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41. 发明授权

US09064626B2 Thin film-type coil component and method of fabricating the same 有权
标题翻译：薄膜型线圈部件及其制造方法
公开(公告)号：US09064626B2
公开(公告)日：2015-06-23
申请号：US13417832
申请日：2012-03-12
申请人： Young Seuck Yoo , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
发明人： Young Seuck Yoo , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
IPC分类号： H01F27/28 , H01F27/29 , H01F5/00 , H01F17/00 , H01F41/04
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/29 , H01F41/042 , H01F2027/2809
摘要： There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.
摘要翻译：提供了一种尺寸等于或小于0806的薄膜型线圈部件，并且包括陶瓷主体，外部电极包括形成在陶瓷主体的一个表面上的多个第一外部电极和多个第二外部电极形成在面向陶瓷主体的一个表面的另一表面上的电极，以及包括堆叠在陶瓷主体中的多个线圈层的线圈单元，从而获得低的直流（DC）电阻。

42. 发明授权

US08506106B2 Backlight unit and display apparatus including the same 有权
标题翻译：背光单元和包括它的显示装置
公开(公告)号：US08506106B2
公开(公告)日：2013-08-13
申请号：US12706661
申请日：2010-02-16
申请人： Yong Suk Kim , Won Do Kee , Chan Sung Jeong , Seung Se Kim
发明人： Yong Suk Kim , Won Do Kee , Chan Sung Jeong , Seung Se Kim
IPC分类号： G02F1/13357
CPC分类号： G02B6/0038 , G02B6/0031 , G02B6/0046 , G02B6/0068 , G02B6/0073 , G02B6/008 , G02B6/0088 , G02B6/0091 , G02F1/1336 , G02F1/133603
摘要： A back-light unit including a plurality of substrates, a plurality of light sources respectively disposed on the plurality of substrates and configured to emit light, and N (N≧2) light guide panels respectively disposed adjacent to the plurality of light sources, a corresponding light guide panel including a light incidence part having a light incidence surface for receiving light emitted from a corresponding light source, and a light emission part for emitting the received incident light. Further, the corresponding light guide panel includes protruding surface patterns protruding from an upper surface the light emission part.
摘要翻译：背光单元，包括多个基板，多个光源分别设置在所述多个基板上并被配置为发光;以及分别设置在所述多个光源附近的N（N> = 2）个导光板，对应的导光板包括具有用于接收从相应的光源发射的光的光入射表面的光入射部分和用于发射所接收的入射光的发光部分。此外，对应的导光板包括从发光部的上表面突出的突出面图案。

43. 发明申请

US20120042921A1 Method for manufacturing thermoelectric module and thermoelectric module manufactured from the same 审中-公开
标题翻译：制造由其制造的热电模块和热电模块的方法
公开(公告)号：US20120042921A1
公开(公告)日：2012-02-23
申请号：US12926671
申请日：2010-12-02
申请人： Yong Suk Kim , Sung Ho Lee , Young Soo Oh , Tae Kon Koo
发明人： Yong Suk Kim , Sung Ho Lee , Young Soo Oh , Tae Kon Koo
IPC分类号： H01L35/20 , H05K13/00 , H01L35/22
CPC分类号： H01L35/34 , H01L35/08 , Y10T29/49002
摘要： The present invention provides a method for manufacturing a thermoelectric module and a thermoelectric module manufactured from the same. The method includes the steps of: forming each of first and second green laminates; forming first and second preliminary electrodes by printing a conductive paste on each of the first and second green laminates; disposing thermoelectric elements on any one of the first and second preliminary electrodes; stacking the first and second green laminates in such a manner that the thermoelectric elements are interposed between the first and second preliminary electrodes; and firing the stacked first and second green sheet laminates, thereby forming the first and second electrodes, and first and second ceramic substrates, and simultaneously bonding the first ceramic substrate to the first electrode, the first and second electrodes to the thermoelectric elements, and the second ceramic substrate to the second electrode.
摘要翻译：本发明提供一种制造由其制造的热电模块和热电模块的方法。该方法包括以下步骤：形成第一和第二生坯层压板中的每一个; 通过在所述第一和第二层压板中的每一个上印刷导电浆料来形成第一和第二初级电极; 在所述第一和第二预备电极中的任何一个上设置热电元件; 堆叠第一和第二生坯层压板，使得热电元件插入在第一和第二初级电极之间; 以及烧结堆叠的第一和第二生片层压板，从而形成第一和第二电极以及第一和第二陶瓷衬底，并且同时将第一陶瓷衬底与第一电极，第一和第二电极接合到热电元件，并且第二陶瓷衬底到第二电极。

