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41. 发明授权

US5273852A Electrophotographic photoreceptor employing polysilane-type carrier transfer polymeric material 失效
标题翻译：使用聚硅烷型载体转移聚合材料的电子照相感光体
公开(公告)号：US5273852A
公开(公告)日：1993-12-28
申请号：US848099
申请日：1992-03-09
申请人： Shigeki Takenouchi , Kiyoshi Tamaki , Hideyuki Matsumoto
发明人： Shigeki Takenouchi , Kiyoshi Tamaki , Hideyuki Matsumoto
IPC分类号： C08G77/48 , C08G77/60 , G03G5/05 , G03G5/07 , G03G5/04
CPC分类号： C08G77/60 , G03G5/0578
摘要： An electrophotographic photoreceptor is disclosed. The photoreceptor comprises a conductive support and provided thereon, a layer comprising a carrier generating material and a polymer having a repetition unit represented by the following formula (1); ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 independently represent a hydrogen atom, an alkyl group, an alkoxy group, an alkenyl group, an aryl group, an alkylsilyl group or an arylsilyl group, and n is a natural number.
摘要翻译：公开了一种电子照相感光体。感光体包括导电支撑体，其上设有包含载体生成材料的层和具有由下式（1）表示的重复单元的聚合物; 式（1）其中R 1，R 2，R 3和R 4独立地表示氢原子，烷基，烷氧基，烯基，芳基，烷基甲硅烷基或芳基甲硅烷基，n是自然数。

42. 发明授权

US08938002B2 Data processing apparatus, data processing method, and program 有权
标题翻译：数据处理装置，数据处理方法和程序
公开(公告)号：US08938002B2
公开(公告)日：2015-01-20
申请号：US13380758
申请日：2010-06-23
申请人： Hideyuki Matsumoto , Yuichi Mizutani
发明人： Hideyuki Matsumoto , Yuichi Mizutani
IPC分类号： G06F12/00 , H04N7/173 , H04H40/90 , H04H60/11 , H04N7/167 , H04N21/434 , H04N21/438 , H04N21/44
CPC分类号： H04N7/173 , H04H40/90 , H04H60/11 , H04N7/167 , H04N21/4347 , H04N21/4383 , H04N21/44004
摘要： A data processing apparatus, a data processing method, and a program that are configured to prevent (or lower) the increase in scale and cost of the apparatus. A read/write control portion executes read/write control in which slots subject to extraction of two or more slots in one frame that is a collection of two or more slots each of which is a unit of error correction coding are written to a ring buffer and the slots subject to extraction in one frame written to the ring buffer are read within the unit time. When slots subject to extraction are changed, an output portion executes output processing in which dummy data outputted from a dummy data output portion are outputted with a timing immediately before a change start frame that is a frame from which the change of slots subject to extraction is started and, slots subject to extraction read from the ring buffer are outputted for frames subsequent to the change start frame. The present disclosure is applicable to reception apparatuses for receiving BS digital broadcasting, for example.
摘要翻译：一种数据处理装置，数据处理方法和程序，被配置为防止（或降低）装置的规模和成本的增加。读/写控制部分执行读/写控制，其中在一帧中作为两个或更多个时隙的集合的两个或更多个时隙中的两个或更多个时隙被提取的时隙，每个时隙都是纠错编码的单位，被写入环形缓冲器并且在单位时间内读取在写入环形缓冲器的一帧中被提取的时隙。当进行提取的时隙发生改变时，输出部分执行输出处理，其中从伪数据输出部分输出的虚拟数据以紧邻改变开始帧之前的定时被输出，该改变开始帧是从其提取的时隙的改变是开始，并且从改变开始帧之后的帧输出从环形缓冲器读取的提取的时隙。例如，本公开可应用于接收BS数字广播的接收装置。

43. 发明授权

US08329282B2 Power transmission belt and method of manufacturing a power transmission belt 有权
标题翻译：动力传动皮带及动力传动皮带的制造方法
公开(公告)号：US08329282B2
公开(公告)日：2012-12-11
申请号：US12150436
申请日：2008-04-28
申请人： Yosuke Sueto , Hideyuki Matsumoto
发明人： Yosuke Sueto , Hideyuki Matsumoto
IPC分类号： B32B3/00 , D02G3/00 , F16G1/00 , F16G5/00 , F16G9/00
CPC分类号： F16G1/10 , F16G1/28 , F16G5/08 , F16G5/20 , Y10T428/24 , Y10T428/24479 , Y10T428/2457 , Y10T428/24612 , Y10T428/2933
摘要： A power transmission belt having a body made at least in part from ethylene-α-olefin rubber. At least one load carrying member is embedded in the ethylene-α-olefin rubber. First, second and third films are formed on the load carrying member. The first film is made from at least one of an isocyanate compound and an epoxy compound, the second film from polybutadiene rubber, and the third film from an ethylene-propylene-diene terpolymer.
摘要翻译：一种动力传动带，其具有至少部分由乙烯-α-烯烃橡胶制成的主体。在乙烯-α-烯烃橡胶中包含至少一个承载构件。首先，在承载构件上形成第二和第三膜。第一膜由异氰酸酯化合物和环氧化合物中的至少一种，来自聚丁二烯橡胶的第二膜和来自乙烯 - 丙烯 - 二烯三元共聚物的第三膜制成。

