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    • 42. 发明申请
    • Printed Circuit Board and Method of Manufacturing the Same
    • 印刷电路板及其制造方法
    • US20130062106A1
    • 2013-03-14
    • US13512748
    • 2010-11-26
    • Jin Su KimDuk Nam KimJae Hyun AhnSang Myung LeeYeong Uk SeoChi Hee AhnSung Woon YoonMyoung Hwa Nam
    • Jin Su KimDuk Nam KimJae Hyun AhnSang Myung LeeYeong Uk SeoChi Hee AhnSung Woon YoonMyoung Hwa Nam
    • H05K3/10H05K1/09H05K1/11
    • H05K3/4658H05K3/205H05K3/4007H05K3/4647H05K2203/0108Y10T29/49155
    • A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer. In addition, a conductive structure in the form of a connecting bump is formed, and thus a complicated process of forming a via-hole and filling the via-hole with a conductive material is not required. Furthermore, a process of grinding the surface of the filled conductive material is removed so as to remarkably decrease a circuit error rate.
    • 提供一种印刷电路板的结构及其制造方法。 该制造方法包括:在第一电路图案上形成至少一个连接凸块并形成第一绝缘层以形成内部电路板的第一步骤;使用模具处理其上形成有金属晶种层的第二绝缘层的第二步骤 以形成第二电路图案以构成外部电路板,以及将内部电路板和外部电路板彼此对准并层压内部电路板和外部电路板的第三步骤。 因此,可以提供具有嵌入在绝缘层中的电路的高密度高可靠性印刷电路板的结构。 可以通过使用与种子层结合的绝缘层来去除用于形成最外层电路的籽晶层形成工艺。 此外,形成连接凸块形式的导电结构,因此不需要形成通孔并且用导电材料填充通孔的复杂工艺。 此外,去除了填充的导电材料的表面的研磨过程,以显着降低电路错误率。