00 , H04B5/00
CPC分类号： H02J5/005 , H02J7/025 , H02J50/12 , H02J50/40 , H02J50/80 , H04B5/0037
摘要： A method and apparatus are provided for controlling power of a receiver in a wireless power transmission/reception system, wherein a wireless power quantity supplied to receivers from a transmitter is controlled through communication between the receivers. The method includes receiving required power information transmitted from a joining receiver in a charging area of a transmitter; determining whether the transmitter is capable of supplying required power to the joining receiver based on the required power information; and requesting the joining receiver to maintain a standby state, when the transmitter is not capable of supplying the required power to the joining receiver.
摘要翻译：提供了一种用于控制无线电力发送/接收系统中的接收机的功率的方法和装置，其中通过接收机之间的通信来控制从发射机提供给接收机的无线电力量。该方法包括从发射机的充电区域接收从加入接收机发送的所需功率信息; 确定所述发射机是否能够基于所需的功率信息向所述加入接收机提供所需的功率; 并且当所述发射机不能够向所述加入接收机提供所需电力时，请求所述加入接收机保持待机状态。

46. 发明授权

US08197637B2 Semiconductor fabrication apparatuses to perform semiconductor etching and deposition processes and methods of forming semiconductor device using the same 有权
标题翻译：用于执行半导体蚀刻和沉积工艺的半导体制造装置以及使用其形成半导体器件的方法
公开(公告)号：US08197637B2
公开(公告)日：2012-06-12
申请号：US12033266
申请日：2008-02-19
申请人： Kyung-Woo Lee , Jin-Sung Kim , Joo-Byoung Yoon , Yeong-Cheol Lee , Sang-Jun Park , Hee-Kyeong Jeon
发明人： Kyung-Woo Lee , Jin-Sung Kim , Joo-Byoung Yoon , Yeong-Cheol Lee , Sang-Jun Park , Hee-Kyeong Jeon
IPC分类号： H01L21/33
CPC分类号： H01L21/02087 , H01J37/32009 , H01J37/32587 , H01L21/02057 , H01L21/0209
摘要： A semiconductor fabrication apparatus and a method of fabricating a semiconductor device using the same performs semiconductor etching and deposition processes at an edge of a semiconductor substrate after disposing the semiconductor substrate at a predetermined place in the semiconductor fabrication apparatus. The semiconductor fabrication apparatus has lower, middle and upper electrodes sequentially stacked. The semiconductor substrate is disposed on the middle electrode. Semiconductor etching and deposition processes are performed on the semiconductor substrate in the semiconductor fabrication apparatus. The semiconductor fabrication apparatus forms electrical fields along an edge of the middle electrode during performance of the semiconductor etching and deposition processes.
摘要翻译：半导体制造装置和使用该半导体制造装置的半导体装置的制造方法在将半导体基板设置在半导体制造装置中的预定位置之后，在半导体基板的边缘进行半导体蚀刻和沉积处理。半导体制造装置具有顺序堆叠的下部，中间和上部电极。半导体衬底设置在中间电极上。在半导体制造装置中的半导体衬底上进行半导体蚀刻和沉积处理。半导体制造装置在半导体蚀刻和沉积工艺的执行期间沿着中间电极的边缘形成电场。

47. 发明申请

US20060281834A1 Method for preparing microcapsule by miniemulsion polymerization 审中-公开
标题翻译：微乳液聚合制备微胶囊的方法
公开(公告)号：US20060281834A1
公开(公告)日：2006-12-14
申请号：US10563523
申请日：2004-07-03
申请人： Kyung-Woo Lee , Yang-Seung Jeong , Hyun-Chul Ha
发明人： Kyung-Woo Lee , Yang-Seung Jeong , Hyun-Chul Ha
IPC分类号： C09D151/00
CPC分类号： B01J13/14
摘要： Provided is a method for preparing uniformly sized and shaped, mono-dispersed microcapsules using miniemulsion polymerization. In microcapsules prepared by the method, a liquid or solid core encapsulated by a polymer shell has 10 to 80% by volume of the microcapsules. Since miniemulsion particles produced at an early stage of the method are stable, an organic material which is well dissolved in monomer particles and has a higher interfacial tension with water, relative to the polymer shell, can be uniformly positioned in polymer particles. Furthermore, when a crosslinking agent is added during the polymerization, single-core microcapsules can be obtained. In addition, use of an oil-soluble initiator can prevent formation of secondary particles and addition of a secondary initiator during the polymerization can increase the yield of the uniformly sized and shaped microcapsules.
摘要翻译：提供了使用细乳液聚合制备均匀尺寸且成形的单分散微胶囊的方法。在通过该方法制备的微胶囊中，由聚合物壳包封的液体或固体核具有10至80体积％的微胶囊。由于在该方法的早期阶段产生的微乳液颗粒是稳定的，所以相对于聚合物壳，良好溶解在单体颗粒中并且与水具有较高界面张力的有机材料可以均匀地定位在聚合物颗粒中。此外，当在聚合过程中加入交联剂时，可以获得单核微胶囊。此外，使用油溶性引发剂可以防止二次粒子的形成，并且在聚合过程中添加二次引发剂可以提高均匀尺寸和形状的微胶囊的产率。