44. 发明授权

US08227971B2 Ultra-high-pressure mercury lamp 有权
标题翻译：超高压汞灯
公开(公告)号：US08227971B2
公开(公告)日：2012-07-24
申请号：US13183526
申请日：2011-07-15
申请人： Hidehiro Kohno , Hideyuki Matsumoto
发明人： Hidehiro Kohno , Hideyuki Matsumoto
IPC分类号： H01J5/58
CPC分类号： H01J61/025 , H01J5/50 , H01J5/58 , H01J9/34 , H01J61/86
摘要： An ultra-high-pressure mercury lamp according to various embodiments is an ultra-high-pressure mercury lamp in which a luminous tube employing a quartz bulb is attached to a neck part of a reflector by injecting first cement, and a metal base is attached to the neck-part end of the luminous tube by injecting second cement, wherein, if a is the outer diameter of the first cement and second cement after injection, b is the total axial depth of the first cement and second cement after injection, and c is the outer diameter of the quartz bulb in the vicinity of the luminous tube where the metal base is attached, the following relationships are satisfied: 1.3
摘要翻译：根据各种实施例的超高压汞灯是一种超高压汞灯，其中使用石英灯泡的发光管通过注射第一水泥附着到反射器的颈部，并且附接金属基底通过注射第二水泥到发光管的颈部端部，其中如果a是注射后的第一水泥和第二水泥的外径，则b是注射后第一水泥和第二水泥的总轴向深度， c是附着金属基底的发光管附近的石英球的外径，满足以下关系：1.3

45. 发明授权

US08026663B2 Triphenylene compounds, method of manufacturing the same and organic electroluminescent devices employing the same 有权
标题翻译：三亚苯基化合物，其制造方法和使用其的有机电致发光器件
公开(公告)号：US08026663B2
公开(公告)日：2011-09-27
申请号：US11576593
申请日：2005-10-05
申请人： Hideyuki Matsumoto , Soichiro Kyushin , Keisuke Negishi , Youhei Ono , Manabu Uchida , Hidefumi Oomori
发明人： Hideyuki Matsumoto , Soichiro Kyushin , Keisuke Negishi , Youhei Ono , Manabu Uchida , Hidefumi Oomori
IPC分类号： H01L51/54 , C09K11/06
CPC分类号： H01L51/0094 , C07F7/0805 , C09K11/06 , C09K2211/1011 , H01L51/0054 , H01L51/0076 , H01L51/0085 , H01L51/5016 , Y10S428/917
摘要： The present invention provides a novel compound represented by general formula (I) below, a method of manufacturing the same and an organic electroluminescent device employing the same: where R1 to R6 are independent of one another and are each a hydrogen atom or a substituent represented by general formula (II) below, and at least one of R1 to R6 is a substituent represented by general formula (II): —C≡C—SiRaRbRc (II) where Ra, Rb and Rc are independent of one another and are each an aliphatic hydrocarbon group having 1 to 10 carbon atoms or an aromatic hydrocarbon group.
摘要翻译：本发明提供由下述通式（I）表示的新型化合物及其制备方法和使用该化合物的有机电致发光器件：其中R 1至R 6彼此独立并且各自为氢原子或代表的取代基（II）表示的取代基，R 1〜R 6中的至少一个为通式（II）表示的取代基：-C≡C-SiR a R b R c（II）其中Ra，Rb和Rc彼此独立，各自独立地表示碳原子数为1〜10的脂肪族烃基或芳香族烃基。

46. 发明申请

US20110175634A1 FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
公开(公告)号：US20110175634A1
公开(公告)日：2011-07-21
申请号：US13075666
申请日：2011-03-30
申请人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
发明人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
IPC分类号： G01R31/3187 , G01R31/20
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

47. 发明申请

US20100304510A1 FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 有权
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20100304510A1
公开(公告)日：2010-12-02
申请号：US12853360
申请日：2010-08-10
申请人： Masayoshi OKAMOTO , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
发明人： Masayoshi OKAMOTO , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
IPC分类号： H01L21/66
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.
摘要翻译：为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

