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41. 发明申请

US20080141752A1 Press forging method 失效
标题翻译：压锻法
公开(公告)号：US20080141752A1
公开(公告)日：2008-06-19
申请号：US11987272
申请日：2007-11-28
申请人： Toshihiko Sato , Yugo Takeuchi , Yasuo Yoshida , Noboru Kakizawa , Takehiro Osugi , Takanori Yoshikawa
发明人： Toshihiko Sato , Yugo Takeuchi , Yasuo Yoshida , Noboru Kakizawa , Takehiro Osugi , Takanori Yoshikawa
IPC分类号： B21J5/02 , B21J5/00
CPC分类号： B21J1/04 , B21J5/02 , B21J5/08
摘要： The present invention is a press forging method by which porosities in a raw material are removed and mechanical properties such as ductility and toughness of a steel product are at a required level in a case that a steel ingot is treated as a raw material in press forging. A cylindrical steel ingot (a so-called “round billet”) is set onto a die as a raw material, and, a forging process is applied to the steel ingot so that buckling of the steel is not generated during the forging process and that a reduction ratio and a forging ratio are more than predetermined values, respectively.
摘要翻译：本发明是一种冲压锻造方法，在将钢锭作为锻造原料处理的情况下，去除原料中的孔隙率，钢材的延展性和韧性等机械性能处于要求的水平。将圆筒形钢锭（所谓的“圆钢坯”）作为原料设置在模具上，并且对钢锭施加锻造工艺，使得在锻造过程中不产生钢的屈曲，并且减速比和锻造比分别大于预定值。

42. 发明申请

US20060189031A1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060189031A1
公开(公告)日：2006-08-24
申请号：US11399365
申请日：2006-04-07
申请人： Yoshiyuki Kado , Takahiro Naito , Toshihiko Sato , Hikaru Ikegami , Takafumi Kikuchi
发明人： Yoshiyuki Kado , Takahiro Naito , Toshihiko Sato , Hikaru Ikegami , Takafumi Kikuchi
IPC分类号： H01L21/78
CPC分类号： H01L24/14 , H01L23/28 , H01L23/3128 , H01L23/50 , H01L23/5386 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0652 , H01L25/18 , H01L2224/1134 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06558 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2224/92247 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要： Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).
摘要翻译：在多芯片模块（MCM）中安装在封装衬底（1）的主表面上的三个芯片（2A），（2B）和（2C）中，形成有DRAM的芯片（2A）其上形成有闪速存储器的芯片（2B）通过Au凸块（4）与封装衬底（1）的布线（5）电连接，并且在主表面（下表面）之间形成间隙芯片（2A），（2B）和封装基板（1）的主表面填充有未填充树脂（6）。在其上形成有高速微处理器的芯片（2C）安装在两个芯片（2A）和（2B）上，并且通过Au线（...）电连接到封装衬底（1）的焊盘（9） 8）。

43. 发明授权

US06433412B1 Semiconductor device and a method of manufacturing the same 有权
公开(公告)号：US06433412B1
公开(公告)日：2002-08-13
申请号：US09800589
申请日：2001-03-08
申请人： Hideko Ando , Hiroshi Kikuchi , Ikuo Yoshida , Toshihiko Sato , Tomo Shimizu
发明人： Hideko Ando , Hiroshi Kikuchi , Ikuo Yoshida , Toshihiko Sato , Tomo Shimizu
IPC分类号： H01L2302
摘要： A central portion of a main face of a package substrate 2 is mounted with a memory chip 1 using face down bonding by a flip chip bonding system. Further, a plurality of chip condensers 7 are mounted at vicinities of the memory chip 1. A clearance between a main face (lower face) of the memory chip 1 and a main face of the package substrate 2 is filled with underfill resin (seal resin) 10 constituting a seal member for achieving protection of connecting portions and for relaxation of thermal stress. An outer edge of the underfill resin 10 is extended to an outer side of the memory chip 1 and covers entire faces of the chip condensers 7 mounted at vicinities of the memory chip 1.

