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41. 发明授权

US09074113B2 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device 有权
标题翻译：用于倒装芯片型半导体背表面的薄膜，用于半导体背表面的切割带集成薄膜，用于制造半导体器件的工艺和倒装芯片型半导体器件
公开(公告)号：US09074113B2
公开(公告)日：2015-07-07
申请号：US13184994
申请日：2011-07-18
申请人： Naohide Takamoto , Goji Shiga , Fumiteru Asai
发明人： Naohide Takamoto , Goji Shiga , Fumiteru Asai
IPC分类号： H01L23/48 , C09J163/00
CPC分类号： C09J163/00 , H01L2224/16225 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.
摘要翻译：本发明涉及一种用于倒装芯片型半导体背表面的薄膜，该薄膜形成在与被粘物相连的半导体元件倒装芯片的背面上，所述薄膜半导体背面的薄膜包含无机填料的量基于用于倒装芯片型半导体背表面的整个膜的70重量％至95重量％的范围。

42. 发明授权

US08704382B2 Film for flip chip type semiconductor back surface 有权
标题翻译：倒装芯片型半导体背面薄膜
公开(公告)号：US08704382B2
公开(公告)日：2014-04-22
申请号：US12975893
申请日：2010-12-22
申请人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
发明人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L21/6836 , H01L21/561 , H01L23/3164 , H01L23/544 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/73204 , H01L2224/8101 , H01L2224/81193 , H01L2224/81203 , H01L2224/814 , H01L2224/831 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01079 , H01L2924/3025 , Y10T428/28 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm.
摘要翻译：本发明提供了一种用于倒装芯片型半导体背表面的薄膜，其将形成在连接在被粘物上的半导体元件倒装芯片的背面上，该薄膜包括晶片粘合层和激光标记层，其中晶片粘合层的波长为532nm的光的透光率为40％以上，激光标记层的波长为532nm的光的透光率为40％以下。

43. 发明授权

US08703584B2 Dicing tape-integrated film for semiconductor back surface 有权
标题翻译：用于半导体背面的切割胶带一体化膜
公开(公告)号：US08703584B2
公开(公告)日：2014-04-22
申请号：US12789878
申请日：2010-05-28
申请人： Sadahito Misumi , Naohide Takamoto
发明人： Sadahito Misumi , Naohide Takamoto
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , Y10T428/2848 , H01L2224/0401
摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a multilayered structure including a wafer adhesion layer and a laser mark layer, the wafer adhesion layer is formed of a resin composition containing a thermosetting resin component and, as an optional component, a thermoplastic resin component in an amount of less than 30% by weight relative to the whole amount of resin components, and the laser mark layer is formed of a resin composition containing a thermoplastic resin component in an amount of 30% by weight or more relative to the whole amount of resin components and, as an optional component, a thermosetting resin component.
摘要翻译：本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及设置在压敏粘合剂层上的倒装芯片型半导体背表面的薄膜，其中倒装芯片型半导体背表面膜具有包括晶片粘合层和激光标记层的多层结构，晶片粘附层为由含有热固性树脂组分的树脂组合物和相对于树脂组分的总量小于30重量％的热塑性树脂组分作为任选组分形成，激光标记层由树脂形成含有相对于树脂成分的总量为30重量％以上的热塑性树脂成分的组合物，作为任意成分的热硬化性树脂成分。

44. 发明授权

US08692389B2 Dicing tape-integrated film for semiconductor back surface 有权
标题翻译：用于半导体背面的切割胶带一体化膜
公开(公告)号：US08692389B2
公开(公告)日：2014-04-08
申请号：US12976112
申请日：2010-12-22
申请人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
发明人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/562 , H01L21/6836 , H01L21/78 , H01L23/3164 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/81 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16221 , H01L2224/274 , H01L2224/73204 , H01L2224/81007 , H01L2224/81097 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/831 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/3025 , Y10T428/1476 , Y10T428/28 , H01L2924/01082 , H01L2924/01047 , H01L2924/0103 , H01L2924/01083 , H01L2924/00014 , H01L2924/014 , H01L2924/3512 , H01L2924/00
摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.
摘要翻译：本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及设置在压敏粘合剂层上的倒装芯片型半导体背面的膜，其中压敏粘合剂层之间的剥离力（温度：23℃，剥离角度：180°，拉伸速度：300mm / min）切割带的粘合剂层和倒装芯片型半导体背面的膜的厚度为0.05N / 20mm至1.5N / 20mm。

