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41. 发明授权

US5241501A Semiconductor memory device for detecting defective memory cells in a short time 失效
标题翻译：用于在短时间内检测有缺陷的记忆细胞的半导体存储器件
公开(公告)号：US5241501A
公开(公告)日：1993-08-31
申请号：US598875
申请日：1990-10-19
申请人： Shinji Tanaka
发明人： Shinji Tanaka
IPC分类号： G11C29/00 , G11C11/401 , G11C29/02 , G11C29/34
CPC分类号： G11C29/34 , G11C29/02
摘要： A DRAM with a word line shifting circuit (6) is disclosed. In an externally specified test mode, a word line shifting circuit sequentially selects two word lines (WL.sub.i, WL.sub.i+1) A test data stored in a memory cell (101) is shifted through bit lines (BL, BL) to an adjacent other memory cell (102). This shifting operation is repeated between two adjacent memory cells. By comparing the repetitive shifted test data with the primarily supplied test data, the detection of whether or not a defective memory cell exists in the memory cell connected to the bit lines is accomplished in a short time.
摘要翻译：公开了具有字线移位电路（6）的DRAM。在外部指定的测试模式中，字线移位电路顺序地选择两个字线（WLi，WLi + 1）A存储在存储单元（101）中的测试数据通过位线（BL，＆amp; B和B）移位到相邻的另一个存储单元（102）。在两个相邻的存储单元之间重复该移位操作。通过将重复移位的测试数据与主要提供的测试数据进行比较，可以在短时间内检测连接到位线的存储单元中是否存在有缺陷的存储单元。

42. 发明授权

US5178897A Water-in-oil emulsion composition for bakery 失效
标题翻译：水果油乳液组合物
公开(公告)号：US5178897A
公开(公告)日：1993-01-12
申请号：US767834
申请日：1991-09-30
申请人： Shinji Tanaka , Yasuo Okutomi , Amane Endo
发明人： Shinji Tanaka , Yasuo Okutomi , Amane Endo
IPC分类号： A23L9/20 , A21D2/16 , A23D7/00 , A23D7/01 , B01J13/00
CPC分类号： A21D2/16 , A23D7/011 , A23D7/013
摘要： The water-in-oil emulsion composition for bakery of the present invention comprises from 30 to 70% by weight of an oil and fat phase containing a fat showing a SFC of 30 or above, 20 or above and 10 or above, respectively, at 10.degree. C., 20.degree. C. and 30.degree. C. and from 70 to 30% by weight of an aqueous phase containing a hydrated emulsifier and contains a monoglyceride containing from 5 to 100% by mole of transmonoenoic acid(s) in the constituting fatty acids and a sizing agent.

43. 发明授权

US5158024A Combustion control apparatus for a coal-fired furnace 失效
标题翻译：燃烧炉燃烧控制装置
公开(公告)号：US5158024A
公开(公告)日：1992-10-27
申请号：US815800
申请日：1992-01-02
申请人： Shinji Tanaka , Tatsuya Miyatake , Kazuyoshi Yamamoto , Yuichi Miyamoto
发明人： Shinji Tanaka , Tatsuya Miyatake , Kazuyoshi Yamamoto , Yuichi Miyamoto
IPC分类号： F23C99/00 , F23N1/02 , F23N5/00 , G05B13/02
CPC分类号： F23N5/003 , F23N1/022 , F23K2201/10 , F23N2023/52 , F23N2041/18 , Y10S706/90
摘要： This invention relates to a combustion control apparatus for a powdered coal-fired furnace that monitors noxious substances contained within the burning waste gases, unburned substances within the ash and the power data of a pulverizing mill in order to operate the combustion furnace safely and efficiently. The combustion control apparatus infers from the current states or data optimal control amounts that will maintain within the minimum allowable ranges the noxious nitrogen oxides and the in-ash unburned substances that affect the combustion efficiency-and thereby controls the combustion furnace with good stability. The combustion control apparatus qualitatively evaluates as fuzzy quantities the density data of the nitrogen oxides contained within the exhaust gases of the unburned substances contained within the ash, and the power data of the pulverizing mill. Based upon the evaluation results a fuzzy inference is formed so as to determine the optimum control amount of the two-stage combustion air ratio for minimizing the nitrogen oxides and also the optimum control amount for the fine/coarse gain separator so as to extract powdered coal of a grain size most effective for minimizing the unburned substances within the ash.