44. 发明授权

US06380621B1 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06380621B1
公开(公告)日：2002-04-30
申请号：US09543769
申请日：2000-04-05
申请人： Hideko Ando , Hiroshi Kikuchi , Toshihiko Sato , Tetsuya Hayashida
发明人： Hideko Ando , Hiroshi Kikuchi , Toshihiko Sato , Tetsuya Hayashida
IPC分类号： H01L2310
CPC分类号： H01L24/32 , H01L21/563 , H01L23/3735 , H01L23/433 , H01L24/81 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2224/92125 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15787 , H01L2924/16195 , H01L2924/351 , H05K3/303 , H05K3/3436 , H05K3/3463 , H05K2201/094 , H05K2201/09781 , H05K2201/2036 , H05K2203/047 , Y02P70/613 , H01L2924/00
摘要： An electrically reliable heat radiating package provided with ball grid array (BGA) structure and a method of manufacturing the package are disclosed. In the concrete, a semiconductor chip is mounted on one surface of a ceramic wiring board via a first soldered bump electrode and resin is filled in a gap area between the one surface of the wiring board and the principal surface of the semiconductor chip. A heat diffusing plate formed in larger plane size than that of the semiconductor chip by aluminum nitride is arranged on the rear surface opposite to the principal surface of the semiconductor chip and soldered. Further, a radiating fin made of aluminum is provided on the heat diffusing plate and stuck via silicone rubber in which thermally conductive filler is included. Further, the above first soldered bump electrode and a second soldered bump electrode with a lower melting point than that of solder used for the above soldering are formed on the rear surface of the above ceramic wiring board and the above BGA package provided with heat radiating structure is formed. This BGA package is mounted on a glass epoxy wiring board at low temperature.
摘要翻译：公开了一种具有球栅阵列（BGA）结构的电可靠性散热封装和制造该封装的方法。具体而言，通过第一焊接突起电极和树脂将半导体芯片安装在陶瓷布线板的一个表面上填充在布线板的一个表面和半导体芯片的主表面之间的间隙区域中。在与半导体芯片的主表面相对的后表面上布置有由氮化铝形成的具有比半导体芯片更大的平面尺寸的热扩散板并焊接。此外，在散热片上设置由铝制成的散热片并通过其中包含导热填料的硅橡胶粘贴。此外，上述第一焊接凸块电极和熔点低于用于上述焊接的焊料熔点低的第二焊接凸块电极形成在形成陶瓷布线板以上的上述BGA封装，并具有散热结构。该BGA封装在低温下安装在玻璃环氧树脂布线板上。

45. 发明授权

US06339330B1 Magnetic head 失效
标题翻译：磁头
公开(公告)号：US06339330B1
公开(公告)日：2002-01-15
申请号：US09660241
申请日：2000-09-12
申请人： Toshihiko Sato , Ryoichi Nakatani , Nobuyuki Inaba
发明人： Toshihiko Sato , Ryoichi Nakatani , Nobuyuki Inaba
IPC分类号： H01L4308
CPC分类号： B82Y25/00 , B82Y10/00 , G01R33/06 , G11C11/16 , H01F10/3227 , H01F10/3254 , H01L43/08 , Y10T428/1114
摘要： A magnetic sensor is constructed to be capable of detecting the change of tunnel current due to co-tunneling effect at a high S/N ratio by using a tunneling magneto-resistive element having a first magnetic layer of a soft magnetic material formed on a flat substrate, first and second tunnel barrier layers formed on the first magnetic layer, magnetic particles of a ferromagnetic material provided between the first and second tunnel barrier layers, and a second magnetic layer of a soft magnetic material formed on the second tunnel barrier layer so as to create tunneling junctions.
摘要翻译：磁传感器被构造成能够通过使用具有形成在平面上的软磁材料的第一磁性层的隧道式磁阻元件来检测由于高S / N比下的共同隧道效应引起的隧道电流的变化形成在第一磁性层上的衬底，第一和第二隧道势垒层，设置在第一和第二隧道势垒层之间的铁磁材料的磁性颗粒和形成在第二隧道势垒层上的软磁材料的第二磁性层，创建隧道路口。

46. 发明授权

US5997958A Method of depositing nanometer scale particles 失效
标题翻译：沉积纳米尺度颗粒的方法
公开(公告)号：US5997958A
公开(公告)日：1999-12-07
申请号：US38939
申请日：1998-03-12
申请人： Toshihiko Sato , Haroon Ahmed
发明人： Toshihiko Sato , Haroon Ahmed
IPC分类号： H01L29/06 , B82B3/00 , H01L21/208 , H01L21/3205 , H01L29/66 , H01L29/80 , H01L49/00 , B05D1/32 , B05D3/10 , B05D5/12
CPC分类号： H01L49/006 , B82B3/00 , B82Y10/00 , B82Y30/00 , B82Y40/00 , H01L21/32051 , H01L51/0595 , Y10S977/89 , Y10S977/937
摘要： Nanometre scale particles (3) e.g. of Au are deposited on a Si substrate (2) with a SiO.sub.2 surface layer (1) provided with receptor sites (4) of a first electrical polarity by treatment with APTMS solution. The Au particles (3) have a surface charge (5) of a second opposite polarity e.g from surface adsorbed citrate ions, such that they are attracted to the surface sites on the substrate. The deposited Au particles are then released from the surface sites such that the particles move over the substrate and coalesce into a low dimensional aggregated structure. The aggregated structure may form at a surface irregularity on the surface of the substrate. The structure may be used in a quantum electronic device such as a single electron transistor.
摘要翻译：纳米级颗粒（3），例如的Au通过用APTMS溶液处理而沉积在具有第一电极性的受体位点（4）的SiO 2表面层（1）的Si衬底（2）上。 Au颗粒（3）具有第二相反极性的表面电荷（5），例如表面吸附的柠檬酸根离子，使得它们被吸引到衬底上的表面位置。然后将沉积的Au颗粒从表面位点释放，使得颗粒在衬底上移动并聚结成低维聚集结构。聚集的结构可以在基底表面上的表面不规则形成。该结构可以用于诸如单电子晶体管的量子电子器件中。

