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41. 发明授权

US08309949B2 Optoelectronic architecture having compound conducting substrate 失效
标题翻译：具有复合导电衬底的光电架构
公开(公告)号：US08309949B2
公开(公告)日：2012-11-13
申请号：US12952174
申请日：2010-11-22
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L29/06 , H01L21/00
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

42. 发明授权

US08198117B2 Photovoltaic devices with conductive barrier layers and foil substrates 失效
标题翻译：具有导电阻挡层和箔基板的光伏器件
公开(公告)号：US08198117B2
公开(公告)日：2012-06-12
申请号：US12064031
申请日：2006-08-16
申请人： Craig R. Leidholm , Brent Bollman , James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： Craig R. Leidholm , Brent Bollman , James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L21/02
CPC分类号： B82Y10/00 , H01L31/022425 , H01L31/02245 , H01L31/03928 , H01L31/046 , H01L31/0465 , H01L31/0512 , H01L31/0749 , H01L51/5203 , H01L2251/5338 , H02S20/23 , Y02B10/12 , Y02E10/541 , Y02P70/521
摘要： Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.
摘要翻译：为在箔基片上形成的吸收层提供了方法和装置。在一个实施例中，制造光伏器件的方法可以包括提供包括至少一个导电铝箔衬底，至少一个导电扩散阻挡层和在扩散阻挡层上方的至少一个导电电极层的衬底。扩散阻挡层可以防止铝箔衬底和电极层之间的化学相互作用。可以在基板上形成吸收层。在一个实施例中，吸收层可以是非硅吸收层。在另一个实施例中，吸收层可以是非晶硅（掺杂或未掺杂）吸收层。任选地，吸收层可以基于有机和/或无机材料。

43. 发明授权

US07919337B2 Optoelectronic architecture having compound conducting substrate 有权
标题翻译：具有复合导电衬底的光电架构
公开(公告)号：US07919337B2
公开(公告)日：2011-04-05
申请号：US11933416
申请日：2007-10-31
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L21/00
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

44. 发明授权

US07604843B1 Metallic dispersion 失效
标题翻译：金属色散
公开(公告)号：US07604843B1
公开(公告)日：2009-10-20
申请号：US11081163
申请日：2005-03-16
申请人： Matthew R. Robinson , Martin R. Roscheisen
发明人： Matthew R. Robinson , Martin R. Roscheisen
IPC分类号： B05D3/04 , H01L31/00
CPC分类号： H01L31/0322 , C23C18/02 , C23C18/1216 , C23C18/1258 , H01L31/03928 , H01L31/0749 , Y02E10/541 , Y02P70/521 , Y10S977/786 , Y10S977/81
摘要： A compound film may be formed by formulating a mixture of elemental nanoparticles composed of the Ib, the IIIa, and, optionally, the VIa group of elements having a controlled overall composition. The nanoparticle mixture is combined with a suspension of nanoglobules of gallium to form a dispersion. The dispersion may be deposited onto a substrate to form a layer on the substrate. The layer may then be reacted in a suitable atmosphere to form the compound film. The compound film may be used as a light-absorbing layer in a photovoltaic device.
摘要翻译：可以通过配制由Ib，IIIa和任选的具有受控整体组成的元素的VIa族组成的元素纳米颗粒的混合物来形成复合膜。将纳米颗粒混合物与镓的纳米金属的悬浮液组合以形成分散体。可以将分散体沉积在基底上以在基底上形成层。然后可以在合适的气氛中反应该层以形成化合物膜。复合膜可以用作光伏器件中的光吸收层。

45. 发明申请

US20120052613A1 OPTOELECTRONIC ARCHITECTURE HAVING COMPOUND CONDUCTING SUBSTRATE 审中-公开
标题翻译：具有复合导体基板的光电结构
公开(公告)号：US20120052613A1
公开(公告)日：2012-03-01
申请号：US13169985
申请日：2011-06-27
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L31/18
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