44. 发明授权

US4894343A Chamber plate for use in cell fusion and a process for production thereof 失效
标题翻译：用于细胞融合的腔室板及其制造方法
公开(公告)号：US4894343A
公开(公告)日：1990-01-16
申请号：US122269
申请日：1987-11-18
申请人： Shinji Tanaka , Kazuo Sato , Tsuneo Terasawa , Yoshio Kawamura , Hisashi Tsuruoka
发明人： Shinji Tanaka , Kazuo Sato , Tsuneo Terasawa , Yoshio Kawamura , Hisashi Tsuruoka
IPC分类号： C12M1/00 , C12M1/32 , C12M1/34 , C12M3/00 , C12N13/00 , G01N15/14
CPC分类号： C12N13/00 , C12M23/20 , C12M35/02 , G01N2015/149
摘要： There are disclosed a chamber plate for use in cell fusion comprising a plate of single crystal silicon on which a plurality of chambers for holding at least a pair of unit cells are formed in array, said chamber having at the bottom a plate having slits which do not pass cells to be held; and a process for producing a chamber plate for use in cell fusion which comprises forming chambers for holding cells in a plate of single crystal silicon by anisotropic etching or isotropic etching by chemical etching.
摘要翻译：公开了一种用于细胞融合的室板，其包括单晶硅板，其上形成有用于保持至少一对单元电池的多个室，所述室在底部具有切口的板不通过细胞被保持; 以及用于生产用于细胞融合的室板的方法，其包括通过各向异性蚀刻或通过化学蚀刻的各向同性蚀刻形成用于将单元硅保持在单元硅板中的室。

45. 发明授权

US4831805A Precast concrete board fixing metal fitting 失效
标题翻译：预制混凝土板固定金属配件
公开(公告)号：US4831805A
公开(公告)日：1989-05-23
申请号：US127017
申请日：1987-11-27
申请人： Mitsuo Noborisaka , Masashi Noborisaka , Toshiaki Fukagai , Takashi Taniguchi , Shinji Tanaka , Yuuji Satou , Kazuhiro Tanaka , Noriaki Yamamoto
发明人： Mitsuo Noborisaka , Masashi Noborisaka , Toshiaki Fukagai , Takashi Taniguchi , Shinji Tanaka , Yuuji Satou , Kazuhiro Tanaka , Noriaki Yamamoto
IPC分类号： E04B2/90 , E04B1/04 , E04B2/88 , E04B2/94 , E04C2/52 , E04F13/21
CPC分类号： E04B2/94 , E04B1/043 , E04C2/526
摘要： A metal fitting for fixing a precast concrete board comprises: a supporting metal member with one end portion secured to the board and with the other end portion provided with a first screw to move the board upward and downward through the supporting metal member and a second screw to move the board backward and forward through the supporting metal member; and an adjusting metal member including a base board which is secured to a building's structure, and a pair of third screws for moving the board rightward and leftward through the supporting metal member, so that the position adjustments of the board in the three directions can be achieved independently of one another.
摘要翻译：用于固定预制混凝土板的金属配件包括：支撑金属构件，其一个端部固定到板上，另一个端部设置有第一螺钉，以通过支撑金属构件向上和向下移动板，第二螺钉通过支撑金属构件向后和向前移动板; 以及调整金属构件，其包括固定到建筑物结构的基板和用于使板向右和向左移动通过支撑金属构件的一对第三螺钉，使得板在三个方向上的位置调整可以是彼此独立实现。

