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    • 43. 发明授权
    • Method of fabricating thin film transistor
    • 制造薄膜晶体管的方法
    • US07795082B2
    • 2010-09-14
    • US11741273
    • 2007-04-27
    • Tae-Hoon YangKi-Yong LeeJin-Wook SeoByoung-Keon Park
    • Tae-Hoon YangKi-Yong LeeJin-Wook SeoByoung-Keon Park
    • H01L21/00
    • H01L21/02672H01L21/02488H01L21/02532H01L21/3226H01L27/1277H01L27/1288
    • A method of fabricating a CMOS thin film transistor includes: providing a substrate; forming an amorphous silicon layer on the substrate; performing a first annealing process on the substrate and crystallizing the amorphous silicon layer into a polysilicon layer; patterning the polysilicon layer to form first and second semiconductor layers; implanting first impurities into the first and second semiconductor layers; implanting second impurities into the first or second semiconductor layer; and performing a second annealing process on the semiconductor layers to remove the metal catalyst remaining in the first or second semiconductor layer, on which the second impurities are implanted, wherein the first impurities are implanted at a dose of 6×1013/cm2 to 5×1015/cm2, and the second impurities are implanted at a dose of 1×1011/cm2 to 3×1015/cm2.
    • 制造CMOS薄膜晶体管的方法包括:提供衬底; 在所述基板上形成非晶硅层; 在所述衬底上进行第一退火处理并将所述非晶硅层结晶成多晶硅层; 图案化多晶硅层以形成第一和第二半导体层; 将第一杂质注入到第一和第二半导体层中; 将第二杂质注入第一或第二半导体层; 以及对所述半导体层进行第二退火处理,以去除留在其中注入所述第二杂质的所述第一或第二半导体层中的金属催化剂,其中所述第一杂质以6×10 13 / cm 2至5× 1015 / cm2,第1杂质以1×10 11 / cm 2的剂量注入3×1015 / cm 2。
    • 49. 发明授权
    • Fabrication method of thin film transistor
    • 薄膜晶体管的制造方法
    • US07205215B2
    • 2007-04-17
    • US11011580
    • 2004-12-15
    • Byoung-Keon ParkJin-Wook SeoTae-Hoon YangKi-Yong Lee
    • Byoung-Keon ParkJin-Wook SeoTae-Hoon YangKi-Yong Lee
    • H01L21/20H01L21/36
    • H01L21/02672H01L21/02532H01L21/02678H01L21/2026H01L27/1277H01L27/1296H01L29/66757
    • The present invention provides a fabrication method of thin film transistor including a step of forming an amorphous silicon layer on a substrate, a step of forming a capping layer on the amorphous silicon layer, a step of forming a metal catalyst layer on the capping layer, a step of diffusing metal catalyst by selectively irradiating a laser beam onto the metal catalyst layer, and a step of crystallizing the amorphous silicon layer. The present invention has an advantage that a fabrication method of thin film transistor is provided, wherein the fabrication method of thin film transistor improves characteristics of device and obtains uniformity of the device by uniformly controlling diffusion of low concentration of metal catalyst through selective irradiation of laser beam and controlling size of grains and crystal growing position and direction in crystallization of amorphous silicon layer using super grain silicon method.
    • 本发明提供一种薄膜晶体管的制造方法,包括在基板上形成非晶硅层的步骤,在非晶硅层上形成覆盖层的步骤,在覆盖层上形成金属催化剂层的步骤, 通过选择性地将激光束照射到金属催化剂层上来扩散金属催化剂的步骤和使非晶硅层结晶的步骤。 本发明的优点在于,提供薄膜晶体管的制造方法,其中薄膜晶体管的制造方法通过选择性地照射激光来均匀地控制低浓度的金属催化剂的扩散,从而提高器件的特性并获得器件的均匀性 使用超晶格硅法,晶粒和晶粒生长位置和非晶硅层结晶方向的控制尺寸。