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41. 发明申请

US20080046766A1 Computer system performance estimator and layout configurator 失效
标题翻译：计算机系统性能估计器和布局配置器
公开(公告)号：US20080046766A1
公开(公告)日：2008-02-21
申请号：US11506876
申请日：2006-08-21
申请人： Trieu C. Chieu , Hoi Y. Chan , Vinod Kamath , Lawrence S. Mok
发明人： Trieu C. Chieu , Hoi Y. Chan , Vinod Kamath , Lawrence S. Mok
IPC分类号： G06F1/00
CPC分类号： G06F1/206 , H05K7/20836
摘要： A method, system and computer readable medium for maximizing the performance of a computer system that includes at least one computing unit. Temperature and location data for each computing unit is received by a server unit and the location of each computing unit within a given environment is reevaluated and revised to maximize the overall performance of the computer system.
摘要翻译：一种用于使包括至少一个计算单元的计算机系统的性能最大化的方法，系统和计算机可读介质。每个计算单元的温度和位置数据由服务器单元接收，并且重新评估和修改给定环境内的每个计算单元的位置以使计算机系统的整体性能最大化。

42. 发明授权

US06867967B2 Method of constructing a multicomputer system 失效
标题翻译：构建多计算机系统的方法
公开(公告)号：US06867967B2
公开(公告)日：2005-03-15
申请号：US10320181
申请日：2002-12-16
申请人： Lawrence S. Mok
发明人： Lawrence S. Mok
IPC分类号： G06F1/16 , G06F1/20 , H05K7/20
CPC分类号： H05K7/20727 , G06F1/16 , G06F1/20 , H01L2224/48091 , H01L2224/49111 , H01L2924/00014
摘要： A method of constructing a multicomputer system consisting of a multiplicity of multiple computing units connected together in multiple dimensions. Furthermore, also disclosed is a novel method and arrangement for constructing a computer system constituted of multiple computing units, and wherein air ducting and plenum arrangement direct cooling air flows through the computer system so as to dissipate heat generated by the multiplicity of electronic components of the computer system.
摘要翻译：一种构建由多个连接在一起的多个计算单元组成的多计算机系统的方法。此外，还公开了一种用于构建由多个计算单元构成的计算机系统的新颖的方法和装置，并且其中空气管道和集气室布置的直接冷却空气流过计算机系统，以便散发由多个计算单元的多个电子部件产生的热量电脑系统。

43. 发明授权

US06778393B2 Cooling device with multiple compliant elements 失效
标题翻译：具有多个兼容元件的冷却装置
公开(公告)号：US06778393B2
公开(公告)日：2004-08-17
申请号：US10308225
申请日：2002-12-02
申请人： Gaetano P. Messina , Lawrence S. Mok , Tsorng-Dih Yuan
发明人： Gaetano P. Messina , Lawrence S. Mok , Tsorng-Dih Yuan
IPC分类号： H05K720
CPC分类号： H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A cooling device having a common cooling distribution unit with multiple compliant cooling elements. Mechanisms are built in to ensure the cooling elements are in good thermal contact with heat generating semiconductor chips of different heights and sizes on a common carrier. The cooling distribution unit has protection structures to prevent the leakage of coolant from the unit. Further reduction of the risk of accidental coolant leakage is provided with the onboard storage of coolant absorbent materials in the coolant distribution unit. The cooling elements have serpentine coolant channels to enhanced the cooling capacity. The compliance of the cooling elements can also be achieved by using concentric tubing to connect the coolant distribution unit to cooling heads on the cooling elements.
摘要翻译：一种冷却装置，具有具有多个顺应冷却元件的公共冷却分配单元。内置机构以确保冷却元件与公共载体上不同高度和大小的发热半导体芯片良好的热接触。冷却分配单元具有防止冷却液从单元泄漏的保护结构。通过冷却剂吸收材料在冷却剂分配单元中的机载存储来提供意外冷却剂泄漏的风险的进一步降低。冷却元件具有蛇形冷却剂通道，以增强冷却能力。冷却元件的顺应性也可以通过使用同心管将冷却剂分配单元连接到冷却元件上的冷却头来实现。