48. 发明申请

US20090130785A1 MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20090130785A1
公开(公告)日：2009-05-21
申请号：US11719112
申请日：2004-11-18
申请人： Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka
发明人： Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Masayoshi Okamoto , Yasunori Narizuka
IPC分类号： H01L21/66 , G01R31/26
CPC分类号： G01R1/0735 , G01R3/00
摘要： As the thickness of the card holder for preventing warping of a multilayered wiring substrate 1 is increased, there occurs a problem that a thin film sheet 2 is buried in a card holder and secure contact between probes 7 and test pads cannot be realized. For its prevention, the thin film sheet 2 and a bonding ring 6 are bonded in a state where a tensile force is applied only to the central region IA of the thin film sheet 2, and a tensile force is not applied to an outer peripheral region OA. Then, the height of the bonding ring 6 defining the height up to the probe surface of the thin film sheet 2 is increased, thereby increasing the height up to the probe surface of the thin film sheet 2.
摘要翻译：随着用于防止多层布线基板1翘曲的卡夹的厚度增加，存在薄膜片2被埋在卡夹中并且不能实现探针7和测试垫之间的牢固接触的问题。为了防止，薄膜片2和接合环6在仅向薄膜片2的中心区域IA施加张力的状态下接合，并且拉伸力不施加到外围区域 OA。然后，限定高达薄膜片2的探针表面的高度的接合环6的高度增加，从而增加高达薄膜片2的探针表面的高度。

49. 发明授权

US07517707B2 Manufacturing method of semiconductor integrated circuit device and probe card 有权
标题翻译：半导体集成电路器件和探针卡的制造方法
公开(公告)号：US07517707B2
公开(公告)日：2009-04-14
申请号：US11783778
申请日：2007-04-12
申请人： Masayoshi Okamoto , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Akira Shimase
发明人： Masayoshi Okamoto , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Akira Shimase
IPC分类号： H01L31/26
CPC分类号： G01R3/00 , G01R1/07307
摘要： Electrical testing is to be performed on a semiconductor integrated circuit device which the test pads formed. To facilitate such testing, the method of manufacture of the semiconductor integrated circuit device employs a probe card which has two or more contact terminals which can contact two or more electrodes. This probe card includes, in opposition to a wiring substrate of the semiconductor integrated circuit device in which a first wiring is formed, a first sheet having two or more contact terminals to contact the two or more electrodes; a second wiring electrically connected to the two or more contact terminals and the first wiring; and first dummy wirings which are near the region of formation of the two or more contact terminals, are arranged to a non-forming region of the second wiring, and do not participate in signal transfer.
摘要翻译：电测试将在形成测试焊盘的半导体集成电路器件上进行。为了便于这种测试，半导体集成电路器件的制造方法采用具有两个或更多个能够接触两个或更多个电极的接触端子的探针卡。该探针卡与形成有第一布线的半导体集成电路器件的布线基板相对应，具有接触两个以上的电极的两个以上的接触端子的第一片; 电连接到所述两个或更多个接触端子和所述第一布线的第二布线; 并且在两个或多个接触端子的形成区域附近的第一虚拟布线被布置到第二布线的非形成区域，并且不参与信号传递。

50. 发明申请

US20070190671A1 Manufacturing method of semiconductor integrated circuit device and probe card 有权
标题翻译：半导体集成电路器件和探针卡的制造方法
公开(公告)号：US20070190671A1
公开(公告)日：2007-08-16
申请号：US11783778
申请日：2007-04-12
申请人： Masayoshi Okamoto , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Akira Shimase
发明人： Masayoshi Okamoto , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Yasuhiro Motoyama , Akira Shimase
IPC分类号： H01L21/66
CPC分类号： G01R3/00 , G01R1/07307
摘要： Electrical testing is to be performed on a semiconductor integrated circuit device which the test pads formed. To facilitate such testing, the method of manufacture of the semiconductor integrated circuit device employs a probe card which has two or more contact terminals which can contact two or more electrodes. This probe card includes, in opposition to a wiring substrate of the semiconductor integrated circuit device in which a first wiring is formed, a first sheet having two or more contact terminals to contact the two or more electrodes; a second wiring electrically connected to the two or more contact terminals and the first wiring; and first dummy wirings which are near the region of formation of the two or more contact terminals, are arranged to a non-forming region of the second wiring, and do not participate in signal transfer.
摘要翻译：电测试将在形成测试焊盘的半导体集成电路器件上进行。为了便于这种测试，半导体集成电路器件的制造方法采用具有两个或更多个能够接触两个或更多个电极的接触端子的探针卡。该探针卡与形成有第一布线的半导体集成电路器件的布线基板相对应，具有接触两个以上的电极的两个以上的接触端子的第一片; 电连接到所述两个或更多个接触端子和所述第一布线的第二布线; 并且在两个或多个接触端子的形成区域附近的第一虚拟布线被布置到第二布线的非形成区域，并且不参与信号传递。

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