47. 发明授权

US5471869A Combustion state-detecting system for internal combustion engines 失效
标题翻译：内燃机燃烧状态检测系统
公开(公告)号：US5471869A
公开(公告)日：1995-12-05
申请号：US303683
申请日：1994-09-09
申请人： Shigetaka Kuroda , Toshihiko Sato , Tsuyoshi Takizawa
发明人： Shigetaka Kuroda , Toshihiko Sato , Tsuyoshi Takizawa
IPC分类号： F02D45/00 , F02B75/02 , F02P17/12 , G01M15/11 , G01M15/00
CPC分类号： G01M15/11 , F02B2075/027
摘要： A combustion state-detecting system for an internal combustion engine is provided, which detects misfires occurring in the engine. A crank angle sensor generates a crank angle signal with a predetermined period shorter than a firing period of the engine whenever the crankshaft rotates through a predetermined angle. An ECU detects the rotational speed of the engine, based on the crank angle signal whenever the crank angle signal is generated to generate a rotational speed signal, and filters the rotational speed signal to extract a specific frequency component therefrom. A rate of variation in the extracted specific frequency component is calculated every first predetermined time period, and an average value of the rate of variation is calculated every second predetermined time period longer than the first predetermined time period. Further, the difference between the average value and the rate of variation is calculated, and absolute values of the difference is cumulated over the second predetermined time period to obtain a difference cumulative value. Then, the difference cumulative value is compared with a predetermined value, and it is determined that the engine is in a continuous degraded combustion state when the difference cumulative value has continued to exceed the predetermined value, and that the engine is in a sporadic degraded combustion state when the difference cumulative value once exceeds the predetermined value once and then becomes smaller than the predetermined value, before it again exceeds the predetermined value.
摘要翻译：提供了一种用于内燃机的燃烧状态检测系统，其检测发动机中发生的失火。每当曲轴旋转预定角度时，曲柄角传感器产生具有比发动机的点火时间短的预定时间段的曲轴转角信号。只要产生曲柄角信号，ECU就基于曲柄角信号来检测发动机的转速，以产生转速信号，并且对转速信号进行滤波以从中提取特定的频率分量。在每第一预定时间段计算提取的特定频率分量的变化率，并且每隔一个预定时间段计算比第一预定时间段更长的变化率的平均值。此外，计算平均值和变化率之间的差异，并且在第二预定时间段内累积差异的绝对值以获得差值累积值。然后，将差累计值与预定值进行比较，并且当差累积值继续超过预定值并且发动机处于零星劣化燃烧时，确定发动机处于连续劣化燃烧状态当差值累积值一次超过预定值一次然后变得小于预定值时，再次超过预定值。

48. 发明授权

US5398501A Air-fuel ratio control system for internal combustion engines 失效
标题翻译：内燃机空燃比控制系统
公开(公告)号：US5398501A
公开(公告)日：1995-03-21
申请号：US137433
申请日：1993-10-15
申请人： Hiroshi Ito , Yoichi Iwata , Takizawa Tsuyoshi , Toshihiko Sato , Naoki Iida , Takayoshi Nakayama
发明人： Hiroshi Ito , Yoichi Iwata , Takizawa Tsuyoshi , Toshihiko Sato , Naoki Iida , Takayoshi Nakayama
IPC分类号： F01N3/20 , F01N11/00 , F02D41/14 , F02D41/22
CPC分类号： F02D41/1441 , F01N11/007 , F02D41/1475 , F01N2550/02 , F01N2900/0422 , Y02T10/47
摘要： An air-fuel ratio control system for an internal combustion engine having a catalytic converter arranged in the exhaust system, a first air-fuel ratio sensor arranged upstream of the catalytic converter, and a second air-fuel ratio sensor arranged downstream of the catalytic converter, calculates an air-fuel ratio control variable, based on an output from the second air-fuel ratio sensor. An air-fuel ratio correction amount is calculated based on an output from the first air-fuel ratio sensor and the air-fuel ratio control variable. The air-fuel ratio of a mixture supplied to the engine is controlled based on the air-fuel ratio correction amount. The air-fuel ratio control variable is corrected in the rich direction such that the air-fuel ratio of the mixture supplied to the engine becomes richer, when deterioration of the catalytic converter is detected.
摘要翻译：一种用于内燃机的空燃比控制系统，其具有布置在排气系统中的催化转化器，布置在催化转化器上游的第一空燃比传感器和布置在催化转化器下游的第二空燃比传感器根据来自第二空燃比传感器的输出，计算空燃比控制变量。基于第一空燃比传感器的输出和空燃比控制变量来计算空燃比校正量。基于空燃比校正量来控制供给到发动机的混合物的空燃比。当检测到催化转化器的劣化时，空燃比控制变量在富方向上被校正，使得供给发动机的混合物的空燃比变得更加丰富。