45. 发明授权

US08652938B2 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device 有权
标题翻译：用于半导体背面的可热分解的片状集成膜，半导体元件的集成方法以及半导体器件的制造方法
公开(公告)号：US08652938B2
公开(公告)日：2014-02-18
申请号：US13190664
申请日：2011-07-26
申请人： Naohide Takamoto , Goji Shiga , Fumiteru Asai
发明人： Naohide Takamoto , Goji Shiga , Fumiteru Asai
IPC分类号： H01L21/00
CPC分类号： C09J5/06 , C09J7/22 , C09J7/29 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2205/102 , C09J2205/11 , C09J2205/302 , H01L21/563 , H01L21/6836 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68327 , H01L2221/68381 , H01L2223/54433 , H01L2223/54486 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16238 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81911 , H01L2224/83104 , H01L2924/10253 , Y10T428/25 , Y10T428/31504 , H01L2924/00014 , H01L2924/01082 , H01L2924/0103 , H01L2924/01083 , H01L2924/00012 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要： The present invention relates to a thermally releasable sheet-integrated film for semiconductor back surface, which includes: a pressure-sensitive adhesive sheet including a base material layer and a pressure-sensitive adhesive layer, and a film for semiconductor back surface formed on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive sheet is a thermally releasable pressure-sensitive adhesive sheet whose peel force from the film for semiconductor back surface decreases upon heating.
摘要翻译：本发明涉及一种用于半导体背表面的可热分解的片状集成膜，其包括：包含基材层和压敏粘合剂层的压敏粘合片，以及在压力下形成的半导体背面的膜粘合片的粘合片的粘合剂层，其中粘合片是其半导体背面的膜的剥离力在加热时降低的可热剥离的压敏粘合片。

46. 发明授权

US08415201B2 Dicing tape-integrated film for semiconductor back surface 有权
标题翻译：用于半导体背面的切割胶带一体化膜
公开(公告)号：US08415201B2
公开(公告)日：2013-04-09
申请号：US12814743
申请日：2010-06-14
申请人： Miki Hayashi , Naohide Takamoto
发明人： Miki Hayashi , Naohide Takamoto
IPC分类号： H01L21/00
CPC分类号： H01L21/6836 , H01L21/67132 , H01L24/16 , H01L24/27 , H01L2221/68327 , H01L2221/68377 , H01L2224/16 , H01L2224/274 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , Y10T428/2495 , Y10T428/31511 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a storage elastic modulus (at 60° C.) of from 0.9 MPa to 15 MPa.
摘要翻译：本发明提供了一种半导体背面用切割带一体化膜，其特征在于，包括：切割带，其包括基材和设置在基材上的粘合剂层; 以及用于倒装芯片型半导体背面的膜具有0.9MPa〜15MPa的储能弹性模量（60℃）的压敏粘合剂层上设置的倒装芯片型半导体背面用膜。

47. 发明授权

US08404522B2 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device 有权
标题翻译：用于半导体背面的切割带集成膜，以及用于制造半导体器件的工艺
公开(公告)号：US08404522B2
公开(公告)日：2013-03-26
申请号：US13172945
申请日：2011-06-30
申请人： Goji Shiga , Naohide Takamoto , Fumiteru Asai
发明人： Goji Shiga , Naohide Takamoto , Fumiteru Asai
IPC分类号： H01L21/00
CPC分类号： H01L21/6836 , H01L21/561 , H01L23/3114 , H01L23/3164 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2221/68327 , H01L2221/68377 , H01L2221/68386 , H01L2223/54433 , H01L2223/54473 , H01L2224/13099 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/73204 , H01L2224/81815 , H01L2224/8191 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , Y10T428/24959 , Y10T428/265 , H01L2924/00014 , H01L2924/01083 , H01L2924/00
摘要： The present invention relates to a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer laminated in this order, and a film for semiconductor back surface provided on the pressure-sensitive adhesive layer of the dicing tape, where the pressure-sensitive adhesive layer has a thickness of from 20 μm to 40 μm.
摘要翻译：本发明涉及一种半导体背面用切割带一体化膜，其特征在于，具有：依次层叠有基材和粘合剂层的切割带和设置在所述压敏粘合剂上的半导体背面用膜切割胶带的层，其中压敏粘合剂层的厚度为20μm至40μm。

