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    • 43. 发明授权
    • Method of manufacturing semiconductor probe having resistive tip
    • 制造具有电阻尖端的半导体探针的方法
    • US07419843B2
    • 2008-09-02
    • US11212605
    • 2005-08-29
    • Chul-min ParkHong-sik ParkHyoung-soo KoSeung-bum Hong
    • Chul-min ParkHong-sik ParkHyoung-soo KoSeung-bum Hong
    • H01L21/00
    • G01Q70/10G01Q70/16
    • A method of manufacturing a semiconductor probe having a resistive tip. The method includes forming first and second mask films having a rectangular shape on a silicon substrate, first etching an upper surface of the silicon substrate, forming a third mask film corresponding to a width of a tip neck by etching the first mask film, forming the width of the tip neck to a predetermined width by second etching of the silicon substrate using the third mask film as a mask, and forming a peak forming portion of the tip by annealing the silicon substrate after removing the third mask film. A semiconductor probe having a uniform height and tips having a uniform neck width can be manufactured.
    • 一种制造具有电阻尖端的半导体探针的方法。 该方法包括在硅衬底上形成具有矩形形状的第一和第二掩模膜,首先蚀刻硅衬底的上表面,通过蚀刻第一掩模膜形成与尖端颈部的宽度相对应的第三掩模膜,形成 通过使用第三掩模膜作为掩模对硅衬底进行第二次蚀刻,使尖端颈部的宽度达到预定宽度,并且在除去第三掩模膜之后通过退火硅衬底来形成尖端的峰形成部分。 可以制造具有均匀高度的半导体探针和具有均匀颈部宽度的尖端。
    • 48. 发明申请
    • Semiconductor probe with resistive tip and method of fabricating the same
    • 具有电阻尖端的半导体探针及其制造方法
    • US20060060779A1
    • 2006-03-23
    • US11219732
    • 2005-09-07
    • Hong-sik ParkKyoung-lock BaeckJu-hwan JungHyoung-soo KoChul-min ParkSeung-bum Hong
    • Hong-sik ParkKyoung-lock BaeckJu-hwan JungHyoung-soo KoChul-min ParkSeung-bum Hong
    • G21K7/00
    • G11B9/1409G01Q60/30Y10S977/875Y10S977/878Y10S977/879
    • A semiconductor probe with a resistive tip, and a method of fabricating the semiconductor probe. The method includes forming a stripe-shaped mask layer on a substrate doped with a first impurity, and forming first and second electrode regions by heavily doping portions of the substrate not covered by the mask layer with a second impurity opposite in polarity to the first impurity; annealing the substrate to decrease a gap between the first and second semiconductor electrode regions, and forming resistive regions lightly doped with the second impurity at portions contiguous with the first and second semiconductor electrode regions; forming a stripe-shaped first photoresist layer orthogonal to the mask layer, and etching the mask layer such that the mask layer has a square shape; forming a second photoresist layer on the substrate to cover a portion of the first photoresist layer and define a cantilever region; forming the cantilever region by etching portions not covered by the first and second photoresist layers; and removing the first and second photoresist layers, and forming a resistive tip having a semi-quadrangular pyramidal shape by etching portions of the substrate not covered by the mask layer.
    • 具有电阻尖端的半导体探针及其制造方法。 该方法包括在掺杂有第一杂质的衬底上形成条形掩模层,以及通过以与第一杂质极性相反的第二杂质重掺杂未被掩模层覆盖的衬底的部分来形成第一和第二电极区 ; 退火所述衬底以减小所述第一和第二半导体电极区之间的间隙,以及在与所述第一和第二半导体电极区相邻的部分形成轻掺杂有所述第二杂质的电阻区; 形成与所述掩模层正交的条状的第一光致抗蚀剂层,并且蚀刻所述掩模层使得所述掩模层具有正方形形状; 在所述基板上形成第二光致抗蚀剂层以覆盖所述第一光致抗蚀剂层的一部分并限定悬臂区域; 通过蚀刻未被第一和第二光致抗蚀剂层覆盖的部分形成悬臂区域; 以及去除所述第一和第二光致抗蚀剂层,以及通过蚀刻未被所述掩模层覆盖的所述衬底的部分,形成具有半四棱锥形形状的电阻尖端。