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    • 41. 发明申请
    • THERMOELECTRIC MODULE AND MANUFACTURING METHOD FOR THERMOELECTRIC MODULE
    • 热电模块的热电模块和制造方法
    • US20130074897A1
    • 2013-03-28
    • US13620898
    • 2012-09-15
    • Ju Hwan YANGDong Hyeok ChoiSung Ho Lee
    • Ju Hwan YANGDong Hyeok ChoiSung Ho Lee
    • H01L35/28H01L35/34
    • H01L35/32H01L35/34
    • The present invention is related to a thermoelectric module and a method for manufacturing the same. The thermoelectric module includes a substrate, a bottom electrode and a thermoelectric semiconductor. The thermoelectric module further includes an insulating layer integrally formed on a whole exposed surface of the bottom electrode, a portion of exposed surface of the thermoelectric semiconductor and a portion of exposed surface of the substrate; a contact hole provided in the insulating layer to expose a portion of a top surface of the thermoelectric semiconductor; and a top electrode to electrically connect at least two thermoelectric semiconductors by being formed on a surface of at least two thermoelectric semiconductors exposed by the contact hole and a portion of a top surface of the insulating layer.
    • 本发明涉及一种热电模块及其制造方法。 热电模块包括基板,底部电极和热电半导体。 热电模块还包括整体形成在底部电极的整个暴露表面上的绝缘层,热电半导体的暴露表面的一部分和基板的暴露表面的一部分; 设置在所述绝缘层中以暴露所述热电半导体的顶表面的一部分的接触孔; 以及顶部电极,其通过形成在由接触孔暴露的至少两个热电半导体的表面和绝缘层的顶表面的一部分上而形成在至少两个热电半导体上。