46. 发明授权

US4750364A Angular velocity and acceleration sensor 失效
标题翻译：角速度和加速度传感器
公开(公告)号：US4750364A
公开(公告)日：1988-06-14
申请号：US920426
申请日：1986-10-20
申请人： Yoshio Kawamura , Kazuo Sato , Tsuneo Terasawa , Shinji Tanaka
发明人： Yoshio Kawamura , Kazuo Sato , Tsuneo Terasawa , Shinji Tanaka
IPC分类号： G01C19/56 , G01C19/5621 , G01C19/5628 , G01P15/097 , G01P15/10 , G01P15/125 , G01P15/08 , G01P9/04
CPC分类号： G01P15/097 , G01C19/5607 , G01P15/14
摘要： The specification discloses an angular velocity and acceleration sensor in which a tuning-fork oscillator is vibrated on the main driven vibrating axis and displacement on an axis which is parallel to the main driven vibrating axis or displacement which crosses it at right angles is detected so that at least one of angular velocity and acceleration on an axis which is parallel to the main driven vibrating axis or which crosses it at right angles may be detected. The sensor is characterized in that vibrating reeds of the tuning-fork oscillator are so formed that the spring constant of the vibrating reeds on the main driven vibrating axis is substantially equal to that on the axis which crosses the main driven vibrating axis at right angles.
摘要翻译：本说明书公开了一种角速度和加速度传感器，其中音叉振荡器在主驱动振动轴上振动，并且检测到平行于主驱动振动轴的轴线的位移或与其直角穿过的轴的位移，使得可以检测在与主驱动振动轴平行的轴上的角速度和加速度中的至少一个，或者以直角与其相交。传感器的特征在于，音叉振荡器的振动片形成为使得主从动振动轴上的振动片的弹簧常数基本上等于与主驱动振动轴线成直角相交的轴线的弹簧常数。

47. 发明授权

US09797034B2 High strength and high toughness cast steel material and method for producing the same 有权
公开(公告)号：US09797034B2
公开(公告)日：2017-10-24
申请号：US13498057
申请日：2010-09-24
申请人： Yoshihiro Gotoh , Shinji Tanaka , Tsukasa Azuma
发明人： Yoshihiro Gotoh , Shinji Tanaka , Tsukasa Azuma
IPC分类号： C22C38/02 , C22C38/04 , C22C38/44 , C22C38/08 , C21D6/00 , C22C38/46 , C22C38/00
CPC分类号： C22C38/44 , C21D6/00 , C21D6/001 , C22C38/001 , C22C38/008 , C22C38/02 , C22C38/04 , C22C38/46
摘要： A high strength and high toughness cast steel material of the invention has a composition comprising 0.10 to 0.20% by mass of C, 0.10 to 0.50% by mass of Si, 0.40 to 1.20% by mass of Mn, 2.00 to 3.00% by mass of Ni, 0.20 to 0.70% by mass of Cr, and 0.10 to 0.50% by mass of Mo, and further comprising Fe and unavoidable impurities. The high strength and high toughness cast steel material of the invention is produced by subjecting an ingot having the above composition to annealing at 1,000 to 1,100° C., quenching at 850 to 950° C., tempering at 610 to 670° C., and then, if desired, stress-relief annealing at less than 610° C.