48. 发明授权

US09054547B2 Communication method and apparatus in wireless recharging system 有权
标题翻译：无线充电系统中的通信方法和装置
公开(公告)号：US09054547B2
公开(公告)日：2015-06-09
申请号：US13604000
申请日：2012-09-05
申请人： Kang-Ho Byun , Se-Ho Park , Kyung-Woo Lee
发明人： Kang-Ho Byun , Se-Ho Park , Kyung-Woo Lee
IPC分类号： H04B7/24 , H04B5/00 , H04M1/00 , H02J5/00
CPC分类号： H02J50/12 , H02J5/005 , H02J50/80 , H02J50/90
摘要： A method of performing communication between a wireless power transmitter and a wireless power receiver, which includes performing load detection by detecting wireless power provided by the wireless power transmitter being applied to the wireless power receiver; setting up a common channel having a predetermined first frequency for establishing a connection with the wireless power receiver, which is performed by the wireless power transmitter; establishing the connection with the wireless power receiver using the common channel; determining, from among available channels, a selection channel having an optimal condition for communicating with the wireless power receiver and a predetermined second frequency through use of the common channel; and performing data transmission and reception with the wireless power receiver through the selection channel.
摘要翻译：一种执行无线电力发射机与无线电力接收机之间的通信的方法，该方法包括：通过检测由所述无线电力发射机提供的无线电力来施加负载检测; 设置具有预定的第一频率的公共信道，用于建立与由所述无线电力发射机执行的所述无线电力接收机的连接; 使用公共信道建立与无线电力接收机的连接; 从可用信道中，确定具有通过使用所述公共信道与所述无线电力接收机进行通信的最佳条件的选择信道和预定的第二频率; 并通过选择信道与无线电力接收机进行数据发送和接收。

49. 发明授权

US08652342B2 Semiconductor fabrication apparatuses to perform semiconductor etching and deposition processes and methods of forming semiconductor device using the same 有权
标题翻译：用于执行半导体蚀刻和沉积工艺的半导体制造装置以及使用其形成半导体器件的方法
公开(公告)号：US08652342B2
公开(公告)日：2014-02-18
申请号：US13468080
申请日：2012-05-10
申请人： Kyung-Woo Lee , Jin-Sung Kim , Joo-Byoung Yoon , Yeong-Cheol Lee , Sang-Jun Park , Hee-Kyeong Jeon
发明人： Kyung-Woo Lee , Jin-Sung Kim , Joo-Byoung Yoon , Yeong-Cheol Lee , Sang-Jun Park , Hee-Kyeong Jeon
IPC分类号： B44C1/22 , C03C25/68 , C23F1/00
CPC分类号： H01L21/02087 , H01J37/32009 , H01J37/32587 , H01L21/02057 , H01L21/0209
摘要： A semiconductor fabrication apparatus and a method of fabricating a semiconductor device using the same performs semiconductor etching and deposition processes at an edge of a semiconductor substrate after disposing the semiconductor substrate at a predetermined place in the semiconductor fabrication apparatus. The semiconductor fabrication apparatus has lower, middle and upper electrodes sequentially stacked. The semiconductor substrate is disposed on the middle electrode. Semiconductor etching and deposition processes are performed on the semiconductor substrate in the semiconductor fabrication apparatus. The semiconductor fabrication apparatus forms electrical fields along an edge of the middle electrode during performance of the semiconductor etching and deposition processes.
摘要翻译：半导体制造装置和使用该半导体制造装置的半导体装置的制造方法在将半导体基板设置在半导体制造装置中的预定位置之后，在半导体基板的边缘进行半导体蚀刻和沉积处理。半导体制造装置具有顺序堆叠的下部，中间和上部电极。半导体衬底设置在中间电极上。在半导体制造装置中的半导体衬底上进行半导体蚀刻和沉积处理。半导体制造装置在半导体蚀刻和沉积工艺的执行期间沿着中间电极的边缘形成电场。

50. 发明申请

US20130057079A1 APPARATUS AND METHOD OF CONTROLLING WIRELESS POWER TRANSMISSION 审中-公开
标题翻译：控制无线电力传输的装置和方法
公开(公告)号：US20130057079A1
公开(公告)日：2013-03-07
申请号：US13605381
申请日：2012-09-06
申请人： Se-Ho PARK , Ki-Hyun Kim , Joon-II Kim , Jin-Hyoung Park , Kyung-Woo Lee , Woo-Ram Lee
发明人： Se-Ho PARK , Ki-Hyun Kim , Joon-II Kim , Jin-Hyoung Park , Kyung-Woo Lee , Woo-Ram Lee
IPC分类号： H02J17/00
CPC分类号： H02J7/00 , H02J7/025 , H02J50/12 , H02J50/40 , H02J2007/0096 , H04B5/0031 , H04B5/0037 , H04B5/0081
摘要： An apparatus for controlling wireless power transmission includes a near-field wireless communication antenna for receiving wireless power transmission control signals from a power transmitting device at a communication frequency, a near-field wireless communication Integrated Circuit (IC) for delivering wireless power transmission control messages based on the wireless power transmission control signals received through the near-field wireless communication antenna to a power IC, a Wireless Power Transmission (WPT) coil for resonating at a frequency band corresponding to a resonant frequency of the power transmitting device, to receive power supplied from the power transmitting device, and the power IC for controlling output of a constant voltage, using the supply power received by the WPT coil, based on the wireless power transmission control messages from the near-field wireless communication IC.
摘要翻译：用于控制无线电力传输的装置包括用于从通信频率的功率发送装置接收无线电力传输控制信号的近场无线通信天线，用于传送无线电力传输控制消息的近场无线通信集成电路（IC）基于通过近场无线通信天线向电力IC接收的无线电力传输控制信号，用于在对应于电力发送装置的谐振频率的频带谐振的无线电力传输（WPT）线圈，以接收电力基于来自近场无线通信IC的无线功率传输控制消息，使用由WPT线圈接收的供电功率，从电力发送装置供给的电力IC和用于控制恒定电压的电力IC。

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