46. 发明申请

US20100269428A1 Cost Effective, Elongate Member Mounting System For Photovoltaic Devices 审中-公开
标题翻译：光伏器件成本效益高的成员安装系统
公开(公告)号：US20100269428A1
公开(公告)日：2010-10-28
申请号：US12601240
申请日：2008-05-23
申请人： Robert Stancel , Martin R. Roscheisen , Jeremy H. Scholz
发明人： Robert Stancel , Martin R. Roscheisen , Jeremy H. Scholz
IPC分类号： E04D13/18 , F16M13/00 , E04B1/38
CPC分类号： H02S20/23 , F24S25/16 , F24S25/33 , F24S25/50 , F24S25/61 , F24S25/636 , F24S2025/6008 , Y02B10/12 , Y02B10/20 , Y02E10/47
摘要： Methods and devices are provided for improved rooftop solar module mounting assemblies. In one embodiment, an assembly is provided for mounting a plurality of photovoltaic devices over a roof surface. The assembly comprises of a plurality of elongate metal rods, wherein the elongate metal rods are connected together to define a support grid; a plurality of non-roof penetrating grid supports configured to elevate the support grid above the roof surface; and a plurality of grid-to-roof anchors that secure the entire support grid over the roof surface, wherein the number of grid-to-roof anchors is less than about ¼ of the number of non-roof penetrating grid supports to minimize the number of locations where water may enter the roof surface.
摘要翻译：提供了改进屋顶太阳能模块安装组件的方法和装置。在一个实施例中，提供了用于将多个光伏器件安装在屋顶表面上的组件。组件包括多个细长金属杆，其中细长金属杆连接在一起以限定支撑格栅; 多个非屋顶穿透网格支撑件，其构造成将支撑栅格提升到屋顶表面上方; 以及将整个支撑格栅固定在屋顶表面上的多个格栅到屋顶的锚固件，其中网格到屋顶锚的数量小于非屋顶穿透网格支撑件的数量的大约1/4，以最小化数量水可能进入屋顶表面的位置。

47. 发明申请

US20100218441A1 Wind Uplift Resistant Module Mounting System 审中-公开
标题翻译：防风升降模块安装系统
公开(公告)号：US20100218441A1
公开(公告)日：2010-09-02
申请号：US12626878
申请日：2009-11-27
申请人： Robert Stancel , Martin R. Roscheisen
发明人： Robert Stancel , Martin R. Roscheisen
IPC分类号： E04D13/18
CPC分类号： H02S20/00 , F24S25/16 , F24S25/35 , F24S25/50 , F24S25/61 , F24S25/634 , F24S40/85 , F24S2025/014 , F24S2025/017 , H02S20/24 , H02S20/30 , Y02B10/12 , Y02B10/20 , Y02E10/47 , Y02E10/50
摘要： Methods and devices are provided for improved rooftop solar module mounting assemblies. In one embodiment, an assembly is provided for mounting a plurality of photovoltaic devices over a roof surface. The assembly comprises of a plurality of elongate metal rods, wherein the elongate metal rods are connected together to define a support grid; a plurality of non-roof penetrating grid supports configured to elevate the support grid above the roof surface, wherein the panels are grouped to define a rigid combination of modules and beams wherein the combination covers sufficient area and has sufficient rigidity which minimizes the risk of module lift off. Some embodiments are non-ballasted systems without features added to increase the weight of the system above a minimum required for conventional wind load ballasting for solar installations.
摘要翻译：提供了改进屋顶太阳能模块安装组件的方法和装置。在一个实施例中，提供了用于将多个光伏器件安装在屋顶表面上的组件。组件包括多个细长金属杆，其中细长金属杆连接在一起以限定支撑格栅; 多个非屋顶穿透网格支撑件，其被配置为提升顶板表面上方的支撑格栅，其中，所述面板被分组以限定模块和梁的刚性组合，其中所述组合覆盖足够的面积并且具有足够的刚性，从而最小化模块的风险升空。一些实施例是非压载系统，没有添加特征以将系统的重量提高到高于太阳能装置的常规风载荷镇流所需的最小值。