48. 发明授权

US09512507B2 Silver-white copper alloy and method of producing silver-white copper alloy 有权
标题翻译：银白铜合金和银白铜合金的制造方法
公开(公告)号：US09512507B2
公开(公告)日：2016-12-06
申请号：US14115062
申请日：2012-06-27
申请人： Shinji Tanaka , Keiichiro Oishi , Hiroharu Ogawa
发明人： Shinji Tanaka , Keiichiro Oishi , Hiroharu Ogawa
IPC分类号： C22C9/04 , C22F1/08
CPC分类号： C22C9/04 , C22F1/08
摘要： Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%.
摘要翻译：提供具有优异的机械性能如热加工性，冷加工性或冲压性，耐色牢度，杀菌和抗菌性能以及耐镍过敏性的银白铜合金。以及制造这种银白铜合金的方法。银白色铜合金含有Cu：51.0质量％〜58.0质量％ 9.0质量％〜12.5质量％的Ni; 0.0003质量％〜0.010质量％ 0.0005质量％至0.030质量％的Pb; 并且在Cu [Cu]（质量％）的含量与Ni [Ni]（含量）的含量之间满足65.5≤[Cu] + 1.2×[Ni]≤70.0的关系的Zn和不可避免的杂质的平衡质量％）。在其金属结构中，分散在α相基体中的β相的面积比为0〜0.9％。

49. 发明申请

US20130323114A1 HIGH-STRENGTH COPPER ALLOY FORGING MATERIAL 审中-公开
标题翻译：高强度铜合金锻造材料
公开(公告)号：US20130323114A1
公开(公告)日：2013-12-05
申请号：US13985729
申请日：2012-02-14
申请人： Yoshiharu Miyabe , Mamoru Mizusawa , Shinji Tanaka
发明人： Yoshiharu Miyabe , Mamoru Mizusawa , Shinji Tanaka
IPC分类号： C22C9/06
CPC分类号： C22C9/06 , B21J1/003 , C22C1/02 , C22F1/08
摘要： The present invention relates to a high-strength copper alloy forging material having properties of high hardness, high strength and high thermal conductivity.The high-strength copper alloy forging material contains, in mass %, 3 to 7.2% of Ni, 0.7 to 1.8% of Si, 0.02 to 0.35% of Zr and 0.002 to 0.05% of P, and further contains 1.5% or less of one or two or more of Cr, Mn and Zn in total, as needed, whereby appropriate amounts of Zr and P act to cause cracks to be less likely to occur in the material during working or heat treatment. After the working and the heat treatment, the forging material of the invention can have properties of high hardness, high strength and high thermal conductivity, and can be suitably used for resin injection mold materials, aircraft components and the like.
摘要翻译：本发明涉及具有高硬度，高强度和高导热性的高强度铜合金锻造材料。高强度铜合金锻造材料以质量％计含有3〜7.2％的Ni，0.7〜1.8％的Si，0.02〜0.35％的Zr和0.002〜0.05％的P，进一步含有1.5％以下的根据需要，总共含有一种或两种以上的Cr，Mn和Zn，由此适当量的Zr和P起作用以在加工或热处理期间不太可能在材料中发生裂纹。在加工和热处理之后，本发明的锻造材料可以具有高硬度，高强度和高导热性的特性，并且可以适用于树脂注射模具材料，飞行器部件等。

50. 发明授权

US08354298B2 Semiconductor device and manufacturing method of a semiconductor device 失效
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US08354298B2
公开(公告)日：2013-01-15
申请号：US13368550
申请日：2012-02-08
申请人： Shinji Tanaka
发明人： Shinji Tanaka
IPC分类号： H01L21/50
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/3677 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/04042 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48101 , H01L2224/48227 , H01L2224/48229 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81801 , H01L2224/81986 , H01L2224/831 , H01L2224/83192 , H01L2224/92225 , H01L2224/92227 , H01L2224/92242 , H01L2224/92247 , H01L2225/06513 , H01L2225/06589 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/15787 , H01L2924/30107 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device of the present invention comprises a substrate and a first semiconductor element. The substrate comprises an inner layer conductor and a cavity comprising the bottom surface on which a part of the inner layer conductor is exposed. The first semiconductor element contacts, in the cavity, the inner layer conductor directly or via a good heat conductor material.
摘要翻译：本发明的半导体器件包括衬底和第一半导体元件。衬底包括内层导体和包括内表面导体的一部分露出的底表面的空腔。第一半导体元件在空腔中直接或经由良好的导热材料接触内层导体。

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