44. 发明申请

US20120023970A1 COOLING AND HEATING WATER SYSTEM USING THERMOELECTRIC MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：使用热电模块的冷却和加热水系统及其制造方法
公开(公告)号：US20120023970A1
公开(公告)日：2012-02-02
申请号：US12947061
申请日：2010-11-16
申请人： Sung Ho Lee , Yong Suk Kim , Young Soo Oh , Tae Kon Koo , Sung Kwon Wi
发明人： Sung Ho Lee , Yong Suk Kim , Young Soo Oh , Tae Kon Koo , Sung Kwon Wi
IPC分类号： F25B21/02 , H05K13/00
CPC分类号： F25B21/02 , F24H1/142 , Y10T29/49002
摘要： Disclosed herein are a cooling and heating water system using a thermoelectric module and a method of manufacturing the same. The cooling and heating water system using a thermoelectric module includes first and second substrates disposed to be spaced apart from each other, while facing each other; a cooling water line formed in the first substrate so as to flow cooling water therethrough; a heating water line formed in the second substrate so as to flow heating water therethrough; first and second insulating layers disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric device interposed between the first and second insulating layers, whereby it is possible to variously control a temperature of drinking water without generating noise by using the thermoelectric module in cooling the drinking water.
摘要翻译：本文公开了使用热电模块的冷却和加热水系统及其制造方法。使用热电模块的冷却和加热水系统包括彼此相对设置的彼此间隔开的第一和第二基板; 在第一基板上形成冷却水线，以使冷却水流过其中; 在第二基板上形成的加热水线，使加热水通过其中; 分别设置在第一和第二基板的内侧表面上的第一和第二绝缘层; 以及插入在第一绝缘层和第二绝缘层之间的热电装置，由此通过在冷却饮用水中使用热电模块，可以不产生噪音来不同地控制饮用水的温度。

45. 发明申请

US20110290293A1 Thermoelectric module and method for manufacturing the same 审中-公开
标题翻译：热电模块及其制造方法
公开(公告)号：US20110290293A1
公开(公告)日：2011-12-01
申请号：US12923079
申请日：2010-08-31
申请人： Yong Suk Kim , Sung Ho Lee , Tae Kon Koo , Yong Soo Oh
发明人： Yong Suk Kim , Sung Ho Lee , Tae Kon Koo , Yong Soo Oh
IPC分类号： H01L35/02 , H01L35/34 , H01L21/02
CPC分类号： H01L35/08
摘要： Disclosed herein is a thermoelectric module. The thermoelectric module includes: first and second substrates that are disposed to be separated from each other, facing each other and includes first and second grooves each formed on inner sides thereof; first and second electrodes that are received in the first and second grooves, respectively; and a thermoelectric device that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes. As a result, the present invention provide a thermoelectric module and a method for manufacturing the same capable of improving the figure of merit and reliability of the thermoelectric module.
摘要翻译：这里公开了一种热电模块。热电模块包括：第一和第二基板，被设置成彼此分离，彼此面对，并且包括各自形成在其内侧的第一和第二槽; 分别容纳在第一和第二凹槽中的第一和第二电极; 以及插入在第一和第二电极之间并且电连接到第一和第二电极的热电装置。结果，本发明提供一种能够提高热电模块的品质因数和可靠性的热电模块及其制造方法。

46. 发明授权

US08012778B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US08012778B2
公开(公告)日：2011-09-06
申请号：US12259576
申请日：2008-10-28
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

