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    • 42. 发明授权
    • Achievement of top rounding in shallow trench etch
    • 在浅沟槽蚀刻中取得顶尖圆角的成就
    • US5994229A
    • 1999-11-30
    • US5567
    • 1998-01-12
    • Chao-Cheng ChenChia-Shiung Tsai
    • Chao-Cheng ChenChia-Shiung Tsai
    • H01L21/3065H01L21/762
    • H01L21/3065H01L21/76232
    • A process for forming a shallow trench having steep sidewalls near its bottom and sloping sidewalls at the top is described. The process is in 3 stages. The first stage involves methane trifluoride, carbon tetrafluoride, argon, and oxygen. The second stage involves methane trifluoride and methane monofluoride, while the third stage involves hydrogen bromide, chlorine, and helium/oxygen. If the ratio of the various components at each stage is carefully controlled along with other variables such as discharge power, pressure, and duration, the trench profile described above is obtained with a minimum of deposited polymer material on the sidewalls.
    • 描述了一种用于形成在其底部附近具有陡峭侧壁并且在顶部具有倾斜侧壁的浅沟槽的工艺。 这个过程分3个阶段。 第一阶段涉及三氟化甲烷,四氟化碳,氩气和氧气。 第二阶段涉及甲烷三氟化氢和甲烷单氟化物,而第三阶段涉及溴化氢,氯气和氦气/氧气。 如果每个阶段的各种组分的比例与诸如放电功率,压力和持续时间的其他变量一起被仔细地控制,则上述的沟槽轮廓是通过在侧壁上沉积的最少的聚合物材料获得的。
    • 43. 发明授权
    • Hard mask method for forming chlorine containing plasma etched layer
    • 用于形成含氯等离子体蚀刻层的硬掩模方法
    • US5981398A
    • 1999-11-09
    • US58122
    • 1998-04-10
    • Chia-Shiung TsaiChao-Cheng ChenHun-Jan Tao
    • Chia-Shiung TsaiChao-Cheng ChenHun-Jan Tao
    • H01L21/3213H01L21/3065
    • H01L21/32136H01L21/32137H01L21/32139
    • A method for forming a chlorine containing plasma etched patterned layer. There is first provided a substrate 10 employed within a microelectronics fabrication. There is then formed over the substrate a blanket target layer 12 formed of a material susceptible to etching within a second plasma employing a chlorine containing etchant gas composition. There is then formed upon the blanket target a blanket hard mask layer 14 formed of a material selected from the group consisting of silsesquioxane spin-on-glass (SOG) materials and amorphous carbon materials. There is then formed upon the blanket hard mask layer a patterned photoresist layer 16. There is then etched while employing the patterned photoresist layer as a first etch mask layer and while employing a first plasma employing a fluorine containing etchant gas composition the blanket hard mask layer to form a patterned hard mask layer. Finally, there is then etched while employing at least the patterned hard mask layer as a second etch mask layer and while employing the second plasma employing the chlorine containing etchant gas composition the blanket target layer to form the patterned target layer.
    • 一种形成含氯等离子体蚀刻图案层的方法。 首先提供了在微电子制造中使用的衬底10。 然后在衬底上形成由使用含氯蚀刻剂气体组合物在第二等离子体内易于蚀刻的材料形成的覆盖层目标层12。 然后在橡皮布目标上形成由选自倍半硅氧烷旋涂玻璃(SOG)材料和无定形碳材料的材料形成的橡皮布硬掩模层14。 然后在橡皮布硬掩模层上形成图案化的光致抗蚀剂层16.然后在使用图案化的光致抗蚀剂层作为第一蚀刻掩模层的同时进行蚀刻,并且在使用含氟蚀刻剂气体组合物的第一等离子体的同时, 以形成图案化的硬掩模层。 最后,在使用至少图案化的硬掩模层作为第二蚀刻掩模层的同时蚀刻,并且在使用含氯蚀刻剂气体组合物的第二等离子体时,覆盖目标层以形成图案化目标层。