48. 发明申请

US20080142073A1 OPTOELECTRONIC ARCHITECTURE HAVING COMPOUND CONDUCTING SUBSTRATE 有权
标题翻译：具有复合导体基板的光电结构
公开(公告)号：US20080142073A1
公开(公告)日：2008-06-19
申请号：US11933416
申请日：2007-10-31
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L31/04
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

49. 发明授权

US07276724B2 Series interconnected optoelectronic device module assembly 有权
标题翻译：系列互连光电器件组件
公开(公告)号：US07276724B2
公开(公告)日：2007-10-02
申请号：US11039053
申请日：2005-01-20
申请人： James R. Sheats , Sam Kao , Gregory A. Miller , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Gregory A. Miller , Martin R. Roscheisen
IPC分类号： H01L29/06 , H01L21/00
CPC分类号： H01L31/0392 , H01L27/3204 , H01L31/03925 , H01L31/03928 , H01L31/046 , H01L31/0465 , H01L31/0749 , H01L31/18 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Series interconnection of optoelectronic device modules is disclosed. Each device module includes an active layer disposed between a bottom electrode and a transparent conducting layer. An insulating layer is disposed between the bottom electrode of a first device module and a backside top electrode of the first device module. One or more vias are formed through the active layer, transparent conducting layer and insulating layer of the first device module. Sidewalls of the vias are coated with an insulating material such that a channel is formed through the insulating material to the backside top electrode of the first device module. The channel is at least partially filled with an electrically conductive material to form a plug that makes electrical contact between the transparent conducting layer and the backside top electrode of the first device module. Portions of the backside top electrode and insulating layer of a second device module are cut back to expose a portion of the bottom electrode of the second device module. The first and second device modules are attached to an insulating carrier substrate. Electrical contact is made between the backside top electrode of the first device module and the exposed portion of the bottom electrode of the second device module.
摘要翻译：公开了光电器件模块的串联互连。每个器件模块包括设置在底部电极和透明导电层之间的有源层。绝缘层设置在第一器件模块的底部电极和第一器件模块的背面顶部电极之间。通过第一器件模块的有源层，透明导电层和绝缘层形成一个或多个通孔。通孔的侧壁涂覆有绝缘材料，使得通过绝缘材料形成通道到第一器件模块的背面顶部电极。通道至少部分地填充有导电材料以形成在第一器件模块的透明导电层和背面顶部电极之间形成电接触的插塞。背面顶部电极和第二器件模块的绝缘层的部分被切割以暴露第二器件模块的底部电极的一部分。第一和第二器件模块附接到绝缘载体衬底。在第一器件模块的背面顶部电极和第二器件模块的底部电极的暴露部分之间形成电接触。

50. 发明授权

US07115304B2 High throughput surface treatment on coiled flexible substrates 有权
标题翻译：螺旋式柔性基板上的高通量表面处理
公开(公告)号：US07115304B2
公开(公告)日：2006-10-03
申请号：US10782545
申请日：2004-02-19
申请人： Martin R. Roscheisen , Karl Pichler
发明人： Martin R. Roscheisen , Karl Pichler
IPC分类号： C23C16/00
CPC分类号： C23C16/45544 , C23C16/405 , C23C16/458 , C23C16/4581 , C23C16/545 , C25D7/0614 , C25D17/02 , H01L31/022425 , H01L31/0322 , H01L31/0392 , H01L31/03926 , H01L31/1864 , H01L31/1876 , Y02E10/541 , Y02P70/521
摘要： One or more substrates may be coiled into one or more coils in such a way that adjacent turns of the coils do not touch one another. The one or more coiled substrates are placed in a treatment chamber where substantially an entire surface of the one or more coiled substrates may be treated with a surface treatment process. One or more spacers may be placed between adjacent layers of the coiled substrate before a full turn of the substrate has been coiled around a carousel.
摘要翻译：一个或多个衬底可以被卷绕成一个或多个线圈，使得线圈的相邻匝不彼此接触。将一个或多个卷绕的基板放置在处理室中，其中可以用表面处理工艺处理一个或多个卷取的基板的基本上整个表面。一个或多个间隔物可以被放置在卷绕的基底的相邻层之前，在衬底的完整转动已经卷绕在圆盘传送带之前。

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