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    • 41. 发明授权
    • Server with a flexible cooling scheme
    • 服务器具有灵活的冷却方案
    • US07558063B2
    • 2009-07-07
    • US11740624
    • 2007-04-26
    • Christian L. BeladyEric C. PetersonDavid M. Chastain
    • Christian L. BeladyEric C. PetersonDavid M. Chastain
    • H05K7/20H05K5/00A47B77/08
    • H05K7/20754
    • A server with a flexible cooling scheme is disclosed. The server comprises a case and a fan. When the server is in a first cooling configuration the fan is configured to force the gas past a first area to be cooled and out to the outside of the case through a second opening in the case. When the server is in a second cooling configuration, the server further comprises a heat exchanger located in the first area and configured to seal the first opening in the case thereby preventing outside gas from entering the first area. When the server is in the second cooling configuration, a sealing device is configured to seal the second opening thereby redirecting the first fan to force the gas past the first area to be cooled and back into the first area, thereby re-circulating the gas inside the case.
    • 公开了具有柔性冷却方案的服务器。 服务器包括外壳和风扇。 当服务器处于第一冷却配置时,风扇被配置成迫使气体经过第一区域被冷却,并通过壳体中的第二开口输出到壳体的外部。 当服务器处于第二冷却配置时,服务器还包括位于第一区域中并被配置为将壳体中的第一开口密封的热交换器,从而防止外部气体进入第一区域。 当服务器处于第二冷却配置时,密封装置被配置为密封第二开口,从而重定向第一风扇以迫使气体经过第一区域被冷却并返回到第一区域,从而使气体再循环 案子。
    • 42. 发明申请
    • SERVER WITH A FLEXIBLE COOLING SCHEME
    • 具有柔性冷却方案的服务器
    • US20080266790A1
    • 2008-10-30
    • US11740624
    • 2007-04-26
    • Christian L. BeladyEric C. PetersonDavid M. Chastain
    • Christian L. BeladyEric C. PetersonDavid M. Chastain
    • H05K7/20
    • H05K7/20754
    • A server with a flexible cooling scheme is disclosed. The server comprises a case having an inside and an outside. A first fan is positioned inside the case and configured to draw gas from a first area inside the case and force the gas past a first area to be cooled. A first opening in the case is configured to allow gas from outside the case to enter the first area. When the server is in a first cooling configuration the first fan is configured to force the gas past the first area to be cooled and out to the outside of the case through a second opening in the case. When the server is in a second cooling configuration, the server further comprises a heat exchanger located in the first area and configured to seal the first opening in the case thereby preventing outside gas from entering the first area. When the server is in the second cooling configuration, a sealing device is configured to seal the second opening thereby redirecting the first fan to force the gas past the first area to be cooled and back into the first area, thereby re-circulating the gas inside the case.
    • 公开了具有柔性冷却方案的服务器。 服务器包括具有内部和外部的壳体。 第一风扇位于壳体内部并且构造成从壳体内的第一区域抽出气体,并迫使气体经过第一区域以进行冷却。 该情况下的第一开口构造成允许来自壳体外部的气体进入第一区域。 当服务器处于第一冷却配置中时,第一风扇构造成迫使气体经过第一区域被冷却,并通过壳体中的第二开口输出到壳体的外部。 当服务器处于第二冷却配置时,服务器还包括位于第一区域中并被配置为将壳体中的第一开口密封的热交换器,从而防止外部气体进入第一区域。 当服务器处于第二冷却配置时,密封装置被配置为密封第二开口,从而重定向第一风扇以迫使气体经过第一区域被冷却并返回到第一区域,从而使气体再循环 案子。
    • 48. 发明授权
    • Mechanical highly compliant thermal interface pad
    • 机械高度兼容的热界面垫
    • US06910271B2
    • 2005-06-28
    • US10283907
    • 2002-10-29
    • Eric C. PetersonBrent A. BoudreauxChristian L. Belady
    • Eric C. PetersonBrent A. BoudreauxChristian L. Belady
    • H05K7/20F28F23/00H01L23/36B21D53/02
    • F28F23/00F28F2013/005Y10T29/4935
    • A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.
    • 热界面垫由多个热界面板组件构成。 替代的热界面板组件在衬垫内相互旋转约180度。 每个板组件包括一个或多个弹簧构件,其构造成使得完整的热界面垫在衬垫的至少两侧上包括多个弹簧构件。 热界面板组件被配置为允许热界面垫的厚度变化很大。 垫片的厚度可以充分调节,以适应多个发热和下沉装置之间的总容差。 插入板中的开口中的杆可以用于对准板组件并且向板施加压力,从而改善相邻板之间的热导率并大大降低热界面垫的整体热阻。
    • 50. 发明授权
    • Heat-activated self-aligning heat sink
    • 热活化自对准散热片
    • US06625026B1
    • 2003-09-23
    • US10210000
    • 2002-07-31
    • Brent A. BoudreauxStacy FrakerRoy M. ZeighamiEric C. PetersonChristian L. Belady
    • Brent A. BoudreauxStacy FrakerRoy M. ZeighamiEric C. PetersonChristian L. Belady
    • H05K720
    • F28F13/00F28F2013/005H01L21/4882H01L23/42H01L2924/0002H01L2924/3011H01L2924/00
    • A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.
    • 热激活的自对准散热器是将至少一个基板上的发热装置热连接到散热体上,其中发热装置可能由于公差叠加而彼此不共面 或与散热器主体平行。 基座附接到基板以支撑散热体。 插头或浮动底座放置在每个发热装置的顶部并且保持在基座内,允许足够的运动使插塞的底表面完全接触发热装置的顶表面。 将一定数量的低熔点温度的导热材料,例如焊料或导热液体放置在每个塞子上,并将散热器主体放置在组件上。 当加热时,热材料熔化,在插头和散热器本体之间形成低阻抗热连接,而与两个器件之间的平面度差异无关。