44. 发明授权

US06592449B2 Smart fan modules and system 失效
公开(公告)号：US06592449B2
公开(公告)日：2003-07-15
申请号：US10083270
申请日：2002-02-25
申请人： Thomas M. Cipolla , Richard I. Kaufman , Lawrence S. Mok
发明人： Thomas M. Cipolla , Richard I. Kaufman , Lawrence S. Mok
IPC分类号： F24F700
CPC分类号： H05K7/20836 , F24F11/77 , G06F9/52 , G06F9/526 , G06F15/17381 , G06F17/142 , G09G5/008 , H04L7/0338
摘要： A fan module including: two or more individual fans, each fan having an air movement means and a motor engaged with the air movement means for accelerating air entering each of the two or more individual fans; a temperature sensor for sensing a temperature associated with the two or more fans and for outputting a first signal corresponding to the temperature; rotational speed sensor for outputting a second signal corresponding to a rotational speed of each of the two or more fans; and a processor for receiving the first and second signals and controlling the two or more individual fans based on the first and second signals.

45. 发明授权

US4939570A High power, pluggable tape automated bonding package 失效
标题翻译：大功率，可插拔胶带自动粘接包装
公开(公告)号：US4939570A
公开(公告)日：1990-07-03
申请号：US223580
申请日：1988-07-25
申请人： Harry R. Bickford , Lawrence S. Mok , Michael J. Palmer
发明人： Harry R. Bickford , Lawrence S. Mok , Michael J. Palmer
IPC分类号： H01L23/34 , H01L21/60 , H01L23/13 , H01L23/367 , H01L23/495 , H01L23/498
CPC分类号： H01L24/50 , H01L23/13 , H01L23/367 , H01L23/49572 , H01L23/49833 , H01L2224/73253 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1532
摘要： A TAB package is described which includes a flexible dielectric film with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads, which leads extend into the aperture and connect to a semiconductor chip. Thermally conductive body means is provided which has a well formed therein, the well defined by a lip comprising the outer rim of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means and the flexible dielectric film is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.

46. 发明授权

US08059400B2 Cooling of substrate using interposer channels 有权
标题翻译：使用插入器通道冷却衬底
公开(公告)号：US08059400B2
公开(公告)日：2011-11-15
申请号：US12233104
申请日：2008-09-18
申请人： Minhua Lu , Lawrence S. Mok
发明人： Minhua Lu , Lawrence S. Mok
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/433 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49204 , H01L2924/00 , H01L2224/0401
摘要： A method of forming a structure. An interposer is provided. The interposer is adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink.
摘要翻译：一种形成结构的方法。提供了插入器。插入件适于插入在热源和散热器之间并将热量从热源传递到散热器。插入器包括封闭空腔的外壳。外壳由导热材料制成。空腔包括导热泡沫材料。泡沫材料包括孔，并且包括至少一个蛇形通道。每个蛇形通道具有至少两个连续连接的通道段。每个蛇形通道独立地形成闭环或开放端环。泡沫材料适于被填充孔的液体浸泡。每个蛇形通道适于部分地填充有用于将热量从热源传递到散热器的流体。

47. 发明授权

US07888603B2 Cooling of substrate using interposer channels 有权
标题翻译：使用插入器通道冷却衬底
公开(公告)号：US07888603B2
公开(公告)日：2011-02-15
申请号：US12212925
申请日：2008-09-18
申请人： Minhua Lu , Lawrence S. Mok
发明人： Minhua Lu , Lawrence S. Mok
IPC分类号： H05K1/00
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/433 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49204 , H01L2924/00 , H01L2224/0401
摘要： A structure. The structure includes a substrate and an interposer. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). The interposer includes N continuous interposer channels coupled to the N substrate channels to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.
摘要翻译：一个结构。该结构包括基板和插入件。衬底在衬底的第一侧上包括热源和N个连续衬底通道（N≥2）。插入器包括耦合到N个衬底通道的N个连续插入器通道，以形成M个连续环路（1＆amp; NlE; M＆amp; N; N）。每个回路以交替顺序独立地由K个衬底通道和K个插入器通道组成。对于每个循环，K至少为1，并且受到与由N个插入物通道和N个底物通道组成的M个回路的约束一致的上限。每个循环是独立开放的或封闭的。衬底的第一面连接到插入器。插入器适于热耦合到散热器，使得插入器插入在基板和散热器之间。

