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41. 发明授权

US06194683B1 Snap together PCMCIA cards with laser tack welded seams 失效
标题翻译：使用激光焊缝焊接在一起的PCMCIA卡
公开(公告)号：US06194683B1
公开(公告)日：2001-02-27
申请号：US09484783
申请日：2000-01-18
申请人： Wilton Louis Cox , Charles David Fieselman , Leonard Douglas Hobgood , Paul Gilbert Watson, Jr. , Simon Yu
发明人： Wilton Louis Cox , Charles David Fieselman , Leonard Douglas Hobgood , Paul Gilbert Watson, Jr. , Simon Yu
IPC分类号： B23K2600
CPC分类号： H05K5/0269 , B23K26/10 , B23K26/12 , B23K26/123 , B23K26/127 , B23K26/24 , B23K26/244
摘要： The top and bottom parts of a one-piece cover of a PCMCIA card are snapped together to form lap-joint seams which are welded together with a laser, under argon gas. Only a few small tack welds are required to substantially increases the mechanical strength and moisture resistance and to eliminate the risk of accidentally opening the card. The operation can be done at a high rate with minimal cost. Also, an internal frame may be made much narrower to allow more card area, while still meeting structural requirements for PCMCIA cards. The weld penetrates fully through the first layer of the seam and only partially through a second layer. During welding a fixture holds the seams in reasonably precise position and tightly closed so the seams are much tighter after welding than when the card is only snap closed. The precise positioning of the seams also allows the size of the weld to be minimized which reduces the risk of burn through which may damage electronic components enclosed within the card during welding. The card is plugged into an externally accessible slot in a computer system during operation.
摘要翻译： PCMCIA卡的单件盖的顶部和底部部分被卡在一起以形成在氩气下用激光焊接在一起的搭接接缝。只需要几个小的定位焊缝才能大大增加机械强度和防潮性，并消除卡片意外打开的风险。可以以最低的成本高速率进行操作。此外，内部框架可能会变得更窄，以允许更多的卡片区域，同时仍然满足PCMCIA卡的结构要求。焊缝完全穿过接缝的第一层，仅部分穿过第二层。在焊接过程中，夹具将接缝保持在相当精确的位置并紧密封闭，因此焊接后的接缝比卡片刚刚闭合时更紧密。接缝的精确定位还可以使焊缝的尺寸最小化，从而降低烧毁的风险，通过这种风险可能会损坏封装在卡内的电子部件。操作期间，该卡插入计算机系统中的外部可访问的插槽。

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