48. 发明申请

US20120261839A1 DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM 有权
标题翻译：贴面复合防水背面保护膜
公开(公告)号：US20120261839A1
公开(公告)日：2012-10-18
申请号：US13534269
申请日：2012-06-27
申请人： Naohide TAKAMOTO , Takeshi MATSUMURA
发明人： Naohide TAKAMOTO , Takeshi MATSUMURA
IPC分类号： H01L21/78 , C09J7/02 , H01L23/58
CPC分类号： H01L21/6836 , H01L23/544 , H01L23/562 , H01L24/81 , H01L2221/68327 , H01L2223/5448 , H01L2224/16 , H01L2224/27436 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , Y10T428/1467 , Y10T428/28 , Y10T428/2848 , Y10T428/31511 , H01L2924/00 , H01L2224/0401
摘要： The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
摘要翻译：本发明提供一种切片带集成晶片背面保护膜，其包括：切割带，其包括基材和形成在基材上的压敏粘合剂层; 以及形成在切割带的压敏粘合剂层上的晶片背面保护膜，其中晶片背面保护膜着色。彩色晶片背面保护膜最好具有激光打标能力。切割带集成的晶片背面保护膜可以适用于倒装芯片安装的半导体器件。

49. 发明申请

US20120208009A1 FILM FOR FORMING PROTECTIVE LAYER 审中-公开
标题翻译：形成保护层的电影
公开(公告)号：US20120208009A1
公开(公告)日：2012-08-16
申请号：US13396532
申请日：2012-02-14
申请人： Takashi Oda , Naohide Takamoto , Takeshi Matsumura
发明人： Takashi Oda , Naohide Takamoto , Takeshi Matsumura
IPC分类号： B32B3/00 , B32B27/38
CPC分类号： C09D171/08 , H01L21/78 , H01L23/3114 , H01L23/3164 , H01L23/562 , H01L2924/0002 , Y10T428/265 , Y10T428/31511 , H01L2924/00
摘要： The present invention aims to provide a film for forming a protective layer that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer while suppressing an increase in the number of steps in the manufacture of a semiconductor device. This object is achieved by a film for forming a protective layer on a bumped wafer in which a low dielectric material layer is formed, including a support base, an adhesive layer, and a thermosetting resin layer, laminated in this order, wherein the melt viscosity of the thermosetting resin layer is 1×102 Pa·S or more and 2×104 Pa·S or less, and the shear modulus of the adhesive layer is 1×103 Pa or more and 2×106 Pa or less, when the thermosetting resin layer has a temperature in a range of 50 to 120° C.
摘要翻译：本发明的目的在于提供一种形成保护层的膜，其能够防止半导体晶片的低电介质材料层中的裂纹，同时抑制半导体器件的制造中的步骤数量的增加。该目的通过在其上形成低介电材料层的凸起晶片上形成保护层的膜来实现，该薄膜包括依次层叠的支撑基底，粘合层和热固性树脂层，其中熔体粘度的热固性树脂层的摩尔比为1×102Pa·S以上且2×104Pa·S以下，粘合剂层的剪切模量为1×10 3 Pa以上2×10 6 Pa以下时，树脂层的温度为50〜120℃。

50. 发明授权

US08237294B2 Dicing tape-integrated wafer back surface protective film 有权
标题翻译：切割胶带集成晶圆背面保护膜
公开(公告)号：US08237294B2
公开(公告)日：2012-08-07
申请号：US12696135
申请日：2010-01-29
申请人： Naohide Takamoto , Takeshi Matsumura
发明人： Naohide Takamoto , Takeshi Matsumura
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/6836 , H01L23/544 , H01L23/562 , H01L24/81 , H01L2221/68327 , H01L2223/5448 , H01L2224/16 , H01L2224/27436 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , Y10T428/1467 , Y10T428/28 , Y10T428/2848 , Y10T428/31511 , H01L2924/00 , H01L2224/0401
摘要： The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.
摘要翻译：本发明提供一种切片带集成晶片背面保护膜，其包括：切割带，其包括基材和形成在基材上的压敏粘合剂层; 以及形成在切割带的压敏粘合剂层上的晶片背面保护膜，其中晶片背面保护膜着色。彩色晶片背面保护膜最好具有激光打标能力。切割带集成的晶片背面保护膜可以适用于倒装芯片安装的半导体器件。

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