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    • 47. 发明授权
    • Method and apparatus for pattern inspection
    • 图案检查方法和装置
    • US07566871B2
    • 2009-07-28
    • US11698025
    • 2007-01-26
    • Masaki HasegawaHisaya MurakoshiHiroshi Makino
    • Masaki HasegawaHisaya MurakoshiHiroshi Makino
    • G01N23/00G21K7/00A61N5/00G21G5/00
    • H01J37/265G06T7/0004G06T2207/10056G06T2207/30148H01J37/29H01J2237/22H01J2237/24592
    • Because a mirror electron imaging type inspection apparatus for obtaining an inspection object image with mirror electrons has been difficult to optimize inspection conditions, since the image forming principles of the apparatus are different from those of conventional SEM type inspection apparatuses. In order to solve the above conventional problem, the present invention has made it possible for the user to examine such conditions as inspection speed, inspection sensitivity, etc. intuitively by displaying the relationship among the values of inspection speed S, inspection object digital signal image pixel size D, inspection object image size L, and image signal acquisition cycle P with use of a time delay integration method as a graph on an operation screen. The user can thus determine a set of values of a pixel size, an inspection image width, and a TDI sensor operation cycle easily with reference to the displayed graph.
    • 由于用于获得具有镜电子的检查对象图像的镜像电子成像型检查装置难以优化检查条件,因为该装置的图像形成原理与常规SEM型检查装置的图像形成原理不同。 为了解决上述常规问题,本发明使得用户可以通过显示检查速度S,检查对象数字信号图像的值之间的关系来直观地检查诸如检查速度,检查灵敏度等条件 像素尺寸D,检查对象图像尺寸L和图像信号采集周期P,使用时间延迟积分方法作为操作画面上的图形。 因此,用户可以参照所显示的图形容易地确定像素尺寸,检查图像宽度和TDI传感器操作循环的一组值。