48. 发明授权

US07836314B2 Computer system performance estimator and layout configurator 失效
标题翻译：计算机系统性能估计器和布局配置器
公开(公告)号：US07836314B2
公开(公告)日：2010-11-16
申请号：US11506876
申请日：2006-08-21
申请人： Trieu C. Chieu , Hoi Y. Chan , Vinod Kamath , Lawrence S. Mok
发明人： Trieu C. Chieu , Hoi Y. Chan , Vinod Kamath , Lawrence S. Mok
IPC分类号： G06F1/00
CPC分类号： G06F1/206 , H05K7/20836
摘要： A method, system and computer readable medium for maximizing the performance of a computer system that includes at least one computing unit. Temperature and location data for each computing unit is received by a server unit and the location of each computing unit within a given environment is reevaluated and revised to maximize the overall performance of the computer system.
摘要翻译：一种用于使包括至少一个计算单元的计算机系统的性能最大化的方法，系统和计算机可读介质。每个计算单元的温度和位置数据由服务器单元接收，并且重新评估和修改给定环境内的每个计算单元的位置以使计算机系统的整体性能最大化。

49. 发明申请

US20090184264A1 LASER ANNEALING FOR 3-D CHIP INTEGRATION 有权
标题翻译：激光退火三维芯片整合
公开(公告)号：US20090184264A1
公开(公告)日：2009-07-23
申请号：US12018756
申请日：2008-01-23
申请人： Howard H. Chen , Louis C. Hsu , Lawrence S. Mok , J. Campbell Scott
发明人： Howard H. Chen , Louis C. Hsu , Lawrence S. Mok , J. Campbell Scott
IPC分类号： H01L21/268
CPC分类号： H01L21/324 , H01L21/268 , H01L24/01 , H01L25/0657 , H01L27/0688 , H01L2225/06513 , H01L2225/06541 , H01L2924/14 , H01L2924/00
摘要： A laser annealing method for annealing a stacked semiconductor structure having at least two stacked layers is disclosed. A laser beam is focused on a lower layer of the stacked layers. The laser beam is then scanned to anneal features in the lower layer. The laser beam is then focused on an upper layer of the stacked layers, and the laser beam is scanned to anneal features in the upper layer. The laser has a wavelength of less than one micrometer. The beam size, depth of focus, energy dosage, and scan speed of the laser beam are programmable. Features in the lower layer are offset from features in the upper layer such that these features do not overlap along a plane parallel to a path of the laser beam. Each of the stacked layers includes active devices, such as transistors. Also, the first and second layers may be annealed simultaneously.
摘要翻译：公开了一种用于退火具有至少两个堆叠层的层叠半导体结构的激光退火方法。激光束聚焦在堆叠层的下层。然后扫描激光束以退火下层中的特征。然后将激光束聚焦在堆叠层的上层上，并且激光束被扫描以退火上层中的特征。激光器的波长小于1微米。激光束的光束尺寸，焦深，能量投射和扫描速度是可编程的。较低层中的特征偏离上层中的特征，使得这些特征不沿着与激光束的路径平行的平面重叠。堆叠层中的每一个包括诸如晶体管的有源器件。此外，第一层和第二层可以同时退火。

50. 发明申请

US20090008130A1 COOLING OF SUBSTRATE USING INTERPOSER CHANNELS 有权
标题翻译：使用插入式通道冷却基板
公开(公告)号：US20090008130A1
公开(公告)日：2009-01-08
申请号：US12233061
申请日：2008-09-18
申请人： Minhua Lu , Lawrence S. Mok
发明人： Minhua Lu , Lawrence S. Mok
IPC分类号： H05K1/00
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/433 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49204 , H01L2924/00 , H01L2224/0401
摘要： A structure. The structure includes an interposer adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink.
摘要翻译：一个结构。该结构包括适于插入在热源和散热器之间并将热量从热源传递到散热器的插入件。插入器包括封闭空腔的外壳。外壳由导热材料制成。空腔包括导热泡沫材料。泡沫材料包括孔，并且包括至少一个蛇形通道。每个蛇形通道具有至少两个连续连接的通道段。每个蛇形通道独立地形成闭环或开放端环。泡沫材料适于被填充孔的液体浸泡。每个蛇形通道适于部分地填充有用于将热量从热源传递到散热器的流体。

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