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    • 41. 发明申请
    • Test method of embedded capacitor and test system thereof
    • 嵌入式电容器的测试方法及其测试系统
    • US20070168148A1
    • 2007-07-19
    • US11591381
    • 2006-11-01
    • Uei-Ming JowChin-Sun ShyuChang-Sheng ChenMin-Lin LeeShinn-Juh Lai
    • Uei-Ming JowChin-Sun ShyuChang-Sheng ChenMin-Lin LeeShinn-Juh Lai
    • G06F19/00G01R31/00
    • G01R31/2818G01R31/2805G01R31/304
    • A test method of an embedded capacitor and test system thereof are provided. The method and system are used to determine an electrical specification of the embedded capacitive component in a circuit board substrate, thereby avoiding executing a follow-up fabricating process for the circuit board substrate not satisfying the desired specification. In the method and system, a geometric size of the embedded capacitor is measured, and a relation value between the electrical parameter and the geometric size and a standard electrical parameter are obtained from a model database, to calculate the electrical parameter of the embedded capacitor. Then, the electrical parameter of the embedded capacitor is compared with the standard electrical parameter, to obtain an error value. Therefore, according to the error value, it may be acquired whether or not the circuit board substrate satisfies set electrical specifications.
    • 提供了一种嵌入式电容器及其测试系统的测试方法。 该方法和系统用于确定电路板基板中的嵌入式电容元件的电气规格,从而避免执行不满足期望规格的电路板基板的后续制造工艺。 在该方法和系统中,测量嵌入式电容器的几何尺寸,并从模型数据库中获得电参数和几何尺寸之间的关系值以及标准电参数,以计算嵌入式电容器的电参数。 然后,将嵌入式电容器的电气参数与标准电气参数进行比较,以获得误差值。 因此,根据误差值,可以获取电路板基板是否满足设定的电气规格。
    • 47. 发明授权
    • Inductor devices
    • 电感器件
    • US07928824B2
    • 2011-04-19
    • US12022967
    • 2008-01-30
    • Uei-Ming JowChang-Sheng Chen
    • Uei-Ming JowChang-Sheng Chen
    • H01F5/00
    • H01F17/0013H01F17/0033H01F2005/006H01F2017/002H01F2017/004H01F2017/0053H01F2017/0073H01F2017/0086
    • The invention relates to a high frequency inductor device with high quality factor (Q). The inductor device comprises a substrate and a gradually sized conductive coil with a plurality of windings surrounded and disposed on the substrate. The windings comprises a first conductive segment disposed on a first surface of the substrate, a second conductive segment disposed on a second surface of the substrate, a first conductive via hole connecting the first and second conductive segments, and a second conductive via hole connecting the second conductive segment to a first conductive segment of the following winding. The length of the first conductive segment is different than that of the first conductive segment of the following winding.
    • 本发明涉及一种高品质因数(Q)的高频电感器件。 电感器件包括衬底和逐渐尺寸的导电线圈,其中多个绕组包围并设置在衬底上。 绕组包括设置在基板的第一表面上的第一导电段,设置在基板的第二表面上的第二导电段,连接第一和第二导电段的第一导电通孔,以及连接第 第二导电段连接到以下绕组的第一导电段。 第一导电段的长度不同于以下绕组的第一导电段的长度。