47. 发明授权

US07733573B2 Lens, manufacturing method thereof and light emitting device package using the same 有权
标题翻译：透镜及其制造方法以及使用其的发光器件封装
公开(公告)号：US07733573B2
公开(公告)日：2010-06-08
申请号：US11902779
申请日：2007-09-25
申请人： Yong Suk Kim , Hoon Hurh , Geun Ho Kim , Yu Ho Won
发明人： Yong Suk Kim , Hoon Hurh , Geun Ho Kim , Yu Ho Won
IPC分类号： G02B3/00 , G02B7/00 , G02B9/00 , G02B11/00 , G02B13/00 , G02B15/00 , G02B17/00 , G02B25/00
CPC分类号： G02B7/022 , H01L33/483 , H01L33/54
摘要： A lens and a light emitting device package formed by introducing surface mount technology (SMT) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.
摘要翻译：公开了通过引入表面贴装技术（SMT）形成的透镜和发光器件封装。透镜包括折射入射光的折射部分和至少一个表面安装部分，其中表面安装部分的一部分形成在折射部分中。

48. 发明授权

US07453093B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US07453093B2
公开(公告)日：2008-11-18
申请号：US11489578
申请日：2006-07-20
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L27/15 , H01L23/34
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

49. 发明申请

US20080112424A1 Apparatus for reducing contention in prioritized contention access of wireless personal area network and method of using the same 审中-公开
标题翻译：用于减少无线个域网优先竞争接入的争用的装置及其使用方法
公开(公告)号：US20080112424A1
公开(公告)日：2008-05-15
申请号：US11727907
申请日：2007-03-29
申请人： Yong Suk Kim , Jun Seo Lee , Chang Woo Seo , Jun Haeng Cho
发明人： Yong Suk Kim , Jun Seo Lee , Chang Woo Seo , Jun Haeng Cho
IPC分类号： H04L12/28
CPC分类号： H04W74/0816 , H04W74/0875 , H04W84/18
摘要： A contention reduction apparatus and method in a prioritized contention access (PCA) method of a Wireless Personal Area Network are provided. A contention reduction apparatus of a Wireless Personal Area Network includes: a prioritized contention access (PCA) section retriever which retrieves a PCA section from beacons received for a beacon period (BP); a PCA section divider which divides the retrieved PCA section; a device selector which selects devices using the PCA section; and a PCA section allocator which allocates the divided PCA section to the selected devices.
摘要翻译：提供了一种无线个人区域网络的优先竞争接入（PCA）方法中的争用减少装置和方法。无线个人区域网络的争用减免装置包括：优先级争用接入（PCA）部分检索器，其从为信标周期（BP）接收到的信标检索PCA部分; 一个PCA部分分割器，分割检索的PCA部分; 使用PCA部分选择设备的设备选择器; 以及PCA部分分配器，其将所分割的PCA部分分配给所选择的设备。

50. 发明申请

US20080112384A1 Apparatus for merging beacon of wireless local network and method using the same 审中-公开
标题翻译：用于合并无线局域网的信标的装置及其使用方法
公开(公告)号：US20080112384A1
公开(公告)日：2008-05-15
申请号：US11723285
申请日：2007-03-19
申请人： Chang Woo Seo , Jun Seo Lee , Jun Haeng Cho , Yong Suk Kim , Seung Hwan Oh
发明人： Chang Woo Seo , Jun Seo Lee , Jun Haeng Cho , Yong Suk Kim , Seung Hwan Oh
IPC分类号： H04J1/00
CPC分类号： H04W8/005 , H04W48/12 , H04W84/18 , H04W88/02 , Y02D70/10 , Y02D70/14
摘要： An apparatus and method of merging beacons in a wireless local network are provided. The method of merging beacons in a wireless local network includes: calculating a continuous occurrence frequency of a received alien beacon period (BP); comparing the calculated occurrence frequency with a certain reference occurrence frequency; and merging a beacon group of a corresponding device with an alien beacon group when the calculated occurrence frequency is greater than or equal to the reference occurrence frequency.
摘要翻译：提供了一种在无线局域网络中合并信标的装置和方法。在无线局域网中合并信标的方法包括：计算接收的外来信标周期（BP）的连续出现频率; 将计算的出现频率与特定参考发生频率进行比较; 以及当所计算的出现频率大于或等于所述参考发生频率时，将对应设备的信标组合与外来信标组合并。

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