49. 发明授权

US5396766A Abnormality-detecting device for internal combustion engines 失效
标题翻译：内燃机异常检测装置
公开(公告)号：US5396766A
公开(公告)日：1995-03-14
申请号：US98798
申请日：1993-07-29
申请人： Toshihiko Sato , Yoichi Iwata , Hiroshi Ito , Tsuyoshi Takizawa , Takayoshi Nakayama
发明人： Toshihiko Sato , Yoichi Iwata , Hiroshi Ito , Tsuyoshi Takizawa , Takayoshi Nakayama
IPC分类号： F02D41/14 , F01N11/00 , F02D41/22 , F01N3/20
CPC分类号： F01N11/007 , F01N2550/02 , F01N2900/0422 , Y02T10/47
摘要： An abnormality-detecting device is provided for an internal combustion engine having first and second oxygen sensors arranged in the exhaust system at locations upstream and downstream of a catalytic converter. An ECU detects the degree of deterioration of the catalytic converter, based on an output from the second oxygen sensor, and sets a reference value for determining an abnormality in the engine, based on the detected degree of deterioration of the catalytic converter. The ECU compares between the set reference value and a value based on an output from the first oxygen sensor, and determines the abnormality in the engine, based on the result of the comparison. Upon detection of the abnormality, an LED is actuated to issue an alarm.
摘要翻译：在内燃机中设置异常检测装置，该内燃机具有在催化转化器的上游和下游位置排列在排气系统中的第一和第二氧传感器。 ECU根据第二氧传感器的输出，检测催化转化器的劣化程度，根据检测到的催化转化器的劣化，设定用于判定发动机异常的基准值。 ECU根据比较结果，比较设定基准值和基于第一氧传感器的输出的值，并确定发动机的异常。一旦发现异常，LED被启动发出报警。

50. 发明授权

US4589184A Method and apparatus for mounting parts to both sides of a main body such as an automobile body 失效
标题翻译：将部件安装在诸如汽车车身的主体的两侧的方法和装置
公开(公告)号：US4589184A
公开(公告)日：1986-05-20
申请号：US730340
申请日：1985-05-03
申请人： Kajio Asano , Toshihiko Sato , Haruo Oda , Yasuaki Abe , Yoshitaka Watanabe
发明人： Kajio Asano , Toshihiko Sato , Haruo Oda , Yasuaki Abe , Yoshitaka Watanabe
IPC分类号： B25J9/00 , B60J5/04 , B62D65/06 , B23P11/00 , B23P19/00 , B23Q15/00 , B65G43/10
CPC分类号： B62D65/06 , B25J9/0093 , Y10S29/044 , Y10T29/49829 , Y10T29/49831 , Y10T29/49998 , Y10T29/5191 , Y10T29/5196 , Y10T29/53052 , Y10T29/53061 , Y10T29/534 , Y10T29/53435 , Y10T29/53548
摘要： A method of mounting parts to both sides of a main body characterized by moving a carriage at a predetermined speed along a specified path of transport with the main body placed on the carriage; moving a pair of movable tables in synchronism with the carriage in the same direction as the movement thereof, the movable tables being disposed at opposite sides of the transport path and each carrying at least one robot and an assembling device; causing the movable tables to support the main body during the synchronized movement; setting a part held by the robot in a specified position on the main body; attaching the part to the main body by the assembling device; and thereafter delivering the main body from the movable tables onto the carriage. Since the carriage is moved during the assembly of parts, this method assures the assembly line of a high-speed operation.
摘要翻译：一种将部件安装在主体的两侧的方法，其特征在于，沿主体放置在滑架上的特定运输路径以预定速度移动滑架; 与支架沿与其运动方向相同的方向同步移动一对活动台，活动台设置在运输路径的相对两侧，每个承载至少一个机器人和组装装置; 使得活动台在同步移动期间支撑主体; 将机器人保持在主体上的指定位置; 通过组装装置将部件附接到主体; 然后将主体从活动台传送到滑架上。由于在部件组装过程中移动滑架，所以这种方法确保了高